{"id":3011,"date":"2020-04-20T20:53:45","date_gmt":"2020-04-21T00:53:45","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/news\/?p=3011"},"modified":"2026-03-26T11:25:51","modified_gmt":"2026-03-26T15:25:51","slug":"using-calibre-for-advanced-ic-packaging-verification-and-signoff","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/news\/using-calibre-for-advanced-ic-packaging-verification-and-signoff\/","title":{"rendered":"Using Calibre for Advanced IC Packaging Verification and Signoff"},"content":{"rendered":"\n<p> By staying home and keeping our distance, each of us is doing a great deal to help fight the spread of COVID-19. We can also use this time to learn new things and sharpen our skills. To this end, this new <a href=\"https:\/\/go.mentor.com\/5b4WS\" target=\"_blank\" rel=\"noopener\"><strong>whitepaper<\/strong><\/a> aims to keep you up-to-date on evolving high density advanced package designs and the new, automated verification solutions that can help you detect and highlight package connectivity errors in them. <\/p>\n","protected":false},"excerpt":{"rendered":"<p>By staying home and keeping our distance, each of us is doing a great deal to help fight the spread&#8230;<\/p>\n","protected":false},"author":69878,"featured_media":3022,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[103],"tags":[134,117],"industry":[],"product":[],"coauthors":[],"class_list":["post-3011","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-learning-resources","tag-covid19responseresources","tag-digital-twin"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/17\/2020\/04\/HDAP-image-1.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts\/3011","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/users\/69878"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/comments?post=3011"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts\/3011\/revisions"}],"predecessor-version":[{"id":3013,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/posts\/3011\/revisions\/3013"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/media\/3022"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/media?parent=3011"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/categories?post=3011"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/tags?post=3011"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/industry?post=3011"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/product?post=3011"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/news\/wp-json\/wp\/v2\/coauthors?post=3011"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}