{"id":33,"date":"2016-11-28T12:17:15","date_gmt":"2016-11-28T19:17:15","guid":{"rendered":"https:\/\/blogs.mentor.com\/expertinsights\/?p=33"},"modified":"2026-03-26T16:10:20","modified_gmt":"2026-03-26T20:10:20","slug":"top-5-articles-of-the-week-2","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/expertinsights\/2016\/11\/28\/top-5-articles-of-the-week-2\/","title":{"rendered":"Top 5 Articles of the Week"},"content":{"rendered":"
    \n
  1. Automotive IC Design Drives Simulation Innovation<\/strong><\/a><\/li>\n
  2. USB \u2013 Class Drivers<\/a><\/strong><\/li>\n
  3. Market Trends Motivate a Shift-Left in Functional Verification<\/strong><\/a><\/li>\n
  4. Smart for Smart’s Sake Part 1<\/strong><\/a><\/li>\n
  5. Better Thermal Design Means Better Efficiency<\/a><\/strong><\/li>\n<\/ol>\n

     
     <\/p>\n

    Automotive IC Design Drives Simulation Innovation\"Silicon_RC_model
    \n<\/strong><\/a>Semiconductor Engineering<\/em>
    \nHybrid automotive IC design must function in a very harsh environment for 10+ years. STMicroelectronics and Mentor Graphics pioneered a new analog\/mixed-signal simulation approach.
    \n
     
     <\/p>\n

    USB \u2013 Class Drivers\"Nucleus-USB-Function-Class-Drivers\"<\/a><\/strong>
    \nEDACafe<\/em>
    \nUSB is a straightforward technology for most users to utilize, but its deployment in devices can be quite challenging. Colin Walls clears up confusion regarding USB Class Drivers.
    \n
     
     <\/p>\n

    Market Trends Motivate a Shift-Left in Functional Verification\"left<\/strong><\/a>
    \nSemiWiki<\/em>
    \nEmulation is being adopted in networking, storage, mobile multimedia, and automotive IC design reflecting an overall shift-left in functional verification. A shift-left greatly reduces the risk of designing very large systems and ICs. Mentor Graphics Veloce and Veloce Apps are making this shift-left a reality.
    \n
     
     <\/p>\n

    Smart for Smart’s Sake Part 1\"smt<\/strong><\/a>
    \nSMT Magazine<\/em>
    \nSkeptical about PCB manufacturing and Industry 4.0? Michael Ford clears up some misconceptions about the amount of data and its management.
    \n
     
     <\/p>\n

    Better Thermal Design Means Better Efficiency\"Marovic_How_to_Tackle_Todays_Difficult_Thermal_Design_Challenges_graphic3-300x253\"
    \n<\/a><\/strong>Power Electronic Tips<\/em>
    \nToday\u2019s Computational Fluid Dynamics (CFD) allows thermal, mechanical, and electrical engineers to work more effectively with CFD analysts to create better products quickly. This article explains the process.<\/p>\n","protected":false},"excerpt":{"rendered":"

    Automotive IC Design Drives Simulation Innovation USB \u2013 Class Drivers Market Trends Motivate a Shift-Left in Functional Verification Smart for…<\/p>\n","protected":false},"author":71674,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[317,349,350,358,362,379,398],"industry":[],"product":[],"coauthors":[],"class_list":["post-33","post","type-post","status-publish","format-standard","hentry","category-news","tag-automotive","tag-embedded","tag-emulation","tag-functional-verification","tag-ic-design","tag-mechanical-analysis","tag-pcb-manufacturing"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/33","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/users\/71674"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/comments?post=33"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/33\/revisions"}],"predecessor-version":[{"id":1988,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/33\/revisions\/1988"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/media?parent=33"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/categories?post=33"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/tags?post=33"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/industry?post=33"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/product?post=33"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/coauthors?post=33"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}