{"id":5080,"date":"2022-07-13T12:00:53","date_gmt":"2022-07-13T16:00:53","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=5080"},"modified":"2026-03-26T15:08:44","modified_gmt":"2026-03-26T19:08:44","slug":"3d-ic-podcast-integration-challenges","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/3d-ic\/3d-ic-podcast-integration-challenges\/","title":{"rendered":"3D IC Integration Challenges \u2013 ep. 6"},"content":{"rendered":"\n<p><\/p>\n\n\n<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm\/?e=TLFIE3561920999\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<p><br>A common challenge when actualizing new technologies such as 3D IC is the lack of specialized tools to mass assemble them. That\u2019s because their designs are normally developed by R&amp;D teams that view commercialization as someone else\u2019s task. At the moment, organizations are working to create and perfect the tools need to assemble 3D IC chips.<\/p>\n\n\n\n<p>Today,&nbsp;John McMillan interviews John Ferguson, Director of Product Management, Dusan Petranovic, Principal Technologist, and Steve McKinney, Account Technology Manager. They\u2019ll help us understand what a 3D IC verification workflow might look like.<\/p>\n\n\n\n<p>In this episode, you\u2019ll learn about the challenges associated with 3D IC integration and the components required to make it possible. You\u2019ll also learn about the upgrades that must be made to make 3D IC assembly possible. Additionally, you\u2019ll hear about parasitic extraction and the tools available to execute it.<\/p>\n\n\n\n<p><strong>What You Will Learn In This Episode:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Challenges faced in the manufacture of 3D IC chips (02:01)<\/li>\n\n\n\n<li>How to ensure that a 3D IC assembly line is aligned (04:18)<\/li>\n\n\n\n<li>The challenges of integrating 3D IC (10:55)<\/li>\n\n\n\n<li>The tools needed to make 3D IC integration possible (13:56)<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"block-1101083c-7ace-4d30-b299-5a1ef8949e39\"><strong>Our Experts:<\/strong><\/h3>\n\n\n\n<h3 class=\"wp-block-heading\" id=\"block-1101083c-7ace-4d30-b299-5a1ef8949e39\">Dusan Petranovic<\/h3>\n\n\n\n<p>Principal Technologist, Siemens Digital Industries Software<br><a href=\"https:\/\/www.linkedin.com\/in\/dusan-petranovic-5339294\/\" target=\"_blank\" rel=\"noreferrer noopener\">Connect with Dusan on LinkedIn<\/a><\/p>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/07\/john-ferguson3.jpg\" alt=\"John Ferguson\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">John Ferguson<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Director of Product Management at Siemens Digital Industries Software<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/john-ferguson-b236453\/\" target=\"_blank\" rel=\"noopener\">Connect with John on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/07\/steve-mckinney2.jpg\" alt=\"Steve McKinney\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Steve McKinney<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>SI\/PI\/EM Analysis &amp; Verification Technologist, Siemens Digital Industries Software<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/smckinne\/\" target=\"_blank\" rel=\"noopener\">Connect with Steve on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/07\/john-mcmillian-190px.jpg\" alt=\"John McMillan\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">John McMillan<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Industry Analyst, Marketing and Technical Relationship Management Professional, Siemens Digital Industries Software<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/johnmcmillan\/\" target=\"_blank\" rel=\"noopener\">Connect with John on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>A common challenge when actualizing new technologies such as 3D IC is the lack of specialized tools to mass assemble&#8230;<\/p>\n","protected":false},"author":29361,"featured_media":5082,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[465],"tags":[486,377,472,605,604,603,373,299,385],"industry":[],"product":[],"coauthors":[417],"class_list":["post-5080","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-3d-ic","tag-3d","tag-3d-cad","tag-3d-ic","tag-3d-ic-chips","tag-3d-ic-verification","tag-chips","tag-digital-transformation-tag","tag-digitalization","tag-podcast"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/07\/3D-IC-06.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/5080","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/29361"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=5080"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/5080\/revisions"}],"predecessor-version":[{"id":8849,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/5080\/revisions\/8849"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/5082"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=5080"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=5080"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=5080"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=5080"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=5080"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=5080"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}