{"id":398,"date":"2015-02-03T17:41:22","date_gmt":"2015-02-04T00:41:22","guid":{"rendered":"https:\/\/blogs.mentor.com\/xpedition\/?p=398"},"modified":"2026-03-27T09:23:33","modified_gmt":"2026-03-27T13:23:33","slug":"behind-the-design-wizlogix-pte-ltd","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2015\/02\/03\/behind-the-design-wizlogix-pte-ltd\/","title":{"rendered":"Behind the Design: Wizlogix Pte Ltd"},"content":{"rendered":"<p>This is the fifth post in a series showcasing the winners of the 2014 Technology Leadership Awards. <a title=\"Behind the Design Blog Series\" href=\"http:\/\/www.mentor.com\/pcb\/blog?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">View the previous ones here<\/a>.<\/p>\n<p><strong>Runner up for the Consumer Electronics &amp; Handheld category: Wizlogix, Singapore<\/strong><\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/02\/Wizlogix-logo.png\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter  wp-image-399\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/02\/Wizlogix-logo.png\" alt=\"Wizlogix logo\" width=\"138\" height=\"47\" \/><\/a><\/p>\n<p><strong>Design:<\/strong> Modem and application processor<\/p>\n<p><strong>Design team: <\/strong>Vivian Ong Ai Lian, Tan Shean Huey, Romeo Pineda<\/p>\n<p><strong>Design challenges:<\/strong><\/p>\n<ul>\n<li>Traces\/spaces at 2.36th with constraint areas under multiple FPGAs<\/li>\n<li>High via density<\/li>\n<li>Primary component was a 644-pin ASIC with .4mm pitch. HDI was necessary to maximize routing efficiency<\/li>\n<li>High-speed constraints with impedance controlled, length matched differential pairs, with perpendicular biasing on adjacent layers<\/li>\n<li>Common planes for all signals in the same bank are required; creating plane areas that are large enough to provide power to different critical banks under the main chip that is already filled with microvias without breaking into different fragments was a challenge<\/li>\n<\/ul>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/02\/Wizlogix-award-winning-design-for-a-modem-and-application-processor.png\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter size-medium wp-image-400\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2015\/02\/Wizlogix-award-winning-design-for-a-modem-and-application-processor-520x379.png\" alt=\"Wizlogix award-winning design for a modem and application processor\" width=\"520\" height=\"379\" \/><\/a><\/p>\n<p><strong>Design tools and team comments:<\/strong><\/p>\n<ul>\n<li>Xpedition\u00ae Enterprise\n<ul>\n<li>\u201cWe used automation with multi via rules to help us punch multiple vias at regular intervals and spacing.\u201d<\/li>\n<li>\u201cWe used the tuning tool to our advantage as well. It would have taken us a longer time to do the length matching if we had to estimate the lengths of each trace. The tuning tool within Xpedition gives us the actual length that we need and saves us time during checking.\u201d<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<p><strong>Judge\u2019s comments<\/strong><\/p>\n<ul>\n<li>\u201cThe 644 pin BGA at 0.4 mm pitch provides a challenge to route this design in 12 layers.\u201d<\/li>\n<\/ul>\n<p><strong>About the Technology Leadership Awards<\/strong><\/p>\n<p>Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today\u2019s complex PCB systems design challenges and produce industry-leading products. See the <a title=\"2014 Technology Leadership Award Winners\" href=\"http:\/\/www.mentor.com\/pcb\/tla\/previous-winners?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">full list of 2014 winners here<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>This is the fifth post in a series showcasing the winners of the 2014 Technology Leadership Awards. View the previous&#8230;<\/p>\n","protected":false},"author":71680,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-398","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/398","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71680"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=398"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/398\/revisions"}],"predecessor-version":[{"id":10463,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/398\/revisions\/10463"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=398"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=398"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=398"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=398"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=398"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=398"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}