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Semiconductor Packaging
The evolution of machine learning (ML) in the physical design and verification of semiconductor packages
August 14, 2024
Discover how Siemens' EDA evolution of machine learning in the physical design and verification of semiconductor packages.
By John McMillan
2
MIN READ
NX Design
NX | Tips and Tricks | Delete Curves
August 14, 2024
Delete Curve is a useful tool that can help boost your productivity while sketching in NX™ software. The video covers...
By Michael Hobson
3
MIN READ
Siemens Software Podcast Network
Ep 7 - A Modular Approach to Defense Aircraft with Tristan Crawford Part 1
August 14, 2024
Welcome to the Industry Forward Podcast with Dale Tutt! Join Dale Tutt, Vice President of Industry Strategy at Siemens Digital...
By Conor Peick
< 1
MIN READ
Siemens Software Podcast Network
Redefining industrial machinery with generative AI
August 13, 2024
In this Digital Transformation podcast episode, Rahul Garg, VP Industrial Machinery, and Noam Ribon, Technical Product Manager at Siemens Digital...
By Bianca Ward
< 1
MIN READ
Electronics & Semiconductors
Shorten NPI time-to-market or zero-defect chips: do you have to choose?
August 13, 2024
Semiconductor customers seem to need it all – new products, fast delivery and zero defects. As we shared previously, fragmented...
By Katie Tormala
2
MIN READ
Verification Horizons
Advanced analytics for accelerating RDC verification closure
August 13, 2024
Complex reset mechanisms are embedded in advanced SoCs to meet low-power and high-performance requirements. Multiple reset domains in a design...
By Reetika
2
MIN READ
Zel X
How to create a request for quote (RFQ) in Zel X
August 12, 2024
Why are RFQs important? With every business scanning the market for the best vendor for services, Zel X allows manufacturers...
By Kyzmen Wood
3
MIN READ
Thought Leadership
Glocal and Sustainable Battery Production
August 12, 2024
Battery production is a highly global industry. It has been highly localized for the manufacturing processes, but the supply chains...
By Nick Finberg
3
MIN READ
Semiconductor Packaging
User2User 2024: EMIB based advanced packaging flow – Intel Foundry
August 12, 2024
Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.
By John McMillan
3
MIN READ
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Latest podcast episodes
Printed Circuit Podcast
Breaking barriers: how two women are redefining PCB design through ECAD/MCAD collaboration
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Can seamless ECAD/MCAD collaboration revolutionize your PCB designs? How can women in engineering shape this bright future and lead the...
By Stephen V. Chavez
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AI Spectrum
Going beyond automation with the Industrial Copilot - Part 1
September 19, 2024
Chatbots and digital assistants aren’t anything new, but their abilities and perceived intelligence were often extremely limited, giving them no...
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Digital Transformation Podcast
Reskilling and adapting: Finding success amidst a changing workforce - Ep. 2
September 19, 2024
In this podcast, Rahul Garg, VP of industrial Machinery at Siemens Digital Industries Software and Dora Smith, Senior director of...
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