{"id":6350,"date":"2019-05-08T05:04:40","date_gmt":"2019-05-08T12:04:40","guid":{"rendered":"https:\/\/blogs.mentor.com\/jimmartens\/?p=6350"},"modified":"2026-03-27T09:32:41","modified_gmt":"2026-03-27T13:32:41","slug":"the-necessity-and-benefits-of-mcad-collaboration-part-2","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2019\/05\/08\/the-necessity-and-benefits-of-mcad-collaboration-part-2\/","title":{"rendered":"The Necessity and Benefits of MCAD Collaboration \u2013 Part 2"},"content":{"rendered":"<p><u><br \/>\n<\/u><em>In the second of this two-part blog series, we\u2019ll talk about 3D placement and automated design rule checking.\u00a0 <\/em><em>To read part one, <a href=\"https:\/\/www.pads.com\/blog\/post\/the-necessity-and-benefits-of-mcad-collaboration-bfe298c1-29a8-43c8-ab23-0a4d0fdd4d9a?cmpid=9049\" target=\"_blank\" rel=\"noopener\"><strong>click here<\/strong><\/a>.<\/em><\/p>\n<p>&nbsp;<\/p>\n<p>One of the biggest advantages of ECAD\/MCAD collaboration is doing PCB placement in the 3D space.\u00a0 Rather than relying on the use of visual inspection, the tool can flag any component placement violations.\u00a0 This is accomplished by creating a set of three dimensional DRCs.\u00a0 These rules are created using the clearance icon on the 3D toolbar.\u00a0 These rules flag any violations that cause placement violations, in the 3D space, between components.<\/p>\n<p>In PADS Professional, it\u2019s possible to work concurrently in the 2D and 3D spaces.\u00a0 It can be difficult to place some components in the 3D environment (electrical components that are placed under heat sinks, or other mechanical structures, for example).\u00a0 Being able to place these parts in the 2D space while simultaneously viewing the results, including any DRC violations, in the 3D space is one of the very powerful capabilities of PADS Professional.<\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/55\/2019\/05\/PADS-Professional-The-Necessity-and-Benefits-of-MCAD-Collaboration-Image_4.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignright wp-image-6348\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/55\/2019\/05\/PADS-Professional-The-Necessity-and-Benefits-of-MCAD-Collaboration-Image_4-520x293.png\" alt=\"\" width=\"823\" height=\"464\" \/><\/a><\/p>\n<h5 style=\"text-align: center\"><em>A Dynamic 3D DRC Violation in PADS Professional<\/em><\/h5>\n<p>Once all components have been placed, a batch 3D analysis is performed to check for any violations in the design.\u00a0 Using the hazard explorer in PADS Professional, those violations can quickly be identified and corrected.\u00a0 Once the violations have been fixed, a design proposal can be exported to the collaboration folder.\u00a0 This is not a complete design file.\u00a0 It only contains the changes to the original file supplied by the mechanical engineer.\u00a0 Using the preview capability, the mechanical engineer can quickly review and accept, or reject, and propose changes.\u00a0 If any changes are rejected, a note can be attached and the file sent back to the PCB design engineer for further changes.<\/p>\n<p>Likewise, if the mechanical engineer makes any changes to their design, they can export a proposal to the collaboration folder and alert the electrical engineer of a pending change.\u00a0 The PCB design engineer can open the file and using the show physical change feature quickly see any changes made by the mechanical engineer.\u00a0 Once all proposals have been reviewed and accepted by both the PCB designer and mechanical engineers, the design can proceed to fabrication and assembly.<\/p>\n<p>Because both NX and PADS Professional support the IDX interchange format, it has been used in this example.\u00a0 Not all MCAD tools support the use of the IDX format.\u00a0 In such cases, PADS Professional also supports other outputs formats, such as STEP, IGES, SAT and PDF file formats.\u00a0 For MCAD tools that do not support the IDX or IDF formats, STEP is the best option for generating a realistic looking board model for visual inspection.\u00a0 The resulting STEP file is not an assembly, but one large solid model.\u00a0 So, changes cannot be made directly to the STEP file, but it can be used for visual inspection and documentation purposes.\u00a0 PADS Professional also supports the importation of STEP files for the creation of board outlines and mounting holes.<\/p>\n<p>&nbsp;<\/p>\n<p>For companies that do not have an MCAD tool, PADS Professional can export files in the PDF format.