{"id":313,"date":"2022-03-01T11:54:25","date_gmt":"2022-03-01T16:54:25","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=313"},"modified":"2026-03-26T14:39:41","modified_gmt":"2026-03-26T18:39:41","slug":"february-digitalization-for-electronics-semiconductor","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/03\/01\/february-digitalization-for-electronics-semiconductor\/","title":{"rendered":"The latest in digitalization for electronics &#038; semiconductor"},"content":{"rendered":"\n<p>A look at the latest digitalization-themed webinars, blogs and more for the electronics and semiconductor industry. <\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Thermal analysis of complex multi-layer printed circuit boards<\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/03\/82151ac0-e08b-42f2-ae0e-b43fed1b7e1c_futuristic-circuit-board_600x300.jpg\" alt=\"Digitalization on printed circuit board with components\" class=\"wp-image-314\"\/><\/figure><\/div>\n\n\n\n<p class=\"has-text-align-center\" style=\"font-size:28px\"><strong>Webinar: Two Sessions<\/strong><\/p>\n\n\n\n<p>The complexity arising from miniaturization, increasing functionality and tighter integration of electronics systems can require the use of complex multi-layer printed circuit boards (PCB), with upwards of 50 layers. Join us for a live webinar to find out how you can accelerate your design through electro-thermal co-simulation.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-16018d1d wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter has-custom-font-size is-style-fill has-medium-font-size\"><a class=\"wp-block-button__link has-background\" href=\"\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Register now<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Is there a simple way to identify compromised components?<\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/03\/3b93f829-8f06-4f2e-8bca-49236f0d5274_blog_post_1_600x300.jpg\" alt=\"3D diagram of a printed circuit board with information bubbles over components that could be compromised\" class=\"wp-image-315\"\/><\/figure><\/div>\n\n\n\n<p class=\"has-text-align-center\" style=\"font-size:28px\"><strong>New Blog Post<\/strong><\/p>\n\n\n\n<p>A single defective part or compromised component can jeopardize an entire production run and cause massive product recalls. How can they be detected on the shop floor \u2013 in real time?<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter has-custom-font-size is-style-fill has-medium-font-size\"><a class=\"wp-block-button__link has-background\" href=\"https:\/\/blogs.sw.siemens.com\/valor\/2022\/02\/20\/is-there-a-simple-way-to-identify-compromised-components\/\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 95%)\">Read now<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Software upgrade and migration strategies for electronics manufacturers<\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/03\/62559626-0d1f-4f47-9144-d38695b37bb5_blog_post_2_600x300.jpg\" alt=\"Visual image depicting PCBs on conveyer belt between old and new software programs shown on computers\" class=\"wp-image-317\"\/><\/figure><\/div>\n\n\n\n<p class=\"has-text-align-center\" style=\"font-size:29px\"><strong>New Blog Post<\/strong><\/p>\n\n\n\n<p>Many electronics manufacturers struggle with outdated software which causes problems and inefficiencies. Learn about three important considerations to evaluate when making decisions about software updates and migrations.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button aligncenter has-custom-font-size is-style-fill has-medium-font-size\"><a class=\"wp-block-button__link has-background\" href=\"https:\/\/blogs.sw.siemens.com\/valor\/2022\/02\/15\/software-upgrade-and-migration-strategies-for-electronics-manufacturers\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 95%)\" target=\"_blank\" rel=\"noreferrer noopener\">Read now<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Additional industry resources:<\/h2>\n\n\n\n<p><strong>Blog &#8211; <a href=\"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/02\/08\/risk-managment-software-upgrade-strategy\/\" target=\"_blank\" rel=\"noreferrer noopener\">Three vital considerations for updating and migrating SMT engineering software<\/a><\/strong> <strong>\u2192<\/strong>&nbsp;Mitigate software update challenges by adopting the right strategy. Before making any migration decision, teams should review three considerations to ensure the success of current and future solutions in the manufacturing environment.<\/p>\n\n\n\n<p><strong>ebook &#8211; <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-engineering-change-process-how-to-guide\" target=\"_blank\" rel=\"noreferrer noopener\">How to guide: engineering change process<\/a><\/strong> \u2192 Changes are inevitable. Making those change doesn\u2019t have to be a long, drawn-out process. This ebook by Lifecycle Insights outlines how you can achieve change management best practices.<\/p>\n\n\n\n<p><strong>Blog &#8211; <a href=\"https:\/\/blogs.sw.siemens.com\/podcasts\/smart-digital-manufacturing\/the-global-pandemic-and-how-digitalization-is-helping-electronics-manufacturers-produce-more-at-lower-costs\" target=\"_blank\" rel=\"noreferrer noopener\">The global pandemic and how digitalization is helping electronics manufacturers produce more at lower costs<\/a><\/strong> \u2192 In our fourth episode of The Voice of Smart Manufacturing, we talk with Oren Manor about the impact of COVID-19 on the electronics industry from manufacturing disruptions and lockdowns to increased supply chain disturbances. Tune in to learn how digitalization is working to alleviate these impacts.<\/p>\n\n\n\n<p><a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/your-success\/events\/\" target=\"_blank\" rel=\"noreferrer noopener\">View all upcoming events <strong>\u2192<\/strong><\/a><\/p>\n\n\n\n<p><a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/your-success\/resources\/\" target=\"_blank\" rel=\"noreferrer noopener\">View all related resources <strong>\u2192<\/strong><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>A look at the latest digitalization-themed webinars, blogs and more for the electronics and semiconductor industry. Thermal analysis of complex&#8230;<\/p>\n","protected":false},"author":79501,"featured_media":321,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[7],"tags":[292,294,306,331],"industry":[257],"product":[],"coauthors":[330],"class_list":["post-313","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-learning-resources","tag-digital-transformation","tag-digitalization","tag-electronics-design","tag-electronics-lifecycle","industry-electronics-semiconductors"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/03\/green-semi.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/313","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/79501"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=313"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/313\/revisions"}],"predecessor-version":[{"id":330,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/313\/revisions\/330"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/321"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=313"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=313"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=313"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=313"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=313"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=313"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}