{"id":1758,"date":"2025-04-30T15:08:29","date_gmt":"2025-04-30T19:08:29","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=1758"},"modified":"2026-03-26T14:41:48","modified_gmt":"2026-03-26T18:41:48","slug":"reducing-npi-cycle-time-with-real-time-manufacturing-data","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2025\/04\/30\/reducing-npi-cycle-time-with-real-time-manufacturing-data\/","title":{"rendered":"Reducing NPI Cycle Time with Real-Time Manufacturing Data\u00a0"},"content":{"rendered":"\n<p>In the fast-paced world of electronics, increasing business productivity and eliminating lengthy, large manual processes are top of mind. Manufacturers are looking for products and solutions rooted in precision, innovation, quality, and efficiency. This allows companies to be best equipped to navigate complex development processes, high costs, and demanding technological specifications to bring their products to market quickly. Global competition is only growing, which is why component and equipment manufacturers need the right digital tools to help <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-managing-new-product-introduction\/\" target=\"_blank\" rel=\"noreferrer noopener\">manage the NPI process<\/a> with ease.\u00a0<\/p>\n\n\n\n<p><strong>Companies are achieving better performance outcomes in the manufacturing process<\/strong>.<\/p>\n\n\n\n<p>In today&#8217;s rapidly evolving landscape, electronics companies are rethinking their product development workflows and partnerships to stay competitive. Companies like <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/case-study-teradyne-teamcenter\/\" target=\"_blank\" rel=\"noreferrer noopener\">Teradyne &#8211; the U.S.$1.2 billion a year maker of automatic test equipment<\/a> \u2013 saw major increases in manufacturing efficiency and cost reductions when implementing Siemens Digital Industries Software\u2019s Teamcenter\u00ae software. Inefficiencies were placing a toll on the company\u2019s performance but together with Siemens, they looked at how they were handling product lifecycle management to solve their process and application problems.&nbsp;<\/p>\n\n\n\n<p>Teradyne saw drastic improvements in requirements management, documentation and an integrated process for engineering change and bills of materials management. As a result of the changes implemented, the company saw a 60% cost reduction and $2 million improved productivity savings annually.\u00a0\u00a0<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p><em>\u201cWe\u2019re not just meeting our promised delivery dates \u2013 we\u2019re beating them.\u201d<\/em>\u00a0<\/p>\n<cite><strong>Bill Duggan, Engineering Manager, Teradyne<\/strong>\u00a0<\/cite><\/blockquote>\n\n\n\n<p>A leading innovator in automation, Festo, also partnered with Siemens to achieve double the proportion of projects in target costing because of the standardized export and reporting capabilities of Teamcenter.\u00a0<\/p>\n\n\n\n<div class=\"wp-block-buttons alignwide is-content-justification-center is-layout-flex wp-container-core-buttons-is-layout-d9cd0f1e wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/resources.sw.siemens.com\/en-US\/case-study-phuntronix-and-valor\/\" target=\"_blank\" rel=\"noopener\"><strong>Download case study<\/strong>\u00a0<\/a><\/div>\n<\/div>\n\n\n\n<p><strong>How to leverage digital solutions to integrate intelligent production systems and track production in real-time.<\/strong>\u00a0<\/p>\n\n\n\n<p>Now more than ever, companies are investing in digital manufacturing technologies that provide real-time access to production data. This allows companies to identify and resolve issues faster, ultimately accelerating their new product introduction process.&nbsp;&nbsp;<\/p>\n\n\n\n<p>New product introduction (NPI) software can help digitalize processes to improve collaboration and accelerate time to market. Siemens NPI manufacturing tools can help you deliver new products on time, by:&nbsp;<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Connecting upstream and downstream disciplines&nbsp;<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Using a digital twin to deliver a 3D component model&nbsp;<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Integrating engineering tools and dynamically update assets&nbsp;<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Working with a single model-based system to capture products and processes\u00a0<\/li>\n<\/ul>\n\n\n\n<p><strong>Deliver high-quality products quickly and efficiently<\/strong>.<\/p>\n\n\n\n<p>New product introduction software can digitalize processes to improve collaboration and accelerate time to market. However, first you must make your factory &#8220;smart&#8221; so that it operates as efficiently as possible with leaner operations for more sustainable use of your resources and more predictable inventory needs. You can achieve efficient \u201csmart manufacturing\u201d through better integration of planning and production for the development of new manufacturing processes that make products in multiple factories around the globe, using both manual and automated assembly processes.\u00a0\u00a0\u00a0<\/p>\n\n\n\n<p><strong>The time to react and reimagine smart manufacturing is now<\/strong>.<\/p>\n\n\n\n<p>Siemens uniquely provides solutions for your entire manufacturing ecosystem. With it you can create a closed-loop production system from design to new product introduction to process planning to mass production. By connecting the entire manufacturing value chain, smart manufacturing solutions help you build better products faster.&nbsp;&nbsp;<\/p>\n\n\n\n<p><a href=\"https:\/\/www.sw.siemens.com\/en-US\/digital-thread\/smart-manufacturing\/electronics-manufacturing\/#1drHhSaJqkep8Xev8dzbYX\" target=\"_blank\" rel=\"noreferrer noopener\">Explore how you can accelerate electronics manufacturing<\/a> to maintain competitiveness in the industry. Siemens integrated solutions are here to help you imagine more.&nbsp;&nbsp;<\/p>\n\n\n\n<p>Take the next step. <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-how-to-achieve-new-product-development-quality-improvement\/\" target=\"_blank\" rel=\"noreferrer noopener\">Download our eBook<\/a> and begin learning to integrate quality management practices to achieve quality excellence with new product introductions&nbsp;<\/p>\n\n\n\n<p>\u00a0<\/p>\n","protected":false},"excerpt":{"rendered":"<p>In the fast-paced world of electronics, increasing business productivity and eliminating lengthy, large manual processes are top of mind. Manufacturers&#8230;<\/p>\n","protected":false},"author":100507,"featured_media":1759,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[629,6,1],"tags":[294,366,380,322,663,664],"industry":[257,605],"product":[],"coauthors":[],"class_list":["post-1758","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog-series","category-featured","category-news","tag-digitalization","tag-electronics-manufacturing","tag-npi","tag-semiconductor","tag-semiconductor-lifecycle","tag-semiconductor-lifecyle-management","industry-electronics-semiconductors","industry-electronics-semiconductors-electronics-semiconductors"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2025\/04\/Semi-shutterstock-2345860421-close-up-chip_original-scaled.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1758","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/100507"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=1758"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1758\/revisions"}],"predecessor-version":[{"id":1760,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1758\/revisions\/1760"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/1759"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=1758"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=1758"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=1758"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=1758"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=1758"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=1758"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}