{"id":11114,"date":"2024-07-29T11:13:21","date_gmt":"2024-07-29T15:13:21","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=11114"},"modified":"2026-03-26T15:14:17","modified_gmt":"2026-03-26T19:14:17","slug":"3d-incites-podcast-siemens-aj-incorvaia-explains-the-evolution-of-eda-tools-for-advanced-packaging-and-3d-ics","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/3d-ic\/3d-incites-podcast-siemens-aj-incorvaia-explains-the-evolution-of-eda-tools-for-advanced-packaging-and-3d-ics\/","title":{"rendered":"3D InCites Podcast \u2013 Siemens&#8217; AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs"},"content":{"rendered":"\n<p>As part of our 3D IC podcast series, Siemens&#8217; AJ Incorvaia, Sr. VP, Electronic Board Systems, EDA, sat down with Fran\u00e7oise von Trapp in a recent 3D InCites podcast to discuss the evolution of EDA tools for advanced packaging and 3D ICs including our newest software, Innovator3D IC.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/www.buzzsprout.com\/1731672\/15359000\" target=\"_blank\" rel=\"noopener\"><strong>Listen to the 3D InCites podcast<\/strong><\/a><\/div>\n<\/div>\n\n\n\n<p>Follow us on  <a href=\"https:\/\/podcasts.apple.com\/us\/podcast\/3d-ic\/id1612354543\" target=\"_blank\" rel=\"noreferrer noopener\">Apple<\/a>\u00a0  <a href=\"https:\/\/open.spotify.com\/show\/1Y2MxqzeYfb9yRoTUx4iGQ\" target=\"_blank\" rel=\"noreferrer noopener\">Spotify<\/a>\u00a0 \u00a0<a href=\"https:\/\/music.amazon.com\/podcasts\/5e846524-0c7a-4af6-9f67-78f2c3f6156c\/3d-ic?ref=dm_sh_wFDJUzba14OudePJpmKt3tA5x\" target=\"_blank\" rel=\"noreferrer noopener\">Amazon<\/a>   <a href=\"https:\/\/feeds.acast.com\/public\/shows\/61e19255414de60014cbfabf\" target=\"_blank\" rel=\"noreferrer noopener\">RSS<\/a><\/p>\n\n\n\n<p>Listen in as they discuss the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlight the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.<\/p>\n\n\n\n<p>You&#8217;ll learn about:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking<\/li>\n\n\n\n<li>3D IC design tools and their evolution<\/li>\n\n\n\n<li>Digital twins, chiplet architectures, and 3D integration processes in semiconductor design<\/li>\n\n\n\n<li>Innovator 3D IC &#8211; a new product &#8221; for faster, more predictable chip design<\/li>\n\n\n\n<li>Siemens&#8217; new 3D IC design platform for concurrent design and optimization.<\/li>\n\n\n\n<li>How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.<\/li>\n<\/ul>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p><strong><em>Now, with the movement to 2.5D and 3D designs, particularly with stacked die and interposers, it&#8217;s a whole new world, and there&#8217;s a whole new set of technologies that need to come online<\/em><\/strong>&#8220;<\/p>\n<cite><em>AJ Incorvaia, Sr. VP, Electronic Board Systems, EDA, Siemens<\/em><\/cite><\/blockquote>\n\n\n\n<p>You&#8217;ll get some back-story on the evolution of chiplets and the importance of standardizing chiplet models and workflows for the chiplet ecosystem. You&#8217;ll also learn how Siemens&#8217; new 3D IC design platform fits into their current 3D IC packaging technologies and workflows with enhanced capabilities, including an enhanced AI-infused user experience that accelerates 3D IC design.<\/p>\n\n\n\n<p><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic-packaging\/innovator3d-ic\/\" target=\"_blank\" rel=\"noreferrer noopener\">Learn more about Innovator 3D IC<\/a><\/p>\n\n\n\n<p>To learn more about how Siemens 3D IC heterogeneous semiconductor packaging solutions catapult design teams into the future of IC design visit our&nbsp;<a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic-packaging\/3d-ic-design\/\" target=\"_blank\" rel=\"noreferrer noopener\">3D IC Homepage<\/a><\/p>\n\n\n\n<p>To learn about our semiconductor packaging design and verification solutions&nbsp;<a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic-packaging\/?pk_vid=5944cf5c11dc57cd011ca49d37fbc75d17211355264df5be\" target=\"_blank\" rel=\"noreferrer noopener\">Click here<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Siemens&#8217; AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs<\/p>\n","protected":false},"author":71824,"featured_media":11117,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[465],"tags":[472,968,385,764],"industry":[40],"product":[],"coauthors":[967],"class_list":["post-11114","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-3d-ic","tag-3d-ic","tag-innovator-3d-ic","tag-podcast","tag-semiconductors","industry-electronics-semiconductors"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2024\/07\/LG-Siemens-Catapult-1200x630-1.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/11114","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/71824"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=11114"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/11114\/revisions"}],"predecessor-version":[{"id":11122,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/11114\/revisions\/11122"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/11117"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=11114"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=11114"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=11114"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=11114"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=11114"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=11114"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}