{"id":1502,"date":"2016-11-22T10:17:10","date_gmt":"2016-11-22T17:17:10","guid":{"rendered":"https:\/\/blogs.mentor.com\/expertinsights\/?p=5"},"modified":"2026-03-26T16:10:18","modified_gmt":"2026-03-26T20:10:18","slug":"top-5-articles-of-the-week","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/expertinsights\/2016\/11\/22\/top-5-articles-of-the-week\/","title":{"rendered":"Top 5 Articles of the Week"},"content":{"rendered":"
    \n
  1. A New World of 10nm Design Constraints<\/a><\/strong><\/li>\n
  2. Big Carmakers Merge, Cautiously, Into the Self-Driving Lane<\/strong><\/a><\/li>\n
  3. The 2016 Wilson Research Group Functional Verification Study<\/strong><\/a><\/li>\n
  4. Industry 4.0: Are We Losing Control?<\/strong><\/a><\/li>\n
  5. Making Drones Secure<\/strong><\/a><\/li>\n<\/ol>\n
    \n 
    \n \n<\/div>\n

     <\/p>\n

    A New World of 10nm Design Constraints<\/strong><\/a>
    \nSemiWiki\"new<\/em>
    \nAt 10nm, new constraint types, such as implant (submetal) rules,\u00a0have a direct impact on place and route subsystems. This expert interview covers the challenges of making place-and-route software ready for a new node.<\/p>\n

    \n 
    \n \n<\/div>\n

     <\/p>\n

    Big Carmakers Merge, Cautiously, Into the Self-Driving Lane<\/strong><\/a>
    \nThe New York Times\"big<\/em>
    \nConflicting autonomous driving approaches are leading to a \u201cclash of philosophies\u201d among automakers. Experts from GM, Audi, Ford, and Mentor Graphics weigh in.<\/p>\n

    \n 
    \n \n<\/div>\n

     <\/p>\n

    The 2016 Wilson Research Group Functional Verification Study<\/strong><\/a>
    \nSemiconductor Engineering\"2016<\/em>
    \nHarry Foster discusses key insights from the 2016 Wilson Research Group Functional Verification Study.<\/p>\n

    \n 
    \n \n<\/div>\n

     <\/p>\n

    Industry 4.0: Are We Losing Control?<\/strong><\/a>
    \nemsnow<\/em>
    \nIndustry 4.0 for PCB manufacturing can be intimidating. Michael Ford puts operators, engineers, and managers at ease with advice on creating the right environment for implementing Industry 4.0.<\/p>\n

    \n 
    \n \n<\/div>\n

     <\/p>\n

    Making Drones Secure<\/strong><\/a>
    \nSemiconductor Engineering\"making<\/em>
    \nCurrent-generation drones are imperiled by multiple security weaknesses. Is the semiconductor industry doing enough to address the problem? Serge Leef, VP of new ventures and GM of system level engineering at Mentor Graphics, and other industry leaders offer their insight.<\/p>\n

     <\/p>\n","protected":false},"excerpt":{"rendered":"

    A New World of 10nm Design Constraints Big Carmakers Merge, Cautiously, Into the Self-Driving Lane The 2016 Wilson Research Group…<\/p>\n","protected":false},"author":71674,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[302,317,318,342,358,362,26,398,400,412],"industry":[],"product":[],"coauthors":[],"class_list":["post-1502","post","type-post","status-publish","format-standard","hentry","category-news","tag-10nm","tag-automotive","tag-autonomous-driving","tag-drones","tag-functional-verification","tag-ic-design","tag-industry-4-0","tag-pcb-manufacturing","tag-place-and-route","tag-security"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/1502","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/users\/71674"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/comments?post=1502"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/1502\/revisions"}],"predecessor-version":[{"id":1987,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/posts\/1502\/revisions\/1987"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/media?parent=1502"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/categories?post=1502"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/tags?post=1502"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/industry?post=1502"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/product?post=1502"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/expertinsights\/wp-json\/wp\/v2\/coauthors?post=1502"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}