{"id":11658,"date":"2024-12-13T13:54:48","date_gmt":"2024-12-13T18:54:48","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=11658"},"modified":"2026-03-26T15:16:32","modified_gmt":"2026-03-26T19:16:32","slug":"how-ai-is-optimizing-the-ic-test-process-part-2","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/ai-spectrum\/how-ai-is-optimizing-the-ic-test-process-part-2\/","title":{"rendered":"How AI is optimizing the IC test process \u2013 Part 2"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe loading=\"lazy\" frameborder=\"0\" height=\"200\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm?e=TLFIE9912365236\" width=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<p>Microchips are getting smaller, denser and more complex with each passing year not only incurring increased costs, but greater manufacturing challenges as well. To help drive the continued advancement of semiconductor technology, the design and testing of these new chips must be ready to accommodate AI and ML from the ground up.<\/p>\n\n\n\n<p>In this podcast, host Spencer Acain is joined by Ron Press, Senior Director of Technology Enablement at Siemens Digital Industries, looks to the future of AI and ML in the chip design and verification process. Ron explores the needs for cutting edge technology in a field as complex as IC production, as well as the challenges of adopting that same technology into a multi-billion-dollar industry.<\/p>\n\n\n\n<p><strong>In this episode you will learn:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>What is analytical AI? (0:37)<\/li>\n\n\n\n<li>Challenges of bringing AI into IC design and test (4:48)<\/li>\n\n\n\n<li>The need for cutting edge technology in leading processes (6:36)<\/li>\n<\/ul>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2024\/11\/1726986224090.jpg\" alt=\"Ron Press\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Ron Press<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Senior Director of Technology Enablement at Siemens Digital Industries Software<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/ron-press-b8bb462\/\" target=\"_blank\" rel=\"noopener\">Connect with Ron on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/06\/spencer-acain.jpg\" alt=\"Spencer Acain\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Spencer Acain<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Technical Writer for Global Marketing at Siemens Digital Industries Software<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/spencer-acain-a4267b125\/\" target=\"_blank\" rel=\"noopener\">Connect with Spencer on LinkedIn<\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Microchips are getting smaller, denser and more complex with each passing year not only incurring increased costs, but greater manufacturing&#8230;<\/p>\n","protected":false},"author":82958,"featured_media":11660,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[374],"tags":[353,373,298,299,385],"industry":[],"product":[],"coauthors":[499],"class_list":["post-11658","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-ai-spectrum","tag-ai","tag-digital-transformation-tag","tag-digital-twin","tag-digitalization","tag-podcast"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2024\/12\/EDA-CPU-brand-evolution-2023-2_original.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/11658","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/82958"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=11658"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/11658\/revisions"}],"predecessor-version":[{"id":11661,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/11658\/revisions\/11661"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/11660"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=11658"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=11658"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=11658"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=11658"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=11658"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=11658"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}