\u00a0 This is the easiest way to share data with anyone who does not have access to an MCAD tool and works quite well for viewing 3D data, including the ability to rotate an object within its 3D space.\u00a0 The use of PDF export from PADS Professional is an easy and convenient tool for generating product documentation and for sharing data with stake holders.<\/p>\n<p>Although these other formats are useful for those without an MCAD tool that supports the IDX format, the use of intelligent data allows an advanced MCAD tool like NX to provide advanced capabilities such as thermal analysis.<\/p>\n<p>Using the filtering capability of the MCAD collaboration dialogue within PADS Professional, the PCB design engineer can select which data is exported to the mechanical engineer.\u00a0 The mechanical engineer will import this data by selecting the import ECAD icon from the PCB exchange toolbar within NX.\u00a0 Once the electrical data has been imported the simulation environment can be set up from the PCB exchange toolbar.\u00a0 The mechanical designer can then go directly to SIM center and begin the thermal analysis of the design.<\/p>\n<p><u>Conclusion: The Benefits of ECAD\/MCAD Collaboration<\/u><\/p>\n<p>Collaboration between design disciplines is now mandatory to meet today\u2019s tight product design schedules. Visualizing and using the design content created by others within the product design team allows faster design times and provides the ability to make better decisions. Changing a design philosophy can be a challenge, however continuing to use obsolete tools and methods allows competitors to be first to market.<\/p>\n<p>&nbsp;<\/p>\n<p>Reasons to choose PADS Professional include:<\/p>\n<ul>\n<li>Use the ECAD\/MCAD collaboration available in PADS Professional to reduce design time<\/li>\n<li>Use 3D placement to eliminate costly design spins and mistakes<\/li>\n<li>Produce a higher quality product<\/li>\n<li>Explore new ideas resulting in a better product with more advanced features and capabilities<\/li>\n<\/ul>\n<p>PADS Professional offers powerful, easy to use ECAD\/MCAD collaboration features that allow electrical and mechanical engineering team to work together in a more efficient manner that results in getting better products to market faster.\u00a0 Engineers can seamlessly share data while working within their familiar tool environments.\u00a0 Costly design spins are eliminated by catching issues that slip past less efficient, traditional methods.\u00a0 Today\u2019s complex products are no longer just a PCB. They are complex electro-mechanical systems consisting of multiple PCBs, thermal solutions and mechanical enclosures.\u00a0 PADS Professional is a modern, collaborative tool to solve these complex design challenges.<\/p>\n<h2 style=\"text-align: center\"><strong>Watch what we&#8217;ve talked about in action! <\/strong><\/h2>\n<h2 style=\"text-align: center\"><strong>View the archived webinar now.<\/strong><\/h2>\n<h6 style=\"text-align: center\"><a href=\"https:\/\/www.pads.com\/multimedia\/electro-mechanical-co-design-for-competitive-advantage?cmpid=9049\" target=\"_blank\" rel=\"noopener\"><br \/>\n<img loading=\"lazy\" decoding=\"async\" class=\"wp-image-5963 aligncenter\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/55\/2019\/02\/click.jpg\" alt=\"\" width=\"186\" height=\"90\" \/><\/a><\/h6>\n","protected":false},"excerpt":{"rendered":"<p>In the second of this two-part blog series, we\u2019ll talk about 3D placement and automated design rule checking.\u00a0 To read&#8230;<\/p>\n","protected":false},"author":71648,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[60,87,112,113],"industry":[],"product":[],"coauthors":[],"class_list":["post-6350","post","type-post","status-publish","format-standard","hentry","category-news","tag-ecad","tag-mcad","tag-pcb","tag-pcb-design"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/6350","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71648"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=6350"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/6350\/revisions"}],"predecessor-version":[{"id":10726,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/6350\/revisions\/10726"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=6350"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=6350"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=6350"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=6350"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=6350"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=6350"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}