{"id":4491,"date":"2022-04-14T18:32:26","date_gmt":"2022-04-14T22:32:26","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=4491"},"modified":"2026-03-26T15:08:46","modified_gmt":"2026-03-26T19:08:46","slug":"3d-ic-physical-design-workflow-5","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/3d-ic\/3d-ic-physical-design-workflow-5\/","title":{"rendered":"3D IC Physical Design Workflow &#8211; ep. 5"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm\/?e=TLFIE5348345772\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<div class=\"row podcast-social\">\n    <div class=\"col-12 col-sm-2\"><p>Follow us on:<\/p><\/div>\n    <div class=\"col\">\n        <a class=\"button apple-podcast\" target=\"_blank\" href=\"https:\/\/podcasts.apple.com\/us\/podcast\/3d-ic\/id1612354543\" rel=\"noopener noreferrer\">Apple<\/a>\n        <a class=\"button spotify-podcast\" target=\"_blank\" href=\"https:\/\/open.spotify.com\/show\/1Y2MxqzeYfb9yRoTUx4iGQ\" rel=\"noopener noreferrer\">Spotify<\/a>\n        <a class=\"button stitcher-podcast\" target=\"_blank\" href=\"https:\/\/www.stitcher.com\/podcast\/siemens\/3d-ic\" rel=\"noopener noreferrer\">Stitcher<\/a>\n        <a class=\"button amazon-podcast\" target=\"_blank\" href=\"https:\/\/music.amazon.com\/podcasts\/5e846524-0c7a-4af6-9f67-78f2c3f6156c\/3d-ic?ref=dm_sh_wFDJUzba14OudePJpmKt3tA5x\" rel=\"noopener noreferrer\">Amazon<\/a>\n        <a class=\"button rss-podcast\" target=\"_blank\" href=\"https:\/\/feeds.acast.com\/public\/shows\/61e19255414de60014cbfabf\" rel=\"noopener noreferrer\">RSS<\/a>\n    <\/div><\/div>\n\n\n\n<p>One of the challenges of designing 3D IC chips is getting data from different sources in various formats to work together. You also need a solution that allows you to verify different components such as the interposer, the package and the die together. Siemens solution allows you to combine data from distinct sources and handle the verification process collectively.<\/p>\n\n\n\n<p>Today,&nbsp; John McMillan interviews Mike Walsh, Technical Applications Engineering Director of the Technical Solutions Sales Team at Siemens Digital EDA. He\u2019ll help us understand what a 3D IC physical design workflow might look like.<\/p>\n\n\n\n<p>In this episode, you\u2019ll learn about the challenges associated with 3D IC physical design. You\u2019ll also gain insight about how a Siemens solution enables design teams to use data received in diverse formats. Additionally, you\u2019ll understand why it&#8217;s important to keep verification in mind early on in the design process.<\/p>\n\n\n\n<p><strong>What You Will Learn in this Episode:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The challenges faced in the 3D IC physical design phase (01:33)<\/li>\n\n\n\n<li>The importance of a design solution that can deal with multiple data formats (03:39)<\/li>\n\n\n\n<li>How Siemens helps organizations combine data from different sources in different formats (07:55)<\/li>\n\n\n\n<li>The different aspects of 3D IC design flow (12:06)<\/li>\n<\/ul>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/04\/Walsh_Mike_2.jpg\" alt=\"Mike Walsh\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Mike Walsh<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Technical Applications Engineering Director of the Technical Solutions Sales Team at Siemens Digital EDA<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/mpwalsh8\/\" target=\"_blank\" rel=\"noopener\">Connect with Mike on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/02\/McMillan-228x228-1.jpg\" alt=\"John McMillan\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">John McMillan<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Technical Marketing Engineering Manager at Siemens EDA<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/johnmcmillan\" target=\"_blank\" rel=\"noopener\">Connect with John on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Follow us on: Apple Spotify Stitcher Amazon RSS One of the challenges of designing 3D IC chips is getting data&#8230;<\/p>\n","protected":false},"author":29361,"featured_media":6938,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[465],"tags":[321,373,299,495,385,330],"industry":[],"product":[],"coauthors":[417],"class_list":["post-4491","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-3d-ic","tag-design-innovation","tag-digital-transformation-tag","tag-digitalization","tag-physical-design-workflow","tag-podcast","tag-xcelerator"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/04\/3D-IC05a.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/4491","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/29361"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=4491"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/4491\/revisions"}],"predecessor-version":[{"id":8851,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/4491\/revisions\/8851"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/6938"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=4491"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=4491"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=4491"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=4491"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=4491"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=4491"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}