New 3D IC Podcast Launch

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

3D IC takes a village but must start with a netlist

In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…

Stoneridge: Addressing Digital Transformation with Xpedition Enterprise

Stoneridge’s global engineering team wanted to standardize their electronic systems engineering platform and evaluated enterprise ECAD systems to meet this…

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…

What’s New in HyperLynx® – VX.2.8

Check out what’s new in the latest VX.2.8 release of HyperLynx – the industry’s complete family of analysis tools for…

Mentor Communities Have a New Home!

Mentor communities are now fully integrated with the Siemens Digital Industries Software communities. This integrated PCB Systems Design community experience…

PADS Professional VX.2.8 is Now Available!

The new release of PADS Professional VX.2.8 is now available for download.

And the Winner of the 2020 PADS Professional Student Design Competition is…

There’s snow in the forecast, so summer is officially over. The same is true for the inaugural PADS Professional Student…

Xpedition® VX.2.8 is now available for download!

Before you read on, a newer version of Xpedition is now available. To learn more, visit the VX.2.12 product highlights…