{"id":1971,"date":"2014-01-27T10:16:17","date_gmt":"2014-01-27T17:16:17","guid":{"rendered":"https:\/\/blogs.mentor.com\/jimmartens\/?p=1971"},"modified":"2026-03-27T09:20:53","modified_gmt":"2026-03-27T13:20:53","slug":"the-votes-are-in-and-the-winner-is","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2014\/01\/27\/the-votes-are-in-and-the-winner-is\/","title":{"rendered":"The Votes are in.. and the Winner is\u2026"},"content":{"rendered":"

Thanks to everyone that responded to our \u201cECAD or MCAD, one giant \u201cSTEP\u201d for Design-Kind<\/em><\/strong>\u201d <\/em>poll last week online and during our \u201cEffective ECAD \/ MCAD Collaboration in PADS<\/a><\/em><\/strong>\u201d webinars. Both the European and US sessions were well attended and some great questions were presented and addressed during our live Q&A.<\/span><\/p>\n

Here are results of the poll question \u201c<\/span>My 3D STEP models come from \u2026\u2026.. ?\u201d<\/span><\/em><\/p>\n

\"\"<\/a><\/p>\n

Are you surprised by these results?\u00a0 <\/span>Feel free to add your comments below.<\/p>\n

During the EDMD Webinars last week there were several questions related to which ECAD and MCAD companies support EDMD Collaboration. I would encourage you visit the ProSTEP iViP ECAD\/MCAD Collaboration<\/a> forum to learn more. You\u2019ll find that most major ECAD and MCAD tool vendors are project partners and have been implementing the <\/span>ECAD<\/span><\/acronym><\/a>\/<\/span>MCAD<\/span><\/acronym><\/a> data<\/span> schema which is designed to ensure the interoperability between the different applications.<\/p>\n

Another great question was raised related to which group, ECAD or MCAD generates the initial baseline for collaboration. Firstly, it can be either but I typically see that MCAD provides the board baseline based on the PCB\u2019s mating enclosure and mounting requirements. In my webinar demonstration, the cell phone design I used had a very intricate board outline and fixed location requirements for physical interface components like the display, camera, switches, connectors, etc. These component locations are typically non-negotiable by MCAD and ultimately driven by the end user. If you were not able to attend either of the \u201cEffective ECAD \/ MCAD Collaboration in PADS\u201d webinars, the recorded session can be viewed here<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"

Thanks to everyone that responded to our \u201cECAD or MCAD, one giant \u201cSTEP\u201d for Design-Kind\u201d poll last week online and…<\/p>\n","protected":false},"author":32176,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-1971","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1971","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/32176"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1971"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1971\/revisions"}],"predecessor-version":[{"id":10387,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1971\/revisions\/10387"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1971"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1971"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1971"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1971"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1971"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1971"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}