{"id":1526,"date":"2014-09-08T13:30:29","date_gmt":"2014-09-08T20:30:29","guid":{"rendered":"https:\/\/blogs.mentor.com\/hyperblog\/?p=1526"},"modified":"2026-03-27T09:22:10","modified_gmt":"2026-03-27T13:22:10","slug":"an-integrity-cocktail-mixing-si-and-pi","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2014\/09\/08\/an-integrity-cocktail-mixing-si-and-pi\/","title":{"rendered":"An Integrity Cocktail &#8211; Mixing SI and PI"},"content":{"rendered":"<p>There are a lot of reasons to mix SI and PI analysis &#8211; trying to figure out a worst-case stimuli to determine PDN performance, trying to see the effect of a poor PDN on signals due to SSN issues, or just being able to properly analyze a single-ended via.\u00a0 In fact, to get an accurate model of a single-ended via, you have to mix SI and PI.\u00a0 The reason is that the power distribution network, or PDN &#8211; decoupling capacitors, stitching vias, and plane pairs &#8211; make up the signal return path for a single-ended via, thus determining the &#8220;impedance&#8221;, delay,\u00a0and crosstalk characteristics of the via.\u00a0 This is especially crucial when modeling very fast, single-ended signals like DDR3 and DDR4 signals.\u00a0 In HyperLynx, you can extract via models which include the PDN; this is achieved by the PI engine running in the background during the via model extraction.\u00a0 The result is a very accurate wideband single-ended via model that properly captures the via&#8217;s electrical characteristics.\u00a0 Once extracted, this model can be used in other simulations again and again.\u00a0 Another option is to use the SI\/PI co-simulation option, which generates these models on-the-fly.<\/p>\n<p>To learn more about mixing SI and PI, take a look at this article in EDN:<br \/>\n<a href=\"http:\/\/www.edn.com\/design\/designcon\/4433827\/Signal-integrity-and-power-integrity-in-high-speed-design\" target=\"_blank\" rel=\"noopener\">http:\/\/www.edn.com\/design\/designcon\/4433827\/Signal-integrity-and-power-integrity-in-high-speed-design<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>There are a lot of reasons to mix SI and PI analysis &#8211; trying to figure out a worst-case stimuli&#8230;<\/p>\n","protected":false},"author":71672,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-1526","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1526","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71672"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1526"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1526\/revisions"}],"predecessor-version":[{"id":10423,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1526\/revisions\/10423"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1526"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1526"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1526"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1526"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1526"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1526"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}