{"id":1567,"date":"2020-12-10T10:56:14","date_gmt":"2020-12-10T15:56:14","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/xpedition\/?p=1567"},"modified":"2026-03-27T09:35:53","modified_gmt":"2026-03-27T13:35:53","slug":"tla-winners-best-design-overall","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2020\/12\/10\/tla-winners-best-design-overall\/","title":{"rendered":"TLA winners:  Best Design Overall"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">The 28<sup>th<\/sup> PCB Technology Leadership Award (TLA) winners have been selected!<\/h2>\n\n\n\n<p>The competition, which started in 1988, is the longest running of its kind in the EDA industry.&nbsp; Design teams who use Mentor\/Siemens solutions submit their designs, and are awarded by&nbsp;an independent panel of industry-expert judges.&nbsp; This year we received entries from all over the world, representing a wide range of design types.&nbsp;<\/p>\n\n\n\n<p>The industry judges have picked winners from several industry categories, and this year because so many great designs were submitted, a category was added for significant contenders.&nbsp; The categories include:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Computers, blade and servers, memory systems<\/li><li>Consumer electronics, handheld<\/li><li>Industrial control, instrumentation, security, medical<\/li><li>Military, aerospace<\/li><li>Telecom, network controllers, line cards<\/li><li>Transportation, automotive<\/li><li>Significant contenders<\/li><li>Overall winner<\/li><\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Best Design Overall<\/h2>\n\n\n\n<p><strong>The overall winner for the 28<sup>th<\/sup> Technology Leadership Awards, is the Infinera team out of Finland, working with Jabil<\/strong>.&nbsp; They submitted an entry in the <strong>Telecom, network controllers, line cards<\/strong> category.&nbsp;<\/p>\n\n\n\n<p><strong>Design team<\/strong><br>\u2022 Infinera &amp; Jabil team<\/p>\n\n\n\n<p><strong>End-product<\/strong><br>\u2022 L2\/L3 router for disaggregated networks<\/p>\n\n\n\n<p><strong>Challenges<\/strong><br>\u2022 Signal integrity, power integrity, cost, fabrication, assembly, test, reliability<br>\u2022 High-density, high-speed<br>\u2022 Multi-board constraints<br>\u2022 ECAD\/MCAD alignment<br>\u2022 Multi-discipline concurrent design<\/p>\n\n\n\n<p><strong>Design flow<\/strong><br>\u2022 Xpedition Enterprise<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"740\" height=\"594\" src=\"https:\/\/blogs.sw.siemens.com\/xpedition\/wp-content\/uploads\/sites\/53\/2020\/12\/image61.png\" alt=\"Best Design Overall\" class=\"wp-image-1568\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2020\/12\/image61.png 740w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2020\/12\/image61-600x482.png 600w\" sizes=\"auto, (max-width: 740px) 100vw, 740px\" \/><figcaption>Best Design Overall<\/figcaption><\/figure><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Comments from our industry judges:<\/h2>\n\n\n\n<ul class=\"wp-block-list\"><li>All of the judging panel were extremely impressed with this board.<\/li><\/ul>\n\n\n\n<ul class=\"wp-block-list\"><li>This particular design was amazing.&nbsp; The first thing that jumps out at me is its odd shape.&nbsp; That in itself poses a challenge in routing when you such a shape like this.&nbsp; The unique mechanical constraint of this board, many of the high speed signals had to work their way around some of these odd angles to go to the I\/O off the board.<\/li><\/ul>\n\n\n\n<ul class=\"wp-block-list\"><li>This design is a combination of off the shelf parts as well as some in-house developed PCB assemblies, which required extensive use of 3D modeling and ECAD MCAD collaboration.&nbsp; That poses a lot of challenges, especially when you have so many diverse complex components and connectors.<\/li><\/ul>\n\n\n\n<ul class=\"wp-block-list\"><li>This was an amazing PCB, and definitely a worthy winner.&nbsp; This design combined everything in terms of the routing, in terms of the placement, a sort of crafted spread.&nbsp; It had a very impressive balanced stack, optimized for signal integrity, optimized to minimize EMC, and optimized for power distribution. Very complex, very dense.<\/li><\/ul>\n\n\n\n<ul class=\"wp-block-list\"><li>This team deserves recognition for overcoming some of the most complex challenges that face PCB design teams.<\/li><\/ul>\n\n\n\n<p>To learn about more about the other winners, keep an eye out for future blogs, or watch the announcement webinar with some of our industry judges <strong><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/technology-overview-28th-pcb-technology-leadership-award-winners\" target=\"_blank\" rel=\"noreferrer noopener\">here<\/a><\/strong>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The 28th PCB Technology Leadership Award (TLA) winners have been selected!<\/p>\n","protected":false},"author":73636,"featured_media":1584,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[19],"tags":[1404,1405,160],"industry":[],"product":[984],"coauthors":[],"class_list":["post-1567","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-webinar","tag-technology-leadership-awards","tag-tla","tag-xpedition","product-xpedition-enterprise"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2020\/12\/TLA_logo.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1567","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/73636"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1567"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1567\/revisions"}],"predecessor-version":[{"id":10825,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1567\/revisions\/10825"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media\/1584"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1567"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1567"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1567"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1567"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1567"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1567"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}