{"id":112,"date":"2020-07-09T17:02:00","date_gmt":"2020-07-09T21:02:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/?p=112"},"modified":"2026-03-26T15:59:01","modified_gmt":"2026-03-26T19:59:01","slug":"semiengineering-easier-low-power-ics-with-reference-flows","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/2020\/07\/09\/semiengineering-easier-low-power-ics-with-reference-flows\/","title":{"rendered":"SemiEngineering: Easier Low Power ICs With Reference Flows"},"content":{"rendered":"\n<p>Excerpt from article: <a href=\"https:\/\/semiengineering.com\/easier-low-power-ics-with-reference-flows\/\" target=\"_blank\" rel=\"noreferrer noopener\">&#8220;Easier Low Power ICs With Reference Flows&#8221;<\/a><\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\"><p>Power-sensitive ICs for wearables and internet of things (IoT) products are in demand for markets ranging from automotive to military\/aerospace to consumer. As with most ICs, cost and time-to-market pressures are important determiners of success. Reducing risk by using a vendor-created reference flow can confer a serious business advantage.<\/p><p>Reference flows are popular because building a custom flow takes time and specialized knowledge, introduces risk, and increases both the total cost of tool ownership and time to tapeout. Reference flows for a specific technology are verified by both the EDA vendor and the fab, letting the designers focus on creating value instead of creating a design flow.<\/p><p><a href=\"https:\/\/semiengineering.com\/entities\/mentor-a-siemens-business\/\" target=\"_blank\" rel=\"noreferrer noopener\">Siemens EDA<\/a> and UMC supply their customers with a complete reference flow for digital and mixed-signal design for the UMC 22uLP technology. The reference flow includes scripts that automate each step of the flow, a user guide, and design data for demonstration (Arm Cortex-M33 processor).<\/p><p>The UMC 22uLP process features a 10 percent area reduction, improved power-to-performance ratio, and enhanced RF capabilities compared to the company\u2019s 28nm High-K\/Metal gate process. The platform is ideal for a wide variety of applications and is well-suited for power-sensitive ICs that require long battery life.<\/p><\/blockquote>\n\n\n\n<p>Read the entire article on <a href=\"https:\/\/semiengineering.com\/easier-low-power-ics-with-reference-flows\/\" target=\"_blank\" rel=\"noreferrer noopener\">SemiEngineering<\/a>\u00a0originally published on July 9th, 2020.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Excerpt from article: &#8220;Easier Low Power ICs With Reference Flows&#8221; Power-sensitive ICs for wearables and internet of things (IoT) products&#8230;<\/p>\n","protected":false},"author":77876,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[362,360,363],"industry":[],"product":[],"coauthors":[349],"class_list":["post-112","post","type-post","status-publish","format-standard","hentry","category-news","tag-ics","tag-low-power-ics","tag-reference-flows"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/posts\/112","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/users\/77876"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/comments?post=112"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/posts\/112\/revisions"}],"predecessor-version":[{"id":121,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/posts\/112\/revisions\/121"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/media?parent=112"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/categories?post=112"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/tags?post=112"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/industry?post=112"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/product?post=112"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/hlsdesign-verification\/wp-json\/wp\/v2\/coauthors?post=112"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}