{"id":3856,"date":"2015-03-11T07:36:26","date_gmt":"2015-03-11T14:36:26","guid":{"rendered":"https:\/\/blogs.mentor.com\/jimmartens\/?p=3856"},"modified":"2026-03-27T09:23:44","modified_gmt":"2026-03-27T13:23:44","slug":"bgas-cad-library-series-part-3","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2015\/03\/11\/bgas-cad-library-series-part-3\/","title":{"rendered":"BGAs  &#8211; CAD Library Series: Part 3"},"content":{"rendered":"<p>In part 3 of this a 4 part whitepaper series dedicated to CAD library quality, we&#8217;ll describe each aspect to consider when <a href=\"http:\/\/www.pads.com\/resources\/overview\/pcb-design-perfection-the-cad-library-series-part-3-bga-ball-grid-arrays--ff1decfb-2963-4024-8f58-8be0ac2b3e1b?cmpid=-9049\" target=\"_blank\" rel=\"noopener noreferrer\">creating BGA (Ball Grid Array) component<\/a> library parts. It also describes the impact each feature has in the PCB process.<\/p>\n<p><a href=\"http:\/\/www.pads.com\/resources\/overview\/pcb-design-perfection-the-cad-library-series-part-3-bga-ball-grid-arrays--ff1decfb-2963-4024-8f58-8be0ac2b3e1b?cmpid=-9049\" target=\"_blank\" rel=\"noopener noreferrer\"><img loading=\"lazy\" decoding=\"async\" class=\"  wp-image-3859 alignright\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/55\/2015\/03\/BGA.png\" alt=\"BGA\" width=\"200\" height=\"163\" \/><\/a><\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>The BGA component family includes both <strong>collapsing<\/strong> and <strong>non-collapsing<\/strong> balls. This paper discusses everything from the land sizes for both ball types to the placement courtyard to consider for different technology and density levels.<\/p>\n<p><a href=\"http:\/\/www.pads.com\/resources\/overview\/pcb-design-perfection-the-cad-library-series-part-3-bga-ball-grid-arrays--ff1decfb-2963-4024-8f58-8be0ac2b3e1b?cmpid=-9049\" target=\"_blank\" rel=\"noopener noreferrer\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft  wp-image-3863\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/55\/2015\/03\/WP-page-520x667.png\" alt=\"WP page\" width=\"285\" height=\"366\" \/><\/a><strong><a href=\"http:\/\/www.pads.com\/resources\/overview\/pcb-design-perfection-the-cad-library-series-part-3-bga-ball-grid-arrays--ff1decfb-2963-4024-8f58-8be0ac2b3e1b?cmpid=-9049\" target=\"_blank\" rel=\"noopener noreferrer\">Click here<\/a><\/strong> to access the <strong>BGA Whitepaper <\/strong>now.<\/p>\n<p>You can <strong>download Part 1<\/strong> of this white paper series dedicated to the creation of <strong>Molded Body components<\/strong> by <a href=\"http:\/\/www.pads.com\/resources\/overview\/pcb-design-perfection-the-cad-library-series-part-1-molded-body-components-8606fa51-b629-4eda-8151-3b9ccb99ba7d?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\"><strong>Clicking here <\/strong><\/a>and Part 2 that covers the\u00a0 <a href=\"http:\/\/www.pads.com\/resources\/overview\/pcb-design-perfection-the-cad-library-series-part-2-sot-small-outline-transistors--8120a935-a7a1-4895-9b0b-cc04f4e98b2b?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\"><strong>Small Outline Transistor (SOT)<\/strong><\/a>\u00a0 components.<\/p>\n<p>To learn more about the <strong>xDM Land Pattern Creator <\/strong><a href=\"http:\/\/www.pads.com\/library-management\/land-pattern-generation\/?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">Click here<\/a><\/p>\n<p>And to learn more about <strong>Library Management<\/strong>, <a href=\"http:\/\/www.pads.com\/library-management\/?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">Click here<\/a>!<\/p>\n<p>&nbsp;<\/p>\n<p>Thanks for reading,\u00a0 and be on the lookout for <strong>Part #4: QFP Components<\/strong> soon!<\/p>\n<p>John<\/p>\n","protected":false},"excerpt":{"rendered":"<p>In part 3 of this a 4 part whitepaper series dedicated to CAD library quality, we&#8217;ll describe each aspect to&#8230;<\/p>\n","protected":false},"author":32176,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-3856","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/3856","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/32176"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=3856"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/3856\/revisions"}],"predecessor-version":[{"id":10468,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/3856\/revisions\/10468"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=3856"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=3856"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=3856"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=3856"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=3856"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=3856"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}