{"id":2035,"date":"2025-11-10T13:51:57","date_gmt":"2025-11-10T18:51:57","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=2035"},"modified":"2026-03-26T14:42:24","modified_gmt":"2026-03-26T18:42:24","slug":"fall-semiconductor-series-how-integrated-software-and-automation-transform-fab-sustainability-3","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2025\/11\/10\/fall-semiconductor-series-how-integrated-software-and-automation-transform-fab-sustainability-3\/","title":{"rendered":"Fall Semiconductor Series: How integrated software and automation transform\u00a0fab\u00a0sustainability\u00a0"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\"><strong>(Part 3 of&nbsp;5):&nbsp;The&nbsp;fab&nbsp;is&nbsp;a complex challenge<\/strong>\u2014<strong>how do you know where your&nbsp;sustainability&nbsp;journey should begin?<\/strong>&nbsp;<\/h2>\n\n\n\n<p>In our Fall Semiconductor Series, we discuss the sustainability challenges faced by semiconductor fabs and why an integrated software and automation solution is the right solution to address these challenges.\u00a0\u00a0If you missed our earlier posts, just click on <a href=\"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2025\/10\/28\/fall-semiconductor-series-how-integrated-software-and-automation-transform-fab-sustainability\/\" target=\"_blank\" rel=\"noreferrer noopener\">Part 1<\/a> or <a href=\"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2025\/11\/03\/fall-semiconductor-series-how-integrated-software-and-automation-transform-fab-sustainability-2\/\" target=\"_blank\" rel=\"noreferrer noopener\">Part 2<\/a> of the Series.\u00a0<\/p>\n\n\n\n<p>In this week&#8217;s blog, we focus on the complex challenge presented by the semiconductor fab. Semiconductor fabs are among the most complex manufacturing environments ever built.&nbsp;Chip manufacturing demands atomic-level precision across thousands of interdependent steps\u2014lithography, etching, doping\u2014and&nbsp;each must be&nbsp;executed flawlessly on silicon wafers. It requires specialized equipment, massive capital investment, and mastery across physics, chemistry, and engineering.&nbsp;All&nbsp;of which must be&nbsp;orchestrated&nbsp;with&nbsp;ultimate&nbsp;precision&nbsp;to deliver flawless products profitably and sustainably\u2014at scale.&nbsp;<\/p>\n\n\n\n<p>Considering&nbsp;such a complex&nbsp;model, how&nbsp;do you&nbsp;know where&nbsp;your&nbsp;sustainability&nbsp;journey should begin?&nbsp;<\/p>\n\n\n\n<p>It begins with the digital twin,&nbsp;which&nbsp;is a virtual replica of your&nbsp;entire&nbsp;semiconductor&nbsp;fab\u2014a physics-based model that mirrors how your actual&nbsp;manufacturing processes and&nbsp;systems behave&nbsp;in real time.&nbsp;It is the right&nbsp;first step towards&nbsp;analyzing and understanding&nbsp;the&nbsp;complex&nbsp;operations&nbsp;of the fab&nbsp;for the purpose of optimizing it effectively.&nbsp;The digital twin&nbsp;enables you to&nbsp;accurately&nbsp;predict production performance, test scenarios, and&nbsp;optimize&nbsp;operations without disrupting live production.&nbsp;<\/p>\n\n\n\n<p>Unlimited in its scope for precise modeling, learnings and optimization, the digital twin can be used to model either the actual product or manufacturing process. The digital twin can simulate real-world conditions in a virtual model prior to building a semiconductor product or designing actual manufacturing operations.&nbsp;<\/p>\n\n\n\n<p>It allows you to&nbsp;optimize&nbsp;fab&nbsp;planning&nbsp;virtually without&nbsp;disrupting your operation or without incurring the&nbsp;high&nbsp;cost&nbsp;of actual trial and error on the&nbsp;production&nbsp;floor.&nbsp;<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Virtual&nbsp;fab&nbsp;planning enables data-driven decisions<\/strong>&nbsp;<\/h2>\n\n\n\n<p>The&nbsp;validated&nbsp;blueprint&nbsp;from the digital twin&nbsp;can be used to orchestrate real-world operations with&nbsp;a seamlessly&nbsp;integrated Manufacturing Execution System (MES),&nbsp;Advanced Process Control (APC)&nbsp;and automated material handling.&nbsp;<\/p>\n\n\n\n<p>With semiconductor manufacturing equipment connected to MES, smart manufacturing&nbsp;can report real-time data collected throughout the&nbsp;fab.&nbsp;This includes&nbsp;data from sensors,&nbsp;actuators&nbsp;and input\/output (I\/O)&nbsp;modules at the semiconductor equipment level and from&nbsp;subfab&nbsp;facilities and utilities up through every level of&nbsp;product and process recording and tracking. The internet&nbsp;of things (IoT) data and process control data are fed into&nbsp;analytics systems to&nbsp;leverage&nbsp;both historical and predictive analytics to forecast and deliver better future outcomes.&nbsp;<\/p>\n\n\n\n<p>A comprehensive digital twin spanning the entire chip lifecycle can create a powerful feedback loop between design and manufacturing. By simulating production virtually and feeding real manufacturing insights back into design, manufacturers can&nbsp;optimize&nbsp;both chip designs and production processes before physical manufacturing begins.