{"id":738,"date":"2022-04-28T16:02:21","date_gmt":"2022-04-28T20:02:21","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=738"},"modified":"2026-03-26T14:39:58","modified_gmt":"2026-03-26T18:39:58","slug":"dont-erase-profitability-with-errors-in-high-mix-low-volume-pcb-manufacturing","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/04\/28\/dont-erase-profitability-with-errors-in-high-mix-low-volume-pcb-manufacturing\/","title":{"rendered":"Don\u2019t erase profitability with errors in high-mix, low volume PCB manufacturing"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">Getting ready for mass personalization in PCB manufacturing<\/h2>\n\n\n\n<p>Is your production process ready for mass personalization to replace mass production? Businesses need to rethink how they design, package, manufacture, and deliver printed circuit boards to meet the market&#8217;s new high-mix, low volume needs without erasing profitability with errors.<\/p>\n\n\n\n<p>Valor Process Preparation creates a single, central database of all manufacturing process definitions and engineering data. Acting as a single environment for all manufacturing process stages, Process Preparation ensures data is constantly up-to-date and an error-free manufacturing process.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">How does a PCB digital twin work?<\/h2>\n\n\n\n<p>The PCB digital twin methodology provides:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>A full virtualization of the PCB assembly process.<\/li><li>Providing access to fully synchronized data across the enterprise.<\/li><li>Reducing the probability of errors on the shop floor and improving both production yields and the bottom line.<\/li><\/ul>\n\n\n\n<p>You can see how <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/our-story\/customers\/srxglobal\/101266\/\" target=\"_blank\" rel=\"noreferrer noopener\">SRXGlobal<\/a> uses Process Preparation to automate and simplify the stencil customization process, resulting in shorter lead times and reducing costly defects that can erase profitability.<\/p>\n\n\n<div class=\"wp-block-buttons\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-100 is-style-fill\"><a class=\"wp-block-button__link has-white-color has-text-color has-background\" style=\"border-radius: 10px; background: linear-gradient(180deg,#4ebcbc 5%,#0699c9 100%);\" href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/our-story\/customers\/srxglobal\/101266\/\" target=\"_blank\" rel=\"noreferrer noopener\">See how SRXGlobal reduced stencil design soldering errors by 80%<\/a><\/div>\n<\/div>\n\n\n<h2 class=\"wp-block-heading\">Benefits of a digital twin for PCB Manufacturing<\/h2>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"640\" height=\"360\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/04\/process_engineering_website_image1_tcm27-88871.jpg\" alt=\"engineer holding tablet with information flowing to pcb production machinery\" class=\"wp-image-740\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/04\/process_engineering_website_image1_tcm27-88871.jpg 640w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/04\/process_engineering_website_image1_tcm27-88871-600x338.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/04\/process_engineering_website_image1_tcm27-88871-395x222.jpg 395w\" sizes=\"auto, (max-width: 640px) 100vw, 640px\" \/><\/figure>\n\n\n\n<p>Some benefits of developing a PCB digital twin include:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Early discovery of issues allows the decision-making process to shift leftward, helping reduce expenses since you get it right the first time<\/li><li>Data backbone synchronization ensures engineers across the enterprise access to up-to-date, in-process design data<\/li><li>The centralized knowledgebase of engineering changes shared among all manufacturing sites<\/li><li>Improves manufacturing agility, reduces cost and accelerates time-to-market<\/li><\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Streamline your next run of high-mix, low volume PCBs<\/h2>\n\n\n\n<p>Valor process engineering solutions simplify the delivery of high-quality, consistent surface mount technology (SMT) process collateral, empowering you to meet the engineering demands of high-mix, low-volume production efficiently.<\/p>\n\n\n\n<p>Learn more about Valor Process Preparation and discover how you can reduce errors, lead times and innovate faster.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-100 is-style-fill\"><a class=\"wp-block-button__link has-white-color has-text-color has-background\" href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/products\/manufacturing-planning\/process-preparation-pcb-assembly-test.html\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 89%)\" target=\"_blank\" rel=\"noreferrer noopener\">Learn more about Valor Process Preparation for PCB Assembly &amp; Test<\/a><\/div>\n<\/div>\n\n\n\n<p>Want to give it a try today? Sign up for a 30-day trial of Valor Process Preparation to unlock an immediate, hands-on trial.\u00a0<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-100 is-style-fill\"><a class=\"wp-block-button__link has-white-color has-text-color has-background\" href=\"https:\/\/trials.sw.siemens.com\/valor-process-preparation\/\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 5%,rgb(6,153,201) 87%)\" target=\"_blank\" rel=\"noreferrer noopener\">Try Valor Process Preparation<\/a><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Getting ready for mass personalization in PCB manufacturing Is your production process ready for mass personalization to replace mass production?&#8230;<\/p>\n","protected":false},"author":79501,"featured_media":741,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[7],"tags":[331,424,426,423,425,308,427],"industry":[257],"product":[213],"coauthors":[330],"class_list":["post-738","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-learning-resources","tag-electronics-lifecycle","tag-pcb-assembly","tag-pcb-digital-twin","tag-pcb-manufacturing","tag-pcb-test","tag-plm","tag-valor-process-preparation","industry-electronics-semiconductors","product-valor-process-preparation"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/04\/bom-connector5-sb-640x360_tcm27-88491.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/738","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/79501"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=738"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/738\/revisions"}],"predecessor-version":[{"id":742,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/738\/revisions\/742"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/741"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=738"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=738"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=738"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=738"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=738"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=738"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}