{"id":1655,"date":"2021-02-11T09:00:51","date_gmt":"2021-02-11T14:00:51","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/xpedition\/?p=1655"},"modified":"2026-03-27T09:36:21","modified_gmt":"2026-03-27T13:36:21","slug":"tla-winner-for-transportation-automotive","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2021\/02\/11\/tla-winner-for-transportation-automotive\/","title":{"rendered":"TLA winner for  Transportation &amp; Automotive"},"content":{"rendered":"\n<p><em>This is part of a series of blogs showcasing the winning designs from the 28<sup>th<\/sup> PCB Technology Leadership Awards.<\/em><em><\/em><\/p>\n\n\n\n<p>The winner in the <strong>Transportation &amp; Automotive <\/strong>category for the 28<sup>th<\/sup> Technology Leadership Awards, is the <strong>Nobo Automotive Systems team <\/strong>out of China!<strong><br><\/strong><\/p>\n\n\n\n<div class=\"wp-block-media-text alignwide has-media-on-the-right is-stacked-on-mobile\"><figure class=\"wp-block-media-text__media\"><img loading=\"lazy\" decoding=\"async\" width=\"760\" height=\"552\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/53\/2020\/12\/Nobo-1291.png\" alt=\"\" class=\"wp-image-1591 size-full\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2020\/12\/Nobo-1291.png 760w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2020\/12\/Nobo-1291-600x436.png 600w\" sizes=\"auto, (max-width: 760px) 100vw, 760px\" \/><\/figure><div class=\"wp-block-media-text__content\">\n<p><strong>Design team<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Li Yue, Wang Zelong, Huang Wenjuan, Cheng Xunzhuang, Lu Shuai &amp; Tong Qi<\/li><\/ul>\n\n\n\n<p><strong>End-product<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Intelligent cockpit domain controller<\/li><\/ul>\n\n\n\n<p><strong>Challenges<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Signal integrity, power integrity, cost, fabrication, assembly, test, reliability<\/li><li>Constraints for electrical, thermal, mechanical, manufacturability<\/li><\/ul>\n\n\n\n<p><strong>Design flow<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Xpedition Enterprise<\/li><\/ul>\n\n\n\n<p><strong>Comments from our industry judges:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>I thought it was a very elegant design, lots of thought was put into the thermal aspects, and extracting the heat away from some of the hotter components.<\/li><li>It had a very good stack, a lot of thought has gone into the design of the stack in terms of managing the EMC, and also the heat sinking for all of the heat.<\/li><li>Just overall a very good design<\/li><\/ul>\n<\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading\" style=\"font-size:24px\"><strong>About the Technology Leadership Awards<\/strong><\/h2>\n\n\n\n<p>The competition, which started in 1988, is the longest running of its kind in the EDA industry.&nbsp; Design teams who use Mentor\/Siemens solutions submit their designs, and are awarded by&nbsp;an independent panel of industry-expert judges for overcoming the most extreme challenges facing PCB design teams today.<\/p>\n\n\n\n<p>To learn about more about the other winners watch the announcement webinar with some of our industry judges <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/technology-overview-28th-pcb-technology-leadership-award-winners\" target=\"_blank\" rel=\"noopener\">here<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The&#8230;<\/p>\n","protected":false},"author":73636,"featured_media":1631,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[19],"tags":[1404,1405,160],"industry":[224],"product":[984],"coauthors":[],"class_list":["post-1655","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-webinar","tag-technology-leadership-awards","tag-tla","tag-xpedition","industry-automotive-transportation","product-xpedition-enterprise"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2021\/01\/TLA_2000w_smaller.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1655","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/73636"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1655"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1655\/revisions"}],"predecessor-version":[{"id":10838,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1655\/revisions\/10838"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media\/1631"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1655"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1655"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1655"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1655"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1655"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1655"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}