{"id":303,"date":"2017-03-29T09:19:54","date_gmt":"2017-03-29T16:19:54","guid":{"rendered":"https:\/\/blogs.mentor.com\/expertinsights\/?p=303"},"modified":"2026-03-26T16:10:56","modified_gmt":"2026-03-26T20:10:56","slug":"techhighlights-simulating-milkshake-straws-connected-car-update-eco-fill-and-more","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/expertinsights\/2017\/03\/29\/techhighlights-simulating-milkshake-straws-connected-car-update-eco-fill-and-more\/","title":{"rendered":"TechHighlights: Simulating Milkshake Straws, Connected Car Update, ECO Fill, and More"},"content":{"rendered":"
    \n
  1. What\u2019s New in Connected Autos<\/a><\/strong><\/li>\n
  2. Just in Time for Shamrock Shakes: Simulating the Last Straw You Will Ever Need<\/a><\/strong><\/li>\n
  3. Developing a Mixed Safety-Critical\u00a0IIoT Robotic Arm<\/a><\/strong><\/li>\n
  4. ECO Fill Can Rescue Your SoC Tapeout Schedule<\/a><\/strong><\/li>\n
  5. 2017 DVCon US: Machine Learning Lands in EDA<\/a><\/strong><\/li>\n<\/ol>\n

    \u00a0<\/strong>
    \n\u00a0<\/strong><\/p>\n

    What\u2019s New in Connected Autos<\/strong><\/a>
    \nSemiconductor Engineering<\/em><\/p>\n

    \"\"Advanced connected car electronics present hardware integration challenges, while software must take in artificial intelligence, deep learning, and neural networking technology. Will security and technology keep up? Experts tackle this and more in this roundtable.<\/p>\n

    \u00a0<\/strong>
    \n\u00a0<\/strong><\/p>\n

    Just in Time for Shamrock Shakes: Simulating the Last Straw You Will Ever Need<\/strong><\/a>
    \nDigital Engineering<\/em><\/p>\n

    \"\"Ever wonder how the unique straw for McDonald\u2019s Shamrock Shake works? Our engineers were curious, so they used FloEFD frontloading computational fluid dynamics (CFD) simulation to see if the arrangement and design of the holes in the straw influenced the mixing ratio.\u00a0This article outlines the steps used and provides a video of the simulation in action.<\/p>\n

    \u00a0<\/strong>
    \n\u00a0<\/strong><\/p>\n

    Developing a Mixed Safety-Critical\u00a0IIoT Robotic Arm<\/strong><\/a>
    \nMicrocontroller Tips<\/em><\/p>\n

    \"\"Industrial automation systems are evolving at a rapid pace. Learn about the new software architectures that have evolved to make these systems reliable and easy to manage. The industrial robotic arm is used as an example in this article.<\/p>\n

    \u00a0<\/strong>
    \n\u00a0<\/strong><\/p>\n

    ECO Fill Can Rescue Your SoC Tapeout Schedule<\/strong><\/a>
    \nSemiconductor Engineering<\/em><\/p>\n

    \"\"At all nodes, automated engineering change order (ECO) fill can help you refill and re-verify your design quickly during late-stage changes, while minimizing costly mask respins. In this article, you\u2019ll learn how to regain control of your tapeout schedules while ensuring quality of results.<\/p>\n

    \u00a0<\/strong>
    \n\u00a0<\/strong><\/p>\n

    2017 DVCon US: Machine Learning Lands in EDA<\/strong><\/a>
    \nEDACafe<\/em><\/p>\n

    \"\"At DVCon US, experts presented and debated across all diverse facets of design verification including portable stimulus, formal analysis, the Universal Verification Methodology (UVM), and design verification languages. But Laura Rizzatti believes the topic of \u201cmachine learning\u201d reigned supreme as the new EDA frontier for DVCon US. This articles features Lauro\u2019s full conference recap.<\/p>\n

    \u00a0<\/strong>
    \n\u00a0<\/strong><\/p>\n","protected":false},"excerpt":{"rendered":"

    What\u2019s New in Connected Autos Just in Time for Shamrock Shakes: Simulating the Last Straw You Will Ever Need Developing…<\/p>\n","protected":false},"author":71674,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-303","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/303","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/users\/71674"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/comments?post=303"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/303\/revisions"}],"predecessor-version":[{"id":2010,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/303\/revisions\/2010"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/media?parent=303"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/categories?post=303"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/tags?post=303"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/industry?post=303"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/product?post=303"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/coauthors?post=303"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}