{"id":12829,"date":"2025-12-16T08:00:00","date_gmt":"2025-12-16T13:00:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=12829"},"modified":"2026-03-26T15:20:21","modified_gmt":"2026-03-26T19:20:21","slug":"futurecast-2026-part-2-specialization-power-and-intelligent-verification","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/bugged-out\/futurecast-2026-part-2-specialization-power-and-intelligent-verification\/","title":{"rendered":"FutureCast 2026 \u2014 Part 2: Specialization, power, and intelligent verification"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm?e=TLFIE3050944067\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<h2 class=\"wp-block-heading\">Holiday special edition of Bugged Out<\/h2>\n\n\n\n<p>In Part 2 of the special FutureCast 2026 holiday series, Harry Foster continues exploring how the semiconductor landscape is rapidly changing \u2014 and why the next phase of innovation will be shaped as much by constraints as by breakthroughs.<\/p>\n\n\n\n<p>This episode examines the forces pushing systems toward specialization, the growing challenge of data movement, and the rising impact of power, security, and runtime behavior on system correctness. Harry also discusses how verification teams can scale as complexity expands and why agentic AI will become essential to automation and workflow orchestration.<\/p>\n\n\n\n<p>Key Discussion Points:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Why specialization becomes unavoidable as AI, robotics, and domain-specific compute accelerate<\/li>\n\n\n\n<li>The growing impact of data movement bottlenecks and memory-centric architectures<\/li>\n\n\n\n<li>How HBM, near-memory compute, analog accelerators, and photonics break legacy abstractions<\/li>\n\n\n\n<li>Why physical effects such as thermals and statistical variation now influence functional correctness<\/li>\n\n\n\n<li>How verification evolves across cross-domain workflows without overwhelming engineering teams<\/li>\n\n\n\n<li>The role of hybrid digital twins in unifying logic, performance, physical behavior, and verification intent<\/li>\n\n\n\n<li>Why power ceilings, security boundaries, and model drift become architectural concerns<\/li>\n\n\n\n<li>How runtime safety, isolation, and lifecycle monitoring reshape verification planning<\/li>\n\n\n\n<li>Why agentic AI shifts from tool enhancement to workflow orchestration and continuous validation<\/li>\n\n\n\n<li>Predictions for 2026: AI-assisted verification becomes standard, and data movement emerges as a verification challenge<\/li>\n\n\n\n<li>Predictions for 2030: thermal- and statistical-aware verification become standard practice, and agentic AI drives verification infrastructure while curated chiplet marketplaces begin to form<\/li>\n<\/ul>\n\n\n\n<p>To dive deeper into these themes, you can also download the companion white paper\u00a0<a href=\"https:\/\/resources.sw.siemens.com\/en-US\/white-paper-the-future-of-semiconductors-engineering-in-the-convergence-era\/\" target=\"_blank\" rel=\"noreferrer noopener\">https:\/\/resources.sw.siemens.com\/en-US\/white-paper-the-future-of-semiconductors-engineering-in-the-convergence-era\/<\/a><\/p>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2025\/11\/harry173.jpg\" alt=\"Harry Foster\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Harry Foster<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Chief Scientist Verification, Siemens EDA<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/harry-foster-19a41a\/\" target=\"_blank\" rel=\"noopener\">Connect with Harry on LinkedIn <\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>In Part 2 of the special FutureCast 2026 holiday series, Harry Foster continues exploring how the semiconductor landscape is rapidly changing \u2014 and why the next phase of innovation will be shaped as much by constraints as by breakthroughs.<\/p>\n","protected":false},"author":86290,"featured_media":12830,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1095],"tags":[1110,353,1111,1112,1107],"industry":[],"product":[196],"coauthors":[752],"class_list":["post-12829","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-bugged-out","tag-agentic-ai","tag-ai","tag-ai-assisted-verification","tag-formal-verification","tag-hbm","product-questa"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2025\/12\/Bugged_Out_podcast_1280x720_ep4.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12829","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/86290"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=12829"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12829\/revisions"}],"predecessor-version":[{"id":12831,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12829\/revisions\/12831"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/12830"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=12829"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=12829"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=12829"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=12829"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=12829"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=12829"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}