{"id":931,"date":"2023-02-01T18:31:44","date_gmt":"2023-02-01T23:31:44","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=931"},"modified":"2026-03-26T14:40:25","modified_gmt":"2026-03-26T18:40:25","slug":"electronics-and-semiconductor-roundup-02-2023","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2023\/02\/01\/electronics-and-semiconductor-roundup-02-2023\/","title":{"rendered":"February 2023 Roundup: What&#8217;s the latest in electronics and semiconductor?"},"content":{"rendered":"\n<p>Discover the latest in electronics and semiconductor with this list of our most popular recent content.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Ebook: <strong>The electronic manufacturer&#8217;s guide to practical manufacturing analytics<\/strong><\/h2>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-manufacturing-analytics-in-pcb-assembly\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Smart_Data_eBook_LP_640x360.webp\" alt=\"Electronics manufacturing engineer reviewing data on a laptop on the shop floor\" class=\"wp-image-936\" width=\"600\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Smart_Data_eBook_LP_640x360.webp 500w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Smart_Data_eBook_LP_640x360-395x222.webp 395w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><\/figure>\n\n\n\n<p>It isn\u2019t always easy for manufacturers to determine what data is important for smart manufacturing data analytics, and to ensure that the right data is being collected. In many cases, the interfaces to data collection sources are complex and data isn\u2019t standardized.<br><br>What data is important for smart manufacturing analytics? How can manufacturers make sure the right data is collected? Learn how to put electronics manufacturing data to work in this ebook.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-manufacturing-analytics-in-pcb-assembly\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 3%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Download the ebook<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Whitepaper: <strong>Why semiconductor companies should use single device tracking<\/strong><\/h2>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/white-paper-semiconductor-manufacturing-with-single-device-tracking\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/semi-single-device-tracking_640x360_tcm27-107241.webp\" alt=\"Digitized version of a semiconductor chip\" class=\"wp-image-939\" width=\"600\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/semi-single-device-tracking_640x360_tcm27-107241.webp 500w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/semi-single-device-tracking_640x360_tcm27-107241-395x222.webp 395w\" sizes=\"(max-width: 500px) 100vw, 500px\" \/><\/a><\/figure>\n\n\n\n<p>Complex products, high mix and greater specs for quality, innovation and size makes it more challenging for semiconductor manufacturers to achieve zero defects. Single-device tracking can help meet customer expectations.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/resources.sw.siemens.com\/en-US\/white-paper-semiconductor-manufacturing-with-single-device-tracking\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 98%)\" target=\"_blank\" rel=\"noreferrer noopener\">Download the whitepaper<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Webinar: <strong>PCB testing in high-mix manufacturing: boosting testing efficiency<\/strong><\/h2>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/webinars.sw.siemens.com\/en-US\/pcb-testing-in-high-mix-electronics-manufacturing\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Capture.png\" alt=\"Up close view of a printed circuit board with machinery\" class=\"wp-image-934\" width=\"600\"\/><\/a><\/figure>\n\n\n\n<p>PCB board testing methods from the past no longer offer a scalable solution for today\u2019s electronics manufacturers. Learn about PCB testing methods for today&#8217;s electronics manufacturers.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/webinars.sw.siemens.com\/en-US\/pcb-testing-in-high-mix-electronics-manufacturing\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Watch the webinar<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Webinar: Seamless ECAD-MCAD collaboration for electronics systems design<\/h2>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><a href=\"https:\/\/webinars.sw.siemens.com\/en-US\/seamless-ecad-mcad-collaboration-for-electronic-system-design\" target=\"_blank\" rel=\"noopener\"><img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/ecad-mcad-800x450px.webp\" alt=\"Image of Siemens NX electronics and mechanical design software showing an electrical design in two different views\" class=\"wp-image-933\" width=\"600\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/ecad-mcad-800x450px.webp 800w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/ecad-mcad-800x450px-600x338.webp 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/ecad-mcad-800x450px-768x432.webp 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/ecad-mcad-800x450px-395x222.webp 395w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/><\/a><\/figure>\n\n\n\n<p>Demand for increased functionality, constant connectivity, and lower cost is dramatically increasing the complexity of electronic systems. From managing the interconnectedness of complex systems to improving communication across stakeholders to increasing productivity and quality without increasing cost, electronics companies cite increasing system complexity as their most significant product development challenge.<\/p>\n\n\n\n<p>The smaller-denser-faster mantra associated with today\u2019s products magnifies the significance of ensuring that electro-mechanical compatibility is addressed before first fabrication. Waiting until fabrication is not an option to launch products quickly.<\/p>\n\n\n\n<p>Watch this on-demand webinar to learn about ECAD-MCAD co-design.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/webinars.sw.siemens.com\/en-US\/seamless-ecad-mcad-collaboration-for-electronic-system-design\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">View the webinar<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Blog: What&#8217;s all buzz about semiconductor lifecycles?<\/h2>\n\n\n\n<figure class=\"wp-block-image size-large is-resized\"><a href=\"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/12\/12\/whats-all-the-buzz-about-semiconductor-lifecycles\/\"><img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-1024x576.jpg\" alt=\"Image of a sunflower with a semiconductor chip in the center with a honeybee flying nearby\" class=\"wp-image-932\" width=\"600\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-1024x576.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-600x338.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-768x432.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-1536x864.jpg 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-395x222.jpg 395w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1-900x506.jpg 900w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Semiconductor-Product-Lifecycles-2048x1152-1.jpg 2048w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/a><\/figure>\n\n\n\n<p>What do honeybees have to do with semiconductors? Everything! Learn how honeybees and semiconductor lifecycles are similar and important to different lifecycles in this blog post.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link has-white-color has-text-color has-background wp-element-button\" href=\"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/12\/12\/whats-all-the-buzz-about-semiconductor-lifecycles\/\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">View the blog<\/a><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Discover the latest in electronics and semiconductor with this list of our most popular recent content. Ebook: The electronic manufacturer&#8217;s&#8230;<\/p>\n","protected":false},"author":79501,"featured_media":936,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[7],"tags":[554,428,589],"industry":[257],"product":[],"coauthors":[330],"class_list":["post-931","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-learning-resources","tag-electronics-systems-design","tag-pcb-testing","tag-semiconductor-lifecycles","industry-electronics-semiconductors"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2023\/02\/Smart_Data_eBook_LP_640x360.webp","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/931","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/79501"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=931"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/931\/revisions"}],"predecessor-version":[{"id":943,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/931\/revisions\/943"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/936"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=931"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=931"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=931"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=931"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=931"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=931"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}