{"id":955,"date":"2023-02-13T16:35:04","date_gmt":"2023-02-13T21:35:04","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=955"},"modified":"2026-03-26T14:40:28","modified_gmt":"2026-03-26T18:40:28","slug":"model-based-systems-engineering-mbse-for-electronics","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2023\/02\/13\/model-based-systems-engineering-mbse-for-electronics\/","title":{"rendered":"Model-based systems engineering (MBSE) for electronics"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">Exploring design alternatives with MBSE for electronics<\/h2>\n\n\n\n<p>Connectedness starts at the beginning of the design process when there is a consensus and a clear understanding across design disciplines for how to develop and build the product. But what does this mean for electronics? Using model-based systems engineering (MBSE), multi-discipline teams can explore design alternatives earlier in the design phase, when changing designs is easier and less disruptive.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Accelerating product development with a systems engineering approach<\/h2>\n\n\n\n<p>Teams can start integrated with a systems engineering approach to capture the system intent, manage the entire development workflow and provide the blueprints everyone can use to define and validate their domain specific work. <br><br>See how Mark Malinowski, Worldwide Director of MBSE for Electronics Design Automation answered a question about systems engineering and the challenges to multi-domain product development in a recent <a href=\"https:\/\/www.engineering.com\/story\/model-based-systems-engineering-the-solution-for-complex-cost-effective-engineering-projects\" target=\"_blank\" rel=\"noreferrer noopener\">Engineering.com roundtable discussion<\/a>.<\/p>\n\n\n\n<figure class=\"wp-block-video\"><video controls src=\"https:\/\/videos.mentor-cdn.com\/mgc\/videos\/5400\/09cec4a3-83d8-45b3-b0d0-98a8a3537927-en-US-video.mp4\"><\/video><figcaption class=\"wp-element-caption\">Engineering.com roundtable discussion on model-based systems engineering (MBSE)<\/figcaption><\/figure>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/www.engineering.com\/story\/model-based-systems-engineering-the-solution-for-complex-cost-effective-engineering-projects\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Watch the MBSE roundtable discussion on Engineering.com<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">About Siemens MBSE software<\/h2>\n\n\n\n<p>With Siemens <a href=\"https:\/\/www.sw.siemens.com\/en-US\/mbse\/\" target=\"_blank\" rel=\"noreferrer noopener\">MBSE software<\/a>, teams stay integrated from requirements to test plans and results to validate the system design, optimize the system efficiency and address all projects in one unified environment. With it, teams can verify and reuse design information, analysis multiple options, and quickly assess the impact of changes on all involved disciplines.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-font-size has-medium-font-size\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/www.sw.siemens.com\/en-US\/mbse\/\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Learn about MBSE software<\/a><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Exploring design alternatives with MBSE for electronics Connectedness starts at the beginning of the design process when there is a&#8230;<\/p>\n","protected":false},"author":79501,"featured_media":956,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[12],"tags":[381,591],"industry":[257],"product":[522],"coauthors":[330],"class_list":["post-955","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-webinar","tag-mbse","tag-model-based-systems-engineering","industry-electronics-semiconductors","product-teamcenter-systems-engineering"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/MBSE-Architecture20800x450_tcm27-85387.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/955","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/79501"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=955"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/955\/revisions"}],"predecessor-version":[{"id":959,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/955\/revisions\/959"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/956"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=955"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=955"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=955"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=955"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=955"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=955"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}