{"id":1434,"date":"2020-04-03T12:44:42","date_gmt":"2020-04-03T19:44:42","guid":{"rendered":"https:\/\/blogs.mentor.com\/xpedition\/?p=1434"},"modified":"2026-03-27T09:35:03","modified_gmt":"2026-03-27T13:35:03","slug":"whats-new-in-xpedition-ic-packaging-design-for-vx-2-7","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2020\/04\/03\/whats-new-in-xpedition-ic-packaging-design-for-vx-2-7\/","title":{"rendered":"What\u2019s New in Xpedition\u00ae IC Packaging Design for VX 2.7"},"content":{"rendered":"<p>Mentor&#8217;s Xpedition\u00ae IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB layout with solutions for Chip\/Package\/PCB prototyping and co-design. They also deliver a complete solution for High Density Advanced Package (HDAP) rapid prototyping assembly, physical design, verification, signoff, and modeling.<\/p>\n<p>Here are some highlights of the Xpedition\u00ae VX. 2.7 IC Packaging design tools release.<\/p>\n<ul>\n<li>Advanced Prototyping Optimization<\/li>\n<li>Differential Pairs Flow Support<\/li>\n<li>ODB++ teardrops import<\/li>\n<li>Route Obstruct Areas<\/li>\n<li>Manual Saw Tuning<\/li>\n<li>Sequential Multi-part Floorplanning<\/li>\n<li>Clearance Rules to NC Pins\u00a0 &#8230;and more!<\/li>\n<\/ul>\n<h3><a href=\"https:\/\/www.mentor.com\/pcb\/xpedition\/new-in-xpedition-ic-packaging\/vx-2-7?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter\" src=\"https:\/\/mgc-images.imgix.net\/pcb\/whats_new_VX27_IC_Package-1F31A9A7.png?q=60&amp;fit=max&amp;w=1440\" alt=\"Image\" width=\"373\" height=\"210\" \/><\/a><\/h3>\n<p class=\"lead\">If you would like a preview of what\u2019s new, please feel free to check out the <strong><a href=\"https:\/\/www.mentor.com\/pcb\/xpedition\/new-in-xpedition-ic-packaging\/vx-2-7?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">What\u2019s New in Xpedition IC Packaging VX.2.7<\/a><\/strong> videos. Download this latest release from <a href=\"https:\/\/support.sw.siemens.com?cmpid=9049\" target=\"_blank\" rel=\"noopener noreferrer\">Support Center<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Mentor&#8217;s Xpedition\u00ae IC Packaging design tools bridge the gap between engineering teams for IC layout, package substrate design, and PCB&#8230;<\/p>\n","protected":false},"author":32176,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[1393,1398,160],"industry":[],"product":[],"coauthors":[],"class_list":["post-1434","post","type-post","status-publish","format-standard","hentry","category-news","tag-hdap","tag-packaging","tag-xpedition"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1434","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/32176"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=1434"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1434\/revisions"}],"predecessor-version":[{"id":10792,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/1434\/revisions\/10792"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=1434"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=1434"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=1434"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=1434"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=1434"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=1434"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}