{"id":425,"date":"2015-04-07T12:50:31","date_gmt":"2015-04-07T19:50:31","guid":{"rendered":"https:\/\/blogs.mentor.com\/xpedition\/?p=425"},"modified":"2026-03-27T09:23:49","modified_gmt":"2026-03-27T13:23:49","slug":"behind-the-design-valtronic-sa","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2015\/04\/07\/behind-the-design-valtronic-sa\/","title":{"rendered":"Behind the Design: Valtronic SA"},"content":{"rendered":"<p>This is the seventh post in a series showcasing the winners of the 2014 Technology Leadership Awards. <a href=\"http:\/\/www.mentor.com\/pcb\/blog?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">View the previous ones here.<\/a><\/p>\n<p><strong>Runner up in the Industrial Control, Instrumentation &amp; Medical category: Valtronic SA, Switzerland<\/strong><\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/04\/Valtronic-Logo.png\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-full wp-image-426\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/04\/Valtronic-Logo.png\" alt=\"Valtronic Logo\" width=\"290\" height=\"40\" \/><\/a><\/p>\n<p><strong>Design:<\/strong> Ultimate 8 channels miniaturized MRI integrated receiver module with lots of channel separation<\/p>\n<p><strong>Design team:<\/strong> Gabriel Gay, Van Ly Mai, Cristian Anton, Bert de Vries<\/p>\n<p><strong>Design challenges:<\/strong><\/p>\n<ul>\n<li>All components had to be non-magnetic or low magnetic.<\/li>\n<li>Miniaturization drove use of ~500 passive SMD 01005. All (9) layers are HDI.<\/li>\n<li>5mm BGA (2 components): Careful placement of the decoupling capacitors, and management of analog\/digital signal separation.<\/li>\n<li>Used flip chip mounting to minimize connections from the chip to the board; placed all on one side for manufacturing reasons, but this required localized shielding.<\/li>\n<\/ul>\n<p><strong>Design tools and team comments:<\/strong><\/p>\n<ul>\n<li>Xpedition\u00ae Enterprise<\/li>\n<li>\u201cThe 3D viewer was utilized and later in the design .idf export and .dxf import were a must to make iterations to reduce the final size of the package.\u201d<\/li>\n<li>\u201cClusters were used to simplify the placement process. &#8220;Copy circuit&#8221; is a must to make sure we had similar placement and routing for each of the receiver channels.\u201d<\/li>\n<li>\u201cCES was especially useful to control the differential pairs.\u201d<\/li>\n<li>\u201cWe exported CCZ files to share the layout for design review with our customer. We also used DxPDF to share valuable data for design review and Part Lister to review BOMs.\u201d<\/li>\n<li>We utilized smart utilities, dynamic tune, and outline optimizer along with other capabilities.<\/li>\n<\/ul>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/04\/Valtronic-Award-Winning-PCB-Design.png\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-medium wp-image-427\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/04\/Valtronic-Award-Winning-PCB-Design-520x254.png\" alt=\"Valtronic Award Winning PCB Design\" width=\"520\" height=\"254\" \/><\/a><\/p>\n<p>&nbsp;<\/p>\n<p><strong>Judge\u2019s comments:<\/strong><\/p>\n<ul>\n<li>\u201cThis was a well-documented and excellent solution.\u201d<\/li>\n<li>\u201cGood EMI\/EMC considerations were given.\u201d<\/li>\n<\/ul>\n<p><strong>About the Technology Leadership Awards<\/strong><\/p>\n<p>Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today\u2019s complex PCB systems design challenges and produce industry-leading products. See the <a href=\"http:\/\/www.mentor.com\/pcb\/tla\/previous-winners?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">full list of 2014 winners here<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>This is the seventh post in a series showcasing the winners of the 2014 Technology Leadership Awards. View the previous&#8230;<\/p>\n","protected":false},"author":71680,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-425","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/425","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71680"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=425"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/425\/revisions"}],"predecessor-version":[{"id":10471,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/425\/revisions\/10471"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=425"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=425"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=425"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=425"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=425"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=425"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}