{"id":9224,"date":"2022-08-30T16:59:25","date_gmt":"2022-08-30T20:59:25","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/xpedition\/?p=1839"},"modified":"2026-03-27T09:37:05","modified_gmt":"2026-03-27T13:37:05","slug":"check-out-the-new-pcb-track-at-iesf-2022","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2022\/08\/30\/check-out-the-new-pcb-track-at-iesf-2022\/","title":{"rendered":"Check out the new PCB track at IESF 2022"},"content":{"rendered":"\n<p><\/p>\n\n\n\n<p>IESF Automotive is organized by Siemens Digital Industries Software and has been a must-attend event for automotive E\/E design professionals and executives for over 20 years. New this year is a PCB Systems Design Track, where attendees can consume PCB design related content.<\/p>\n\n\n\n<p>This new track is made up of the following presentations:<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\"><div class=\"wp-block-image\">\n<figure class=\"alignleft size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"232\" height=\"232\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2022\/08\/ismael-1.png\" alt=\"Ismael Rex\" class=\"wp-image-1841\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/ismael-1.png 232w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/ismael-1-150x150.png 150w\" sizes=\"auto, (max-width: 232px) 100vw, 232px\" \/><\/figure><\/div>\n\n<div class=\"wp-block-image\">\n<figure class=\"alignleft size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2022\/08\/bhavin.png\" alt=\"Bhavin Naik\" class=\"wp-image-1842\" width=\"226\" height=\"227\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/bhavin.png 240w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/bhavin-150x150.png 150w\" sizes=\"auto, (max-width: 226px) 100vw, 226px\" \/><\/figure><\/div>\n\n\n<p><strong>Developing a Digital Thread Between EDA and PLM at Nexteer<\/strong><br>12:30pm \u2013 1:00pm EDT<br><br>Ismael Rex | Senior Engineering Supervisor | Nexteer<br>Bhavin Naik | Applications Engineer | Siemens<br><br>Nexteer delivers electric and hydraulic power steering systems, steering columns, driveline systems, advanced driver assistance systems (ADAS), and automated driving enabling technologies for original equipment manufacturers (OEMs). Nexteer has embarked on deploying a full ECAD flow with Xpedition Enterprise and HyperLynx analysis and have connected these applications with their Teamcenter environment. In this presentation, we will look at how Nexteer migrated from Cadence Orcad flow to Xpedition and how they started utilizing the shift-left methodology to reduce design re-spins by performing analysis with HyperLynx suite of tools while connecting Xpedition to their Teamcenter infrastructure.<\/p>\n<\/div>\n<\/div>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n<\/div>\n<\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\"><div class=\"wp-block-image\">\n<figure class=\"alignleft size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2022\/08\/Eric.png\" alt=\"Eric Wines \" class=\"wp-image-1876\" width=\"222\" height=\"221\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/Eric.png 244w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/Eric-150x150.png 150w\" sizes=\"auto, (max-width: 222px) 100vw, 222px\" \/><\/figure><\/div>\n\n\n<p><strong>Migrating from PADS Standard to Xpedition<\/strong><br>1:00pm \u2013 1:30pm EDT<br><br>Eric Wines |&nbsp; PLM Architect | Stoneridge<br><br>Designing complex electronics in a global company can be challenging in today\u2019s environment.&nbsp; Looking for a global, integrated, and enterprise solution, Stoneridge has migrated from PADS to Xpedition.&nbsp;&nbsp; Eric will discuss the benefits of Xpedition and past challenges such as integrating global libraries and growth through acquisitions.<\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n<\/div>\n<\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\"><div class=\"wp-block-image\">\n<figure class=\"alignleft size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2022\/08\/rob.png\" alt=\"Rob Blakeslee \" class=\"wp-image-1877\" width=\"224\" height=\"230\" \/><\/figure><\/div>\n\n\n<p><strong>Using Xpedition\u2019s 3D Layout to Develop Complex Designs<\/strong><br>1:30pm \u2013 2:00pm EDT<br>Rob Blakeslee | Application Engineering Consultant | Siemens<br>Today\u2019s PCB designs require complex analysis as PCB layouts are assembled into systems or folded into small enclosures.&nbsp; Without the proper tools, PCB designers may be unaware of potential interference issues.&nbsp; Xpedition allows PCB designers to visualize and edit designs in 3D, and validate designs as if they were already manufactured. Xpedition also enables the identification of electro-mechanical problems early in the design cycle to avoid costly re-designs.&nbsp; Rob will cover how Xpedition addresses your complex design concerns to validate your PCB layout before it is manufactured and assembled.<\/p>\n<\/div>\n<\/div>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\" \/>\n\n\n\n<p>In addition, as a part of the Vehicle Electrification &amp; Autonomous Drive Track, Kevin Rinebold will be presenting: <strong>Heterogeneous Integration of Semiconductors for Autonomous Driving, Electric Vehicle, and ADAS Systems. <a href=\"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/2022\/08\/18\/learn-about-heterogeneous-integration-of-semiconductors-for-autonomous-driving-electric-vehicle-and-adas-systems-at-the-iesf-2022-automotive-conference\/\">Check out this blog post to learn more about this session.<\/a><\/strong><\/p>\n\n\n\n<p><a href=\"https:\/\/event.sw.siemens.com\/iesf-americas-2022\/page\/2174367\/registration\" target=\"_blank\" rel=\"noopener\">Register now<\/a> to attend these presentations and many more!<\/p>\n","protected":false},"excerpt":{"rendered":"<p>IESF Automotive is organized by Siemens Digital Industries Software and has been a must-attend event for automotive E\/E design professionals&#8230;<\/p>\n","protected":false},"author":86290,"featured_media":1844,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[10],"tags":[1063,112,160],"industry":[],"product":[984],"coauthors":[488],"class_list":["post-9224","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","tag-hyperlynx","tag-pcb","tag-xpedition","product-xpedition-enterprise"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/08\/IESF2022-september.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/9224","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/86290"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=9224"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/9224\/revisions"}],"predecessor-version":[{"id":10879,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/9224\/revisions\/10879"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media\/1844"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=9224"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=9224"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=9224"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=9224"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=9224"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=9224"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}