{"id":1576,"date":"2024-10-08T16:41:56","date_gmt":"2024-10-08T20:41:56","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=1576"},"modified":"2026-05-08T12:56:49","modified_gmt":"2026-05-08T16:56:49","slug":"harness-digital-transformation-to-collaborate-seamlessly-across-platforms","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2024\/10\/08\/harness-digital-transformation-to-collaborate-seamlessly-across-platforms\/","title":{"rendered":"Harness digital transformation to collaborate seamlessly across platforms"},"content":{"rendered":"\n

Craig Armenti<\/a> – Director of Electronics Solutions@Siemens Digital Industries Software | Electronics | Digital Twins | PLM | NPI | Supply Chain | Sustainability and Compliance\u00a0<\/p>\n\n\n\n

Post 1 of a 3-Part Series<\/em>.<\/p>\n\n\n\n

Today\u2019s rapidly evolving global electronics market gets more demanding every business day. Customer demand for complex electronic products with more features, functionality, and options is surging. At the same time, customers expect these exciting enhancements to be widely available and easily affordable. <\/p>\n\n\n\n

Manufacturers are increasingly challenged to develop and deliver today\u2019s complex products using outdated tools and systems. To create the next generation of electronics, they need greater collaboration and innovation across their design and engineering teams\u2014something legacy solutions simply can’t provide. Unfortunately, many legacy systems still in use today are fragmented, operating in silos without a unified data platform or a shared language across systems. This severely limits the collaboration needed to drive the development of next-generation electronics<\/a>. It\u2019s clear that a new approach is essential\u2014one that fosters seamless collaboration, enables continuous innovation and accelerates development cycles to meet the demands of the modern electronics market. <\/p>\n\n\n\n

Digital transformation connects and empowers design and engineering teams<\/strong> <\/h2>\n\n\n\n

The key is digital transformation<\/a> \u2013 providing accelerated access to project, product, and process data \u2013 including change management \u2013 which allows all the teams in your organization to collaborate earlier to make quicker data-driven decisions to go to market faster.  <\/p>\n\n\n\n

Fortunately, modern Lifecycle Management (PLM) software<\/a> can provide the end-to-end digitalization needed, with a digital thread backbone connecting applications, people, and processes throughout the product lifecycle. <\/p>\n\n\n\n

In the fast-paced world of consumer and industrial electronics, how you manage your product\u2019s data, programs, requirements, and quality makes all the difference. When these priorities are not managed effectively, they impact your team and competitiveness. It means delays in getting products out the door, higher costs, or customers losing trust, all of which signal the need for change. <\/p>\n\n\n\n

Seamless collaboration doesn\u2019t just happen \u2013 it must be designed into the process<\/strong> <\/h2>\n\n\n\n

During the New Product Introduction Process (NPI)<\/a>, as data flows downstream for manufacturing, supply chain planning, compliance, and costing become more complex. As products become increasingly complex, collaboration across various engineering teams\u2014mechanical, electronics, electrical, packaging, and software\u2014must be seamless so that innovation can be continuous. <\/p>\n\n\n\n

Some popular software solutions offer helpful features, but collectively, they don\u2019t solve the big challenge of integrated collaboration. Social collaboration platforms like Slack and Webex help facilitate part of the solution with cross-team communication but fall short of a total solution. Similarly, popular office products such as Microsoft Office & Google Docs provide real-time collaboration for documents but don\u2019t go far enough to empower the whole team to work better together.  <\/p>\n\n\n\n

Fortunately for OEMs, Siemens Xcelerator<\/a> offers a new level of seamless collaboration for the entire team with interoperable tools to accelerate innovation throughout NPI programs. Siemens Xcelerator offers PLM software that provides a specialized, integrated approach for managing the complexities of product development. It ensures that all data, processes, and teams involved in electronics development will stay aligned as the product is developed. <\/p>\n\n\n\n

Seamless collaboration is now an imperative for business essentials:<\/strong> <\/h2>\n\n\n\n

\u2022 Product roadmaps, programs and schedules to align strategic goals, user requests, work in progress and resource optimization.<\/p>\n\n\n\n

\u2022 Product and process data management \u2013 managing design, engineering, manufacturing, service, and planning bill of materials (BOM)<\/a>.<\/p>\n\n\n\n

\u2022 Change Management processes \u2013 initiating, tracking, and managing change. This includes critical communication with downstream applications and contract manufacturers about BOM changes during NPI.<\/p>\n\n\n\n

\u2022 Requirements and verification management \u2013 start compliant and stay compliant. By integrating requirements and verification management, you can build confidence in every aspect of your final product, ensuring unmatched quality, traceability, and compliance. <\/p>\n\n\n\n

When you combine all these advantages in a single collaborative product lifecycle management solution, with all product and process data; you’re not just managing, you\u2019re orchestrating a seamless, customer-centric journey from concept to market.  <\/p>\n\n\n\n

It’s a win-win. For seamless collaboration. And new product success. <\/p>\n\n\n\n

To <\/strong>learn <\/strong>more about digitally transforming your business, I in<\/span>vite you to view our webinar – Digital Transformation\u2014Don’t Just Replace\u2014Dramatically Improve!<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Electronics industry expert Mandar Lele shares how to harness digital transformation to collaborate seamlessly across digital platforms & accelerate development<\/p>\n","protected":false},"author":70655,"featured_media":1579,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[629,6,1],"tags":[292,366,309],"industry":[259,257],"product":[22,197],"coauthors":[342],"class_list":["post-1576","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog-series","category-featured","category-news","tag-digital-transformation","tag-electronics-manufacturing","tag-product-lifecycle-management","industry-electronic-manufacturing-services","industry-electronics-semiconductors","product-bom-tools","product-teamcenter"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/10\/1709654460814.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1576","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/70655"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=1576"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1576\/revisions"}],"predecessor-version":[{"id":2300,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1576\/revisions\/2300"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/1579"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=1576"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=1576"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=1576"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=1576"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=1576"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=1576"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}