&nbsp;<\/p>\n\n\n\n<p>With the integration of software and automation, digital twin capabilities are amplified across the chip lifecycle. Real-time production data automatically feeds into simulation,&nbsp;while analytics drive rapid process adjustments, creating an intelligent, self-optimizing system that continuously improves both current manufacturing and future chip designs.&nbsp;<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Applying the power of data to sustainable outcomes<\/strong>&nbsp;<\/h2>\n\n\n\n<p>With end-to-end connectivity across&nbsp;systems,&nbsp;shown in the diagram below, real-time data is collected directly from the semiconductor MES to inform the digital twin and semiconductor specific dashboards.&nbsp;<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"665\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-1024x665.jpg\" alt=\"\" class=\"wp-image-2040\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-1024x665.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-600x390.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-768x499.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-1536x998.jpg 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-2048x1330.jpg 2048w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/EBOOK-SM-VIRTUAL-REPRESENTATION_Graphic-900x585.jpg 900w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><figcaption class=\"wp-element-caption\"><em>Siemens MES solutions work with&nbsp;the Siemens Facility Monitoring and Control System (FMCS)&nbsp;to help semiconductor manufacturers achieve sustainability goals by&nbsp;optimizing&nbsp;energy use and reducing waste with real-time digital control of&nbsp;fab&nbsp;operations. Digital twin technology and advanced automation enable fabs to maximize quality and efficiency while minimizing environmental impact.<\/em>&nbsp;<\/figcaption><\/figure>\n\n\n\n<p>MES can&nbsp;leverage&nbsp;a digital twin to capture real-time performance data, including Statistical Process Control (SPC) and deviations from manufacturing execution, maintenance,&nbsp;testing&nbsp;and scheduling. Continually updated with MES data in a closed-loop manufacturing system, the digital twin is always ready to&nbsp;provide&nbsp;advanced simulation to discover actionable insights not only for predictive maintenance, but also to&nbsp;identify&nbsp;production and sustainability improvement opportunities, which are significant.&nbsp;<\/p>\n\n\n\n<p>Siemens\u2019 end-to-end sustainability solutions reduce carbon footprints and&nbsp;optimize&nbsp;the use of water, energy,&nbsp;chemicals&nbsp;and gases, ensuring safer handling of hazardous materials. This supports responsible sourcing and better&nbsp;utilization&nbsp;of materials.&nbsp;<\/p>\n\n\n\n<p>Chipmakers and machine builders can design and build future-proof semiconductor fabs by implementing a wide range of digitally integrated automation solutions, reducing energy&nbsp;consumption, enhancing efficiency and productivity, choosing less regulated materials, reducing water&nbsp;consumption&nbsp;and providing people-centric workspaces in operations.&nbsp;<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"576\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-1024x576.jpg\" alt=\"\" class=\"wp-image-2058\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-1024x576.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-600x338.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-768x432.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-1536x864.jpg 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-2048x1152.jpg 2048w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-395x222.jpg 395w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Senseye-PdM-Visual-Tech-Style-sRGB_original-2-900x506.jpg 900w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Empowering predictive maintenance<\/strong>&nbsp;<\/h2>\n\n\n\n<p>The digital twin also empowers predictive maintenance capabilities, including&nbsp;equipment&nbsp;health monitoring and predictive process performance. Automated response capabilities are enhanced, including predictive part replacement, preventive cleaning cycles, calibration scheduling, resource&nbsp;optimization&nbsp;and environmental adjustments such as gas delivery systems.&nbsp;Additional&nbsp;predictive capabilities include preventing unplanned downtime,&nbsp;optimizing&nbsp;future maintenance schedules, reducing future operational costs, extending equipment&nbsp;lifetimes&nbsp;and more.&nbsp;<\/p>\n\n\n\n<figure class=\"wp-block-image size-thumbnail\"><img loading=\"lazy\" decoding=\"async\" width=\"150\" height=\"150\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/402-Ai-Icons-v01_original-150x150.jpg\" alt=\"\" class=\"wp-image-2042\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/402-Ai-Icons-v01_original-150x150.jpg 150w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/402-Ai-Icons-v01_original-600x600.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/402-Ai-Icons-v01_original-768x768.