{"id":12476,"date":"2025-08-07T16:52:43","date_gmt":"2025-08-07T20:52:43","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=12476"},"modified":"2026-03-26T15:18:25","modified_gmt":"2026-03-26T19:18:25","slug":"why-si-pi-is-mission-critical-for-3d-ic-success","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/3d-ic\/why-si-pi-is-mission-critical-for-3d-ic-success\/","title":{"rendered":"Why SI\/PI is Mission-Critical for 3D IC Success"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm?e=TLFIE4069533234\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<p>How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises?<\/p>\n\n\n\n<p>In this episode of the Siemens 3D IC Podcast, host John McMillan sits down with John Caka, Principal SI\/PI Engineer at Siemens EDA, to explore why signal and power integrity (SI\/PI) analysis is more vital than ever in 3D IC workflows\u2014and why progressive verification is key to managing complexity at every stage of design.<\/p>\n\n\n\n<p>Together, they unpack the evolving demands of SI\/PI in 3D IC architecture, from early planning to vendor-specific IP verification. You&#8217;ll learn how multidisciplinary teams\u2014spanning layout, thermal, mechanical, electrical, and packaging\u2014must align in parallel to make next-gen designs successful.<\/p>\n\n\n\n<p>This episode also shares behind-the-scenes insight into Siemens\u2019 recent collaboration with Chipletz, highlighting the EDA tool flexibility and scalability needed for today\u2019s massive pin-count designs.<\/p>\n\n\n\n<p>Ideal for SI\/PI engineers, 3D IC architects, packaging teams, die designers, layout specialists, and system-level verification professionals.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">What you\u2019ll learn<\/h2>\n\n\n\n<p>What SI\/PI means and why it\u2019s essential for 3D IC reliability<br>How 3D design shifts traditional SI\/PI workflows and stakeholder roles<br>What progressive verification looks like in practice\u2014from architectural feasibility to detailed modeling<br>How new standards like UCIe and AIB add flexibility\u2014and ambiguity\u2014to the design process<br>The real-world challenges Siemens overcame with Chipletz, a smart substrate startup<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Where you\u2019ll find it:<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>What is SI\/PI and why does it matter in 3D IC? (1:40)<\/li>\n\n\n\n<li>How does the SI\/PI flow differ from traditional monolithic designs? (3:20)<\/li>\n\n\n\n<li>What is progressive verification, and how does it help? (5:55)<\/li>\n\n\n\n<li>Who are the key stakeholders\u2014and why is collaboration essential? (9:20)<\/li>\n\n\n\n<li>The story behind Siemens\u2019 partnership with Chipletz (11:35)<\/li>\n\n\n\n<li>Final thoughts on the future of 3D IC and SI\/PI\u2019s role (14:05)<\/li>\n<\/ul>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2025\/08\/JohnCaka_headshot.jpeg\" alt=\"John Caka\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">John Caka<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p><b><span data-olk-copy-source=\"MessageBody\">John Caka<\/span><\/b>\u00a0is a Signal Integrity Applications Engineer with over a decade of experience in high-speed digital design, modeling, and simulation. He earned his B.S. in Electrical Engineering from the University of Utah in 2013 and an MBA from the Quantic School of Business and Technology in 2024.<\/p>\n<p>John began his career at Micron Technology, where he was part of the Signal Integrity team from 2013 to 2018. His work focused on the design and analysis of DDR4, DDR5, and LPDDR4 memory packages and systems, with an emphasis on optimizing signal quality across complex interconnects.<\/p>\n<p>Since 2018, John has served as a Signal Integrity Applications Engineer at Siemens Digital Industries (formerly Mentor Graphics). In this role, he supports customers worldwide in solving advanced SI\/PI challenges, with deep expertise in simulation methodologies, EM field solvers, and high-speed interface technologies.<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/john-caka-912627118\/\" target=\"_blank\" rel=\"noopener\">LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage&#8230;<\/p>\n","protected":false},"author":69244,"featured_media":12493,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[465],"tags":[472,891,1080,890],"industry":[40,43],"product":[],"coauthors":[1052],"class_list":["post-12476","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-3d-ic","tag-3d-ic","tag-power-integrity","tag-progressive-verification","tag-signal-integrity","industry-electronics-semiconductors","industry-semiconductor-devices"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2025\/08\/3DIC-Podcast_1280x720_ep_7.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12476","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/69244"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=12476"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12476\/revisions"}],"predecessor-version":[{"id":12485,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/12476\/revisions\/12485"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/12493"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=12476"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=12476"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=12476"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=12476"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=12476"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=12476"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}