{"id":12495,"date":"2025-08-14T10:35:58","date_gmt":"2025-08-14T14:35:58","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=12495"},"modified":"2026-03-26T15:18:27","modified_gmt":"2026-03-26T19:18:27","slug":"secure-remote-and-collaborative-the-future-of-pcb-design","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/printed-circuit\/secure-remote-and-collaborative-the-future-of-pcb-design\/","title":{"rendered":"Secure, remote, and collaborative: The future of PCB design"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm?e=TLFIE4892546924\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<p>How do you enable seamless PCB design collaboration for globally distributed teams without sacrificing security or IP control?<\/p>\n\n\n\n<p><strong>What you\u2019ll learn\u2026<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>How cloud connectivity supports asynchronous design reviews across time zones<\/li>\n\n\n\n<li>Why web-based 2D\/3D visualization is a game changer for non-EDA stakeholders<\/li>\n\n\n\n<li>How BOM integration and real-time supply chain data reduce redesign risk<\/li>\n\n\n\n<li>Best practices for balancing accessibility with security in PCB design<\/li>\n\n\n\n<li>The role of AI in future PCB collaboration and design review workflows<\/li>\n<\/ul>\n\n\n\n<p><strong>Where you\u2019ll find it\u2026<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>(01:00)<strong> <\/strong>How has cloud connectivity transformed PCB design collaboration in recent years?<\/li>\n\n\n\n<li>(02:20) How web-based 2D 3D visualization works in practice?<\/li>\n\n\n\n<li>(03:30) What specific features enable remote design reviews to be as effective as in-person reviews?<\/li>\n\n\n\n<li>(05:35) How does the bill of materials factor into the design review process?<\/li>\n\n\n\n<li>(07:00) How do you balance accessibility with security in cloud-connected design?<\/li>\n\n\n\n<li>(08:25) What measures are in place to protect intellectual property during collaboration?<\/li>\n\n\n\n<li>(10:25) Layers of access control in secure cloud environments\u00a0<\/li>\n\n\n\n<li>(16:00) The future of cloud-connected PCB design and AI\u2019s role\u00a0<\/li>\n<\/ul>\n\n\n\n<p><strong>More about the episode\u2026<\/strong><\/p>\n\n\n\n<p>In this episode of the Printed Circuit Podcast, host Steph Chavez speaks with Paul Welch, Product Manager at Siemens EDA, about how secure, cloud-connected solutions are transforming PCB design collaboration.<\/p>\n\n\n\n<p>Paul explains how centralized, cloud-based environments enable asynchronous design reviews, bringing together global teams while maintaining full traceability of feedback and design changes. He dives into the advantages of web-based 2D and 3D visualization for stakeholders without direct EDA tool access, and how integrating BOM insights with live supply chain data helps avoid late-stage redesigns.<\/p>\n\n\n\n<p>The conversation also covers Siemens secure-by-design approach, the multiple layers of access control that protect intellectual property, and where AI will fit into future PCB workflows, from prioritizing design review feedback to streamlining issue management.<\/p>\n\n\n\n<p>Ideal for PCB designers, electrical engineers, design managers, supply chain teams, and anyone involved in collaborative, multi-location PCB projects.<\/p>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2025\/08\/paul.jpg\" alt=\"Paul Welch\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Paul Welch<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Product Manager, Siemens<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/paul-k-welch\/\" target=\"_blank\" rel=\"noopener\">Connect with Paul on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/11\/steph_chavez300-small.jpg\" alt=\"Stephen V. Chavez\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Stephen V. Chavez<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Senior Product Marketing Manager, Siemens<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/stephen-v-chavez-59985012\/\" target=\"_blank\" rel=\"noopener\">Connect with Steph on LinkedIn <\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>How do you enable seamless PCB design collaboration for globally distributed teams without sacrificing security or IP control? What you\u2019ll&#8230;<\/p>\n","protected":false},"author":86290,"featured_media":12497,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[751],"tags":[467,773,1010,756,1081],"industry":[],"product":[283],"coauthors":[752],"class_list":["post-12495","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-printed-circuit","tag-cloud","tag-cloud-security","tag-pcb","tag-pcb-design","tag-secure-collaboration","product-xpedition-enterprise"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2025\/08\/Podcasts_2025_1280x720_4.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12495","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/86290"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=12495"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12495\/revisions"}],"predecessor-version":[{"id":12498,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12495\/revisions\/12498"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/12497"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=12495"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=12495"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=12495"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=12495"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=12495"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=12495"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}