Article Roundup: Automotive Chip Compliance, Integrated IoT IC Design, IC/ASIC Design Trends, 5nm Collaboration & Cleaner Fireplaces

  1. The Long And Detailed Road To Automotive Compliance
  2. Enabling IoT Design with Integrated MEMS/IC Co-Design and Verification
  3. The Weather Report: 2018 Study On IC/ASIC Verification Trends
  4. A Collaborative Driven Solution
  5. Using CFD for Cleaner Fireplace Design


The Long And Detailed Road To Automotive Compliance
SemiEngineering

Surging activity around electric and autonomous vehicles is being tempered by the strict safety regulations prevalent in the automotive industry. This is particularly true for chip makers that must achieve a uniquely high bar of reliability in their products. This article examines new processes and methodologies chip companies are using to cope with automotive safety standards.


Enabling IoT Design with Integrated MEMS/IC Co-Design and Verification
Semi

Integrated circuit (IC) design for the IoT is a challenge because it integrates digital, analog, and radio frequency domains. Even more challenging is creating an IC that combines traditional electronics with a micro-electro-mechanical system (MEMS) sensor on the same silicon die to create the “smart” sensors needed for IoT systems. This article will examine methods of streamlining the design and verification of these smart sensor systems.


The Weather Report: 2018 Study On IC/ASIC Verification Trends
SemiEngineering

Harry Foster summarizes the results of the 2018 Wilson Research Group Functional Verification Study, focusing on trends in the IC and application-specific IC (ASIC) markets. In particular, the article will look at design and design resources that reflect growing design complexity as well as trends in verification technology adoption.


A Collaborative Driven Solution
SemiWiki

TSMC’s new 5nm design infrastructure enables SoC designers to implement advanced mobile and high-performance computing designs for emerging 5G and AI-driven markets. While new process nodes deliver improvements in performance, power, area, and cost, new technologies also incur challenges for IC designers and EDA vendors. Early collaboration can help both foundries and EDA companies overcome these challenges.


Using CFD for Cleaner Fireplace Design
Engineering.com

Fireplaces can make any room more comfortable, inviting, and, of course, warm. But they can also emit particulate into your home and the environment outside. In this article, see how Stove Builder International, a manufacturer of fireplaces, stoves, and furnaces, is using computational fluid dynamics to reduce the particulate emissions of its products.

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/expertinsights/2019/05/09/article-roundup-automotive-chip-compliance-integrated-iot-ic-design-ic-asic-design-trends-5nm-collaboration-cleaner-fireplaces/