{"id":1253,"date":"2024-04-22T01:34:43","date_gmt":"2024-04-22T05:34:43","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/?p=1253"},"modified":"2026-03-26T14:41:16","modified_gmt":"2026-03-26T18:41:16","slug":"bom-management","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/2024\/04\/22\/bom-management\/","title":{"rendered":"Streamlining BOM management and product configuration in the cloud"},"content":{"rendered":"\n<figure class=\"wp-block-image size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"683\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-1024x683.jpg\" alt=\"\" class=\"wp-image-1256\" style=\"width:840px;height:auto\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-1024x683.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-600x400.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-768x512.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-1536x1025.jpg 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-2048x1366.jpg 2048w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/karlsruhe-factory-1365810648_original-900x600.jpg 900w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p>The world of electronics product development is evolving at a rapid pace. As products become more complex and teams become more distributed, effective collaboration and data management are more critical than ever. Traditional methods of managing the bill of materials (BOM) and product configurations are no longer sufficient to keep up with the demands of today&#8217;s market.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">PLM of the future: Webinar<\/h2>\n\n\n\n<p>In our recent PLM of the Future webinar, we explored how cloud-based software-as-a-service (SaaS) solutions can help electronics companies overcome the challenges of engineer-to-order and configure-to-order product development. By leveraging the power of the cloud, these solutions provide a single source of truth for product data, enabling teams to work more efficiently and effectively.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">BOM management in the cloud<\/h2>\n\n\n\n<p>One of the key topics covered in the webinar was BOM management. The <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-how-to-create-and-manage-an-accurate-bill-of-materials\" data-type=\"link\" data-id=\"https:\/\/resources.sw.siemens.com\/en-US\/e-book-how-to-create-and-manage-an-accurate-bill-of-materials\" target=\"_blank\" rel=\"noopener\">BOM is a critical deliverable that is used by multiple departments <\/a>throughout the product development process, from engineering to manufacturing to procurement. However, managing the BOM can be a complex and time-consuming task, particularly when dealing with product variations and frequent changes.<\/p>\n\n\n\n<p>Cloud-based PLM solutions like <a href=\"https:\/\/plm.sw.siemens.com\/it-IT\/teamcenter\/teamcenter-x-cloud-plm\/\" data-type=\"link\" data-id=\"https:\/\/plm.sw.siemens.com\/it-IT\/teamcenter\/teamcenter-x-cloud-plm\/\" target=\"_blank\" rel=\"noopener\">Teamcenter <\/a><a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/products\/teamcenter\/teamcenter-x.html\" target=\"_blank\" rel=\"noopener\">X<\/a> offer a streamlined approach to BOM management:<\/p>\n\n\n\n<div class=\"wp-block-media-text is-stacked-on-mobile\"><figure class=\"wp-block-media-text__media\"><img loading=\"lazy\" decoding=\"async\" width=\"598\" height=\"405\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/BOM.png\" alt=\"\" class=\"wp-image-1257 size-full\"\/><\/figure><div class=\"wp-block-media-text__content\">\n<ul class=\"wp-block-list\">\n<li>Automatically generate the BOM based on CAD models<\/li>\n\n\n\n<li>Provide a centralized repository for all product data<\/li>\n\n\n\n<li>Ensure everyone is working from the most up-to-date and accurate information<\/li>\n\n\n\n<li>Reduce the risk of errors and delays<\/li>\n\n\n\n<li>Enable teams to respond more quickly to changes and new requirements<\/li>\n<\/ul>\n<\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Product configuration in the cloud<\/h2>\n\n\n\n<p>Another key topic covered in the webinar is product configuration. In today&#8217;s market, customers expect products tailored to their needs and preferences. This requires a flexible and efficient approach to product configuration that can handle various options and variations.<\/p>\n\n\n\n<p>Our solutions provide a powerful toolset for managing product configurations in the cloud:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Easily define and manage complex product rules and constraints<\/li>\n\n\n\n<li>Ensure every configuration is valid and meets customer requirements<\/li>\n\n\n\n<li>Streamline the sales process<\/li>\n\n\n\n<li>Reduce the risk of errors and rework in downstream processes<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">The perfect balance<\/h2>\n\n\n\n<p>By <a href=\"https:\/\/www.siemens.com\/global\/en\/products\/drives\/selection-and-engineering-tools\/siemens-product-configurator.html\" data-type=\"link\" data-id=\"https:\/\/www.siemens.com\/global\/en\/products\/drives\/selection-and-engineering-tools\/siemens-product-configurator.html\" target=\"_blank\" rel=\"noopener\">combining BOM management and product configuration <\/a>in a single, cloud-based platform, electronics companies can achieve new levels of efficiency and agility. Teams can collaborate more effectively, respond quickly to changing requirements, and deliver high-quality products that meet customer needs.<\/p>\n\n\n\n<p>We&#8217;re committed to helping electronics companies navigate the challenges of today&#8217;s market and stay ahead of the competition. Our cloud-based PLM solutions provide a proven foundation for streamlining product development processes and driving innovation. <\/p>\n","protected":false},"excerpt":{"rendered":"<p>The world of electronics product development is evolving at a rapid pace. As products become more complex and teams become&#8230;<\/p>\n","protected":false},"author":95107,"featured_media":1257,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"true","italian_translation":"","polish_translation":"","japanese_translation":"true","chinese_translation":"true","footnotes":""},"categories":[12,612,1,8,613],"tags":[625,626,364,322],"industry":[257],"product":[197,523],"coauthors":[606],"class_list":["post-1253","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-webinar","category-electronics","category-news","category-product-updates","category-semiconductors","tag-bom","tag-bom-management","tag-electronics","tag-semiconductor","industry-electronics-semiconductors","product-teamcenter","product-teamcenter-x"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/25\/2024\/04\/BOM.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1253","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/users\/95107"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/comments?post=1253"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1253\/revisions"}],"predecessor-version":[{"id":1263,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/posts\/1253\/revisions\/1263"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media\/1257"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/media?parent=1253"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/categories?post=1253"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/tags?post=1253"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/industry?post=1253"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/product?post=1253"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronics-semiconductors\/wp-json\/wp\/v2\/coauthors?post=1253"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}