{"id":5669,"date":"2017-11-20T22:51:23","date_gmt":"2017-11-21T05:51:23","guid":{"rendered":"https:\/\/blogs.mentor.com\/jimmartens\/?p=5669"},"modified":"2026-03-27T09:29:03","modified_gmt":"2026-03-27T13:29:03","slug":"pcb-technology-leadership-award-winner-murrelektronic","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2017\/11\/20\/pcb-technology-leadership-award-winner-murrelektronic\/","title":{"rendered":"PCB Technology Leadership Award Winner: Murrelektronic"},"content":{"rendered":"<p>Congratulations to <a href=\"https:\/\/www.murrelektronik.com\/\" target=\"_blank\" rel=\"noopener\">Murrelektronik<\/a> in Germany and the design team of Matthias Haak and Simon De Serra for their winning design in this year\u2019s Technology Leadership Awards. Using the PADS Product Creation Platform, their safety I\/O module for industrial automation was runner-up in the <a href=\"https:\/\/www.mentor.com\/pcb\/tla\/?cmpid=9049\" target=\"_blank\" rel=\"noopener\">Industrial Control, Instrumentation, and Medical category<\/a>.<\/p>\n<p>The design had significant challenges, including SI, fabrication, reliability, and cost. In particular, the judges noted the very dense placement of the board, with the power components distributed to facilitate better heat dissipation across the design. The use of a sequential stack-up with HDI further minimized the stress of thermal variations, thus improving board reliability. The mechanical restrictions of a fixed form factor also put an emphasis on thermal and EMC design and made integration and communication with MCAD critical.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-medium wp-image-5670\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/55\/2017\/11\/Blog-TLA-PADS-2-520x170.png\" alt=\"\" width=\"520\" height=\"170\" \/><\/p>\n<p>Congratulations to Murrelektronik and all the engineers and designers involved!<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Congratulations to Murrelektronik in Germany and the design team of Matthias Haak and Simon De Serra for their winning design&#8230;<\/p>\n","protected":false},"author":16541,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-5669","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/5669","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/16541"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=5669"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/5669\/revisions"}],"predecessor-version":[{"id":10622,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/5669\/revisions\/10622"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=5669"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=5669"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=5669"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=5669"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=5669"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=5669"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}