{"id":274,"date":"2022-02-07T16:28:00","date_gmt":"2022-02-07T21:28:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=274"},"modified":"2026-03-26T14:39:54","modified_gmt":"2026-03-26T18:39:54","slug":"latest-industry-trends-digitalization-for-electronics-semiconductor","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/02\/07\/latest-industry-trends-digitalization-for-electronics-semiconductor\/","title":{"rendered":"What&#8217;s new in digitalization for electronics &#038; semiconductor?"},"content":{"rendered":"\n<p>As we start 2022, many of us are still left wondering how we can best prepare for the ongoing unpredictable reality. What trends and challenges are likely to be the most significant this year? <\/p>\n\n\n\n<p>Discover how electronics manufacturers can benefit from digitalization across product development, manufacturing and lifecycle processes. Below are some upcoming and recent webinars on these industry trends, as well as newly released electronics and semiconductor content.<\/p>\n\n\n\n<h2 class=\"has-text-align-center wp-block-heading\" id=\"live-webinar-7-feburary-2022-how-to-design-better-products-faster-with-electronics-design-innovation\">How to design better products, faster with electronics design innovation<\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/02\/blog-january-1.jpg\" alt=\"Digital twin alongside a device with electronic components\" class=\"wp-image-276\"\/><\/figure><\/div>\n\n\n\n<p class=\"has-text-align-center\"><strong>Live Webinar: 7 February 2022<\/strong><\/p>\n\n\n\n<p class=\"has-text-align-left\">Companies that design electronic products often use a serial approach to design with limited collaboration. A design strategy that supports visibility, reuse and control for the entire product is, without a doubt, a smarter way. The question is, how? Find out in this live webinar.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-16018d1d wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-25 has-custom-font-size is-style-fill has-medium-font-size\"><a class=\"wp-block-button__link has-background\" href=\"https:\/\/webinars.sw.siemens.com\/electronics-design-using-a-digital-twin\/\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Register Now<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"has-text-align-center wp-block-heading\" id=\"live-webinar-7-feburary-2022-how-to-design-better-products-faster-with-electronics-design-innovation\">How electronics manufacturers can leverage the growing smart device market<\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/02\/blog-january-2.jpg\" alt=\"Electronics printed circuit board imagery\" class=\"wp-image-283\"\/><\/figure><\/div>\n\n\n\n<p class=\"has-text-align-center\"><strong>On-demand webinar<\/strong><\/p>\n\n\n\n<p>To take full advantage of the growing electronics market demand, companies need to constantly innovate. But how do you do this without sacrificing product integrity or time to market?<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-16018d1d wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-25 has-custom-font-size is-style-fill has-medium-font-size\"><a class=\"wp-block-button__link has-background\" href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/webinar\/semiconductor-lifecycle-management-for-chipmakers\/101268\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Watch Now<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"thermal-analysis-influence-of-variability-on-electronics-reliability\">Thermal analysis &#8211; influence of variability on electronics reliability<\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/02\/blog-january-3.jpg\" alt=\"Dual computer screens showing the influence of variability in electronics using thermal analysis \" class=\"wp-image-287\"\/><\/figure><\/div>\n\n\n\n<p class=\"has-text-align-center\"><strong>On-demand webinar<\/strong><\/p>\n\n\n\n<p>This on-demand webinar explores using electronics thermal analysis combined with statistical design space exploration tools to analyze and reduce manufacturing defects.<\/p>\n\n\n\n<div class=\"wp-block-buttons is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-16018d1d wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button has-custom-width wp-block-button__width-25 has-custom-font-size is-style-fill has-medium-font-size\"><a class=\"wp-block-button__link has-background\" href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/webinar\/thermal-analysis-variability-influences\/103670\" style=\"border-radius:10px;background:linear-gradient(180deg,rgb(78,188,188) 0%,rgb(6,153,201) 100%)\" target=\"_blank\" rel=\"noreferrer noopener\">Watch Now<\/a><\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"additional-electronics-semiconductor-industry-resources\">Additional electronics &amp; semiconductor industry resources<\/h2>\n\n\n\n<p><strong>Blog &#8211; <\/strong><a href=\"https:\/\/blogs.sw.siemens.com\/valor\/2022\/01\/10\/smart-procurement-for-supply-chain-resilience\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Smart procurement for supply chain resilience \u2192<\/strong>&nbsp;<\/a>If there\u2019s one thorn in the side of almost every manufacturer on the planet right now, it\u2019s the supply chain. What\u2019s needed is a strategy re-think; moving procurement upstream.