{"id":1734,"date":"2022-01-31T15:17:53","date_gmt":"2022-01-31T20:17:53","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/xpedition\/?p=1734"},"modified":"2026-03-27T09:36:39","modified_gmt":"2026-03-27T13:36:39","slug":"new-3d-ic-podcast-launch","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2022\/01\/31\/new-3d-ic-podcast-launch\/","title":{"rendered":"New 3D IC Podcast Launch"},"content":{"rendered":"\n<h2 class=\"has-text-align-center wp-block-heading\"><strong>NEW PODCAST &#8211;<\/strong> <strong>We\u2019re<\/strong> <strong>excited to announce the launch of our new podcast dedicated to 3D IC!<\/strong> <\/h2>\n\n\n\n<p><\/p>\n\n\n\n<p><\/p>\n\n\n\n<p>Join me as I interview Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He has been in the semiconductor industry for over 30 years, primarily in the design of custom integrated circuits. He\u2019ll help us understand the 3D IC technology and the impact it\u2019s expected to have.<\/p>\n\n\n\n<p>In this episode, you\u2019ll learn about the current chip standards in the industry and where they fall short. You\u2019ll also learn how 3D IC works and how it will help in solving most of the challenges facing today\u2019s chips. Additionally, you\u2019ll hear about the challenges that come with 3D IC and how some of them are being resolved.<\/p>\n\n\n\n<p><strong>What You\u2019ll Learn in this Episode:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>The problem that 3D IC solves<\/li><li>How 3D IC works and why it gives tremendous performance<\/li><li>The difference between 3D IC and other technologies<\/li><li>The challenges in moving to 3D IC<\/li><\/ul>\n\n\n\n<figure class=\"wp-block-pullquote\"><blockquote><p><strong>Check out this episode today and subscribe to make sure you don\u2019t miss an episode on your favorite podcast platform.<\/strong><a href=\"https:\/\/blogs.sw.siemens.com\/podcasts\/3d-ic\/an-introduction-to-3d-ic-ep-1\/\"> <span class=\"has-inline-color has-vivid-red-color\"><strong>Click here<\/strong><\/span><\/a><\/p><\/blockquote><\/figure>\n\n\n\n<p class=\"has-text-align-center\">Use your smartphone camera to scan the code below to subscribe now.<\/p>\n\n\n\n<div class=\"wp-block-image is-style-default\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"394\" height=\"394\" src=\"https:\/\/blogs.sw.siemens.com\/xpedition\/wp-content\/uploads\/sites\/53\/2022\/01\/3D-IC-QR-subscribe-code.jpg\" alt=\"QR Code for 3D IC podcast episode\" class=\"wp-image-1741\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/01\/3D-IC-QR-subscribe-code.jpg 394w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/01\/3D-IC-QR-subscribe-code-150x150.jpg 150w\" sizes=\"auto, (max-width: 394px) 100vw, 394px\" \/><\/figure><\/div>\n","protected":false},"excerpt":{"rendered":"<p>NEW PODCAST &#8211; We\u2019re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as&#8230;<\/p>\n","protected":false},"author":32176,"featured_media":1735,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[1387,1393,1398,160],"industry":[],"product":[],"coauthors":[472],"class_list":["post-1734","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-calibre","tag-hdap","tag-packaging","tag-xpedition"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2022\/01\/3D-IC-Podcast-Image-jm.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1734","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/32176"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1734"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1734\/revisions"}],"predecessor-version":[{"id":10857,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1734\/revisions\/10857"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media\/1735"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1734"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1734"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1734"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1734"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1734"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1734"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}