{"id":634,"date":"2012-07-18T15:27:40","date_gmt":"2012-07-18T22:27:40","guid":{"rendered":"https:\/\/blogs.plm.automation.siemens.com\/t5\/Siemens-PLM-Corporate-Blog\/NX-CAE-Tips-amp-Tricks-Temperature-Mapping\/ba-p\/334956"},"modified":"2026-03-26T11:01:19","modified_gmt":"2026-03-26T15:01:19","slug":"nx-cae-tips-tricks-temperature-mapping","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/news\/nx-cae-tips-tricks-temperature-mapping\/","title":{"rendered":"NX CAE Tips &#038; Tricks &#8211; Temperature Mapping"},"content":{"rendered":"<p><P>Simulating real world systems or applications often requires an analyst to address multiple physical phenomena, simultaneously.&nbsp; This is sometimes referred to as multiphysics or multidiscipline simulation.&nbsp; Simply put, it is the science that emerges from the recognition that physical phenomena do not act in isolation, but rather in conjunction with one another.<BR \/><BR \/>Thermal-structural effects are a typical example of multiphysics, where heat transfer through a medium affects its structural behavior differently than if heat transfer were absent.&nbsp; Take an automotive exhaust manifold for instance, where heat propagates throughout the structure due to contact with exhaust gases.&nbsp; The heat flux creates a unique temperature profile on the manifold, which then affects its structural behavior by causing the metal to expand differently across the geometry.<BR \/><BR \/><!--more-->Mapping can be an effective and computationally efficient technique for conducting multiphysics analysis.&nbsp; Results from one physics solution are &#8216;mapped&#8217; onto the model of another physics solution.&nbsp; In our example above, this would involve imposing the temperature profile from a heat transfer simulation onto a structural analysis model.&nbsp; This allows the analyst to understand the structural behavior of the manifold, while accounting for its dependency on thermal effects.<BR \/><BR \/>The following video illustrates the mapping of temperature results from a thermal solution to a structural analysis model in NX CAE.&nbsp; The process is seamless, despite the two geometries having meshes that are quite distinct.&nbsp; Note how the mapping procedure is a numerical solution, with the solver computing the equivalent temperature map for the structural analysis model based on the map in the thermal analysis model.&nbsp; This ensures that the temperature information is transferred with a high degree of accuracy.&nbsp; Another feature I like is the option to automatically create a Nastran solution complete with the mapped temperature profile &#8211; a little luxury that can go a long way when you have lots of cases to evaluate.&nbsp; Click on the video to commence playback.<BR \/><BR \/><IFRAME width=\"425\" height=\"355\" src=\"https:\/\/www.youtube.com\/v\/AoEN7GdWKwI\"><\/IFRAME><BR \/><BR \/>Temperature Mapping<BR \/><BR \/>So there you have it &#8211; a painless and substantially automated, temperature mapping procedure in NX CAE.&nbsp; Who said multiphysics analysis can&#8217;t be easy?&nbsp; Leave a comment below.<BR \/><BR \/>Mark<\/P><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Simulating real world systems or applications often requires an analyst to address multiple physical phenomena, simultaneously.&nbsp; This is sometimes referred to as multiphysics or multidiscipline &#8230;<\/p>\n","protected":false},"author":45655,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-634","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts\/634","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/users\/45655"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/comments?post=634"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts\/634\/revisions"}],"predecessor-version":[{"id":635,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts\/634\/revisions\/635"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/media?parent=634"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/categories?post=634"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/tags?post=634"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/industry?post=634"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/product?post=634"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/coauthors?post=634"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}