{"id":10613,"date":"2024-05-07T08:20:28","date_gmt":"2024-05-07T12:20:28","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=10613"},"modified":"2026-03-26T15:13:29","modified_gmt":"2026-03-26T19:13:29","slug":"power-integrity-and-efficient-pdn-design","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/printed-circuit\/power-integrity-and-efficient-pdn-design\/","title":{"rendered":"Power integrity and efficient PDN design"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe frameBorder=\"0\" height=\"482\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm\/?e=TLFIE2903649904\"\nwidth=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<p>From voltage droops that threaten system stability to electromagnetic interference that disrupts signal integrity, engineers face countless obstacles in their quest for optimal Power Distribution Network (PDN)\u00a0 performance.\u00a0<\/p>\n\n\n\n<p>I\u2019m your host, Steph Chavez, today, we&#8217;re diving into power integrity and designing Power Distribution Networks (PDNs) with our guest, Daniel Beeker. From his transformative journey under industry giants like Richard Hartley and Ralph Morrison to his current role as a technical director at NXP, Daniel is on a mission to empower engineers with insights into energy management and PDN design.<\/p>\n\n\n\n<p>In this episode, you will learn about the foundational importance of power distribution in electronic design and uncover common challenges and pitfalls encountered in PDN design. You will also gain valuable insights into practical strategies for ensuring stable and efficient power delivery.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">What you\u2019ll learn in this episode:<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Power integrity and its impact on electronic systems. (5:15)<\/li>\n\n\n\n<li>Traditional power supply design approaches and their limitations. (11:13)<\/li>\n\n\n\n<li>PCB layout fundamentals and the &#8220;billion dollar mistake.&#8221;&nbsp; (16:58)<\/li>\n\n\n\n<li>Engineering education, PCB design, and EMC requirements. (28:18)<\/li>\n\n\n\n<li>Challenges in designing small transistors for faster performance. (32:38)<\/li>\n\n\n\n<li>Designing electronic circuits using triplets for efficient signal transmission. (37:38)<\/li>\n<\/ul>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2024\/05\/Beeker-173.jpg\" alt=\"Daniel Beeker\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Daniel Beeker<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Technical Director at NXP Semiconductors<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/danielbeeker\/\" target=\"_blank\" rel=\"noopener\">Connect with Dan on LinkedIn <\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/11\/steph_chavez300-small.jpg\" alt=\"Stephen V. Chavez\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Stephen V. Chavez<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Principal Technical Product Marketing Manager<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/stephen-v-chavez-59985012\/\" target=\"_blank\" rel=\"noopener\">Connect with Steph on LinkedIn <\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>From voltage droops that threaten system stability to electromagnetic interference that disrupts signal integrity, engineers face countless obstacles in their&#8230;<\/p>\n","protected":false},"author":86822,"featured_media":10619,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[751],"tags":[756,765,947,891],"industry":[],"product":[122,283],"coauthors":[937],"class_list":["post-10613","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-printed-circuit","tag-pcb-design","tag-pcb-design-best-practices","tag-pdn","tag-power-integrity","product-hyperlynx-si-pi-thermal","product-xpedition-enterprise"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2024\/05\/Power_efficiency_1280x720.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/10613","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/86822"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=10613"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/10613\/revisions"}],"predecessor-version":[{"id":10616,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/10613\/revisions\/10616"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/10619"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=10613"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=10613"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=10613"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=10613"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=10613"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=10613"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}