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/402-Ai-Icons-v01_original-900x900.jpg 900w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/402-Ai-Icons-v01_original.jpg 1000w\" sizes=\"auto, (max-width: 150px) 100vw, 150px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>With the addition of AI, predictive maintenance is enhanced even further<\/strong>&nbsp;<\/h2>\n\n\n\n<p>Additional AI capabilities include pattern recognition and anomaly detection,&nbsp;identifying&nbsp;equipment behavior changes, detecting emerging failure patterns, performing root-cause analysis, making risk assessments and preventive action recommendations.&nbsp;<\/p>\n\n\n\n<p>When combined, the capabilities of the digital twin and AI built on a foundation of smart manufacturing and automation,&nbsp;enable&nbsp;semiconductor manufacturers to plan and execute a sustainable business strategy, from design to production to finished chip.&nbsp;<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Sustainability KPIs help manage progress<\/strong>&nbsp;<\/h2>\n\n\n\n<p>Designing for sustainability begins with the commitment to reduce the carbon footprint, while establishing key performance indicators (KPIs) to measure sustainability progress and guide the process.<\/p>\n\n\n\n<p>With digital tools such as the Siemens\u2019 SIMATIC Energy Suite, engineering managers can establish MES KPIs in energy monitoring and management, power usage patterns analysis, peak demand management, energy cost allocation, resource utilization metrics, energy per wafer metrics, carbon footprint tracking, load balancing capabilities, cost reduction opportunities and more, while tracking sustainability goal progress.&nbsp;<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p><strong>\u201cBy establishing the relevant sustainability key performance indicators early, a business can properly monitor impact and costs in the design process and eventually across the entire value chain.\u201d<\/strong>&nbsp;<\/p>\n\n\n\n<p>\u2014 Eryn Devola,&nbsp;Vice President, Sustainability, Siemens Digital Industries Software&nbsp;<\/p>\n<\/blockquote>\n\n\n\n<p>Next week, we will discuss&nbsp;the&nbsp;Siemens Facility Monitoring and Control System (FMCS)&nbsp;and how it equips fabs to&nbsp;streamline workflows, enhance quality control,&nbsp;optimize&nbsp;resource&nbsp;and plant&nbsp;efficiency&nbsp;and boost throughput.&nbsp;<\/p>\n\n\n\n<p>Or if&nbsp;you\u2019d&nbsp;like to discover more about this topic right now, just&nbsp;<a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Siemens-SW-Using-integrated-software-and-automation-EB-86851-D6-1.pdf\" target=\"_blank\" rel=\"noreferrer noopener\">download<\/a>&nbsp;our new eBook below, \u201cUsing integrated software and automation to transform fab sustainability.\u201d&nbsp;<\/p>\n\n\n\n<div data-wp-interactive=\"core\/file\" class=\"wp-block-file\"><object data-wp-bind--hidden=\"!state.hasPdfPreview\" hidden class=\"wp-block-file__embed\" data=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Siemens-SW-Using-integrated-software-and-automation-EB-86851-D6-1.pdf\" type=\"application\/pdf\" style=\"width:100%;height:600px\" aria-label=\"Embed of Siemens-SW-Using-integrated-software-and-automation-EB-86851-D6 1.\"><\/object><a id=\"wp-block-file--media-f57c9a10-621a-4aff-97a0-2ae33fcac7cf\" href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Siemens-SW-Using-integrated-software-and-automation-EB-86851-D6-1.pdf\">Siemens-SW-Using-integrated-software-and-automation-EB-86851-D6 1<\/a><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/Siemens-SW-Using-integrated-software-and-automation-EB-86851-D6-1.pdf\" class=\"wp-block-file__button wp-element-button\" download aria-describedby=\"wp-block-file--media-f57c9a10-621a-4aff-97a0-2ae33fcac7cf\">Download<\/a><\/div>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>(Part 3 of 5): The\u00a0semiconductor fab\u00a0is\u00a0a complex challenge\u2014how do you know where your\u00a0sustainability\u00a0journey should begin?\u00a0<\/p>\n","protected":false},"author":12405,"featured_media":2056,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[613,1,8],"tags":[322,597],"industry":[257,260],"product":[197,523],"coauthors":[652,333],"class_list":["post-2035","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-semiconductors","category-news","category-product-updates","tag-semiconductor","tag-sustainability","industry-electronics-semiconductors","industry-semiconductor-devices","product-teamcenter","product-teamcenter-x"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/11\/graphic_86306-D2-1-scaled.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/2035","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/12405"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=2035"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/2035\/revisions"}],"predecessor-version":[{"id":2064,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/2035\/revisions\/2064"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/2056"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=2035"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=2035"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=2035"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=2035"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=2035"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=2035"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}