{"id":3886,"date":"2022-01-26T08:00:00","date_gmt":"2022-01-26T13:00:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=3886"},"modified":"2026-03-26T15:03:57","modified_gmt":"2026-03-26T19:03:57","slug":"an-introduction-to-3d-ic-ep-1","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/3d-ic\/an-introduction-to-3d-ic-ep-1\/","title":{"rendered":"An introduction to 3D IC \u2013 ep. 1"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm\/?e=TLFIE3452368798\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<div class=\"row podcast-social\">\n    <div class=\"col-12 col-sm-2\"><p>Follow us on:<\/p><\/div>\n    <div class=\"col\">\n        <a class=\"button apple-podcast\" target=\"_blank\" href=\"https:\/\/podcasts.apple.com\/us\/podcast\/3d-ic\/id1612354543\" rel=\"noopener noreferrer\">Apple<\/a>\n        <a class=\"button spotify-podcast\" target=\"_blank\" href=\"https:\/\/open.spotify.com\/show\/1Y2MxqzeYfb9yRoTUx4iGQ\" rel=\"noopener noreferrer\">Spotify<\/a>\n        <a class=\"button stitcher-podcast\" target=\"_blank\" href=\"https:\/\/www.stitcher.com\/podcast\/siemens\/3d-ic\" rel=\"noopener noreferrer\">Stitcher<\/a>\n        <a class=\"button amazon-podcast\" target=\"_blank\" href=\"https:\/\/music.amazon.com\/podcasts\/5e846524-0c7a-4af6-9f67-78f2c3f6156c\/3d-ic?ref=dm_sh_wFDJUzba14OudePJpmKt3tA5x\" rel=\"noopener noreferrer\">Amazon<\/a>\n        <a class=\"button rss-podcast\" target=\"_blank\" href=\"https:\/\/feeds.acast.com\/public\/shows\/61e19255414de60014cbfabf\" rel=\"noopener noreferrer\">RSS<\/a>\n    <\/div><\/div>\n\n\n\n<p>Electronic circuits design has become more complex due to the consumers\u2019 need for more features that require more processing capability. To keep up with these demands, new methodologies of designing and connecting chips have been developed. The latest innovation in this area is the three-dimensional integrated circuits (3D IC), which take less space and deliver much higher performance compared to traditional monolithic technologies.<\/p>\n\n\n\n<p>In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He has been in the semiconductor industry for over 30 years, primarily in the design of custom integrated circuits. He\u2019ll help us understand the 3D IC technology and the impact it\u2019s expected to have.<\/p>\n\n\n\n<p>You will learn about the current chip standards in the industry and where they fall short. You\u2019ll also learn how 3D IC works and how it will help in solving most of the challenges facing today\u2019s chips. Additionally, you\u2019ll hear about the challenges that come with 3D IC and how some of them are being resolved.<\/p>\n\n\n\n<p><strong>This episode includes the following topics:<\/strong><\/p>\n\n\n\n<p>The problem that 3D IC solves (01:49)<\/p>\n\n\n\n<p>How 3D IC works and why it gives tremendous performance (06:37)<\/p>\n\n\n\n<p>The difference between 3D IC and other technologies (10:22)<\/p>\n\n\n\n<p>The challenges in moving to 3D IC (15:56)<\/p>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/01\/Tony_photo.jpg\" alt=\"Anthony Mastroianni, Advanced Packaging Solutions Director, Siemens EDA segment, Siemens  Digital Industries Software\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Anthony Mastroianni, Advanced Packaging Solutions Director, Siemens EDA segment, Siemens  Digital Industries Software<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Tony Mastroianni has more than 30 years of experience as an engineer and engineering manager in the global semiconductor industry. In recent years, he has focused significantly on advanced ASIC package design flow development (2.5\/3D). He currently leads development of Advanced Packaging Solutions for Siemens Digital Industries Software. Prior to joining Siemens, he served in engineering leadership positions at Inphi and eSilicon. He earned a bachelor\u2019s degree in electrical engineering from Lehigh University and a masters in electrical engineering at Rutgers University.<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/tony-mastroianni\/\" target=\"_blank\" rel=\"noopener\">Connect with Tony Mastroianni on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"\" alt=\"\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\"><\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n                    <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"\" target=\"_blank\"><\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/01\/McMillan-228x228-1.jpg\" alt=\"John McMillan, Technical Marketing Engineering Manager at Siemens EDA\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">John McMillan, Technical Marketing Engineering Manager at Siemens EDA<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>John has over 35 years of a seasoned Principle PCB Engineer and held key positions within the EDA industry ranging from Applications Engineering, Technical management, and R&amp;D.<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/johnmcmillan\/\" target=\"_blank\" rel=\"noopener\">Connect with John on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Follow us on: Apple Spotify Stitcher Amazon RSS Electronic circuits design has become more complex due to the consumers\u2019 need&#8230;<\/p>\n","protected":false},"author":29361,"featured_media":3998,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[465],"tags":[377,371,315,298,299,349,383,402,352,385,311,330],"industry":[],"product":[],"coauthors":[417],"class_list":["post-3886","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-3d-ic","tag-3d-cad","tag-digital-future","tag-digital-thread","tag-digital-twin","tag-digitalization","tag-electrical-systems","tag-electrification","tag-engineer-innovation","tag-industry-4-0","tag-podcast","tag-simulation","tag-xcelerator"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/01\/3D-IC.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/3886","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/29361"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=3886"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/3886\/revisions"}],"predecessor-version":[{"id":6363,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/3886\/revisions\/6363"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/3998"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=3886"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=3886"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=3886"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=3886"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=3886"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=3886"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}