<\/p>\n\n\n\n<p><strong>Video &#8211; <\/strong><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/video-integrated-electronics-simulation-and-manufacturing\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Simulation-driven design can significantly reduce development time for electronics designers \u2192<\/strong>&nbsp;<\/a>Learn about how integrated simulation and manufacturing can reduce development time in this short video.<\/p>\n\n\n\n<p><strong>Blog <\/strong>&#8211; <a href=\"https:\/\/blogs.sw.siemens.com\/valor\/2022\/01\/17\/sustainability-in-the-electronics-industry-in-2022-and-beyond\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Sustainability in the electronics industry \u2013 A hot topic in 2022 and beyond \u2192<\/strong><\/a>&nbsp;The electronics industry is receiving increasing scrutiny of its environmental performance. This requires manufacturers to make critical changes.<\/p>\n\n\n\n<p><strong>Video <\/strong>&#8211; <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/video-concurrent-electronics-mechanical-design\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Concurrent electronics and mechanical design of complex consumer products for faster time to market \u2192<\/strong>&nbsp;<\/a>An integrated approach to electronic product development is essential for organizations to move through the product design process quickly and efficiently.<\/p>\n\n\n\n<p><strong>Blog <\/strong>&#8211; <a href=\"https:\/\/blogs.sw.siemens.com\/valor\/2022\/01\/24\/electronics-manufacturing-industry-trends-in-2022\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Electronics manufacturing industry trends in 2022 \u2192<\/strong>&nbsp;<\/a>What challenges are likely to be the most acute and significant in 2022? Oren Manor defines major trends in the electronics manufacturing industry.<\/p>\n\n\n\n<p><strong>Blog<\/strong> &#8211; <a href=\"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2022\/01\/10\/better-collaboration-and-innovation-with-a-digital-twin\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>Collaborate more efficiently and accelerate digital handoffs in electronics design \u2192<\/strong>&nbsp;<\/a>While traditional electronic design silos limit teams, the comprehensive digital twin enables data analysis and simulation across mechanical, electrical and software domains. This single source of truth allows collaboration, data sharing, reuse and control.<\/p>\n\n\n\n<p><strong>eBook &#8211; <\/strong><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-bill-of-materials-bom-management-how-to-guide\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>How to guide: A better way to make a single, accurate BOM (Bill of Materials) \u2192<\/strong>&nbsp;<\/a>Read this ebook and discover how easy it is to ensure everyone is working from the most accurate, up-to-date BOM.<\/p>\n\n\n\n<p><a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/your-success\/events\/?stc=wwiia420000&amp;elqcst=272&amp;elqcsid=7362&amp;_ref=c3RjPXd3aWlhNDIwMDAwJmVscWNzdD0yNzImZWxxY3NpZD03MzYy\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>View all upcoming events&nbsp;\u2192<\/strong><\/a><\/p>\n\n\n\n<p><a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/your-success\/resources\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>View all related resources&nbsp;\u2192<\/strong><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>As we start 2022, many of us are still left wondering how we can best prepare for the ongoing unpredictable&#8230;<\/p>\n","protected":false},"author":79501,"featured_media":293,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[5,7,12],"tags":[292,293,294,306,367,331,357],"industry":[257],"product":[],"coauthors":[330],"class_list":["post-274","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","category-learning-resources","category-webinar","tag-digital-transformation","tag-digital-twin","tag-digitalization","tag-electronics-design","tag-electronics-innovation","tag-electronics-lifecycle","tag-webinar","industry-electronics-semiconductors"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2022\/02\/blog-january-header-image.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/274","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/79501"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=274"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/274\/revisions"}],"predecessor-version":[{"id":712,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/274\/revisions\/712"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/293"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=274"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=274"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=274"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=274"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=274"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=274"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}