{"id":1529,"date":"2014-09-09T08:13:18","date_gmt":"2014-09-09T15:13:18","guid":{"rendered":"https:\/\/blogs.mentor.com\/hyperblog\/?p=1529"},"modified":"2026-03-27T09:22:11","modified_gmt":"2026-03-27T13:22:11","slug":"the-future-of-integrity","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2014\/09\/09\/the-future-of-integrity\/","title":{"rendered":"The Future of Integrity"},"content":{"rendered":"<p>I have recently been blogging about signal and power integrity, how the two are related, and how they can cross over.\u00a0 This was prompted by an <a href=\"http:\/\/www.edn.com\/design\/designcon\/4433827\/Signal-integrity-and-power-integrity-in-high-speed-design\" target=\"_blank\" rel=\"noopener noreferrer\">article I recently wrote for the DesignCon branch of EDN<\/a>.\u00a0 Twenty years ago, one of the biggest barriers to designing high-speed PCBs was ensuring signal integrity.\u00a0 About ten years ago, power integrity started becoming a serious issue.\u00a0 So what is next?\u00a0 Is there another type of &#8220;integrity&#8221; we need to start analyzing?<\/p>\n<p>No &#8211; at this point we pretty much have everything covered.\u00a0 No more integrities on the horizon.\u00a0 But what likely will change is how much we analyze in each of these analysis types&#8230;\u00a0 For instance, if we look at vias, they used to be short enough to just model as a simple capacitor, then a simple L-C, and now for high-speed differential signals we need a full-wave 3D EM model of the via to properly characterize it for simulation.\u00a0 For single-ended vias, we need to know the entire PDN to get an accurate <em>signal<\/em> model for the via.\u00a0 And that is another trend that is permeating analysis needs &#8211; the impending crossover between signal and power integrity.\u00a0 Eventually integrity analysis will encompass both, as well as other disciplines, all on the way to being able to create &#8220;virtual prototypes&#8221; of our PCBs, being able to predict their performance in a number of realms before the first prototype is manufactured.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>I have recently been blogging about signal and power integrity, how the two are related, and how they can cross&#8230;<\/p>\n","protected":false},"author":71672,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-1529","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1529","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71672"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1529"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1529\/revisions"}],"predecessor-version":[{"id":10424,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1529\/revisions\/10424"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1529"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1529"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1529"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1529"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1529"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1529"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}