{"id":657,"date":"2017-05-26T05:52:07","date_gmt":"2017-05-26T12:52:07","guid":{"rendered":"https:\/\/blogs.mentor.com\/xpedition\/?p=657"},"modified":"2026-03-27T09:27:41","modified_gmt":"2026-03-27T13:27:41","slug":"going-to-dac2017-in-austin-tx-interested-in-high-density-advanced-packaging-then-read-on","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2017\/05\/26\/going-to-dac2017-in-austin-tx-interested-in-high-density-advanced-packaging-then-read-on\/","title":{"rendered":"Going to DAC\u20192017 in Austin TX? Interested in High Density Advanced Packaging? then read on!!"},"content":{"rendered":"<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2017\/05\/Package_Designer_honeycomb_NEW.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-658\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2017\/05\/Package_Designer_honeycomb_NEW-520x407.png\" alt=\"\" width=\"520\" height=\"407\" \/><\/a><\/p>\n<p>If you\u2019re coming or planning on coming to DAC this June and interested in HDAP such as FO-WLP then you need to join us on Thursday for an exciting seminar.<\/p>\n<p>On Thursday 22nd June Mentor will be hosting a half-day morning seminar focused on HDAP with specific focus on FO-WLP.\u00a0Join us and listen to two informative industry guest speakers, hear from Mentor on its latest technologies and solutions for FO-WLP and HDAP and see live technology demonstrations.<\/p>\n<p>Interested, sign-up here as seats are limited and going fast.\u00a0We even provide a nice lunch to round off the event!!<\/p>\n<p><a href=\"http:\/\/go.mentor.com\/4SQxm?cmpid=9050\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">http:\/\/go.mentor.com\/4SQxm<\/a><\/p>\n<p>We look forward to seeing and talking with you!!<\/p>\n","protected":false},"excerpt":{"rendered":"<p>If you\u2019re coming or planning on coming to DAC this June and interested in HDAP such as FO-WLP then you&#8230;<\/p>\n","protected":false},"author":71666,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[1386,1387,1393,1397,1398,1406,160],"industry":[],"product":[],"coauthors":[],"class_list":["post-657","post","type-post","status-publish","format-standard","hentry","category-news","tag-amkor","tag-calibre","tag-hdap","tag-osat","tag-packaging","tag-tsmc","tag-xpedition"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/657","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71666"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=657"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/657\/revisions"}],"predecessor-version":[{"id":10582,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/657\/revisions\/10582"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=657"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=657"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=657"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=657"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=657"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=657"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}