{"id":130,"date":"2010-01-29T09:59:15","date_gmt":"2010-01-29T16:59:15","guid":{"rendered":"https:\/\/blogs.mentor.com\/hyperblog\/?p=130"},"modified":"2026-03-27T09:17:13","modified_gmt":"2026-03-27T13:17:13","slug":"designcon-2010-next-week","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2010\/01\/29\/designcon-2010-next-week\/","title":{"rendered":"DesignCon 2010 &#8211; Next week"},"content":{"rendered":"<p>You may have noticed on the <a title=\"[SI-LIST]\" href=\"http:\/\/www.si-list.net\/\" target=\"_blank\" rel=\"noopener noreferrer\">[SI-LIST]<\/a> that everyone and their brother have been posting information about <a title=\"DesignCon 2010\" href=\"http:\/\/www.designcon.com\/2010\/\" target=\"_blank\" rel=\"noopener noreferrer\">DesignCon<\/a>.\u00a0 Well it is right around the corner with Tutorials kicking the week off on Monday, just 3 days away.<\/p>\n<p>Hopefully you&#8217;ve got your bags packed and you&#8217;re ready to go!\u00a0 Online registration closed yesterday but you can still get into the conference if you show up in Santa Clara and register at the event.<\/p>\n<p>Here are some highlights of things that will I think will be interesting in the signal integrity and PCB space at the conference that you may want to check out:<\/p>\n<ul>\n<li>In the area of Tutorials:\n<ul>\n<li><a title=\"Navigating Electromagnetic Field Solvers\" href=\"http:\/\/www.designcon.com\/2010\/attendees\/tf_ma2\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Navigating Electromagnetic Field Solvers:\u00a0 Designer and EDA Perspectives<\/a><\/li>\n<li><a title=\"Stackup planning\" href=\"http:\/\/www.designcon.com\/2010\/attendees\/tf_mp2\/index.asp\" target=\"_blank\" rel=\"noopener\">Designing PCB Stackups to Balance Signal Integrity Against Manufacturability<\/a><\/li>\n<li><a title=\"PDN Measurements\" href=\"http:\/\/www.designcon.com\/2010\/attendees\/12_th3\/index.asp\" target=\"_blank\" rel=\"noopener\">Accuracy Improvements of PDN Impedance Measurements in the Low to Middle Frequency Range<\/a><\/li>\n<\/ul>\n<\/li>\n<li>Mentor has several Technical panels we&#8217;re hosting:\n<ul>\n<li><a title=\"Statistical Analysis Techniques Technical Panel\" href=\"http:\/\/www.designcon.com\/2010\/attendees\/tp_w2\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Challenges of Applying Statistical Analysis Techniques in High Speed Serial Channel Design<\/a><\/li>\n<li><a title=\"SiP and Advanced Packaging Technical Panel\" href=\"http:\/\/www.designcon.com\/2010\/attendees\/tp_t2\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">SiP and Advanced Packaging &#8211; A Growing Market Segment in an Economic Downturn &#8211; Turning to 3D packaging<\/a><\/li>\n<\/ul>\n<\/li>\n<li>There are a ton of great papers that will be presented.\u00a0 Here are just a few:\n<ul>\n<li><a title=\"SSN in LPDDR2\" href=\"http:\/\/www.designcon.com\/2010\/attendees\/10_ta1\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Estimation of Simultaneous Switching Noise from the Power Distribution Network Impedance in LPDDR2 Systems<\/a><\/li>\n<li><a href=\"http:\/\/www.designcon.com\/2010\/attendees\/5_ta2\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Impact of Copper Surface Texture on Loss: A model that works<\/a><\/li>\n<li><a href=\"http:\/\/www.designcon.com\/2010\/attendees\/12_ta2\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">PWB Manufacturing Variability Effects on High Speed SerDes Links<\/a><\/li>\n<li><a href=\"http:\/\/www.designcon.com\/2010\/attendees\/5_ta4\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Cost Effective Crosstalk Management &amp; Decision Making<\/a><\/li>\n<li><a href=\"http:\/\/www.designcon.com\/2010\/attendees\/7_wa1\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Additional Trace Losses due to Glass-Weave Periodic Loading<\/a><\/li>\n<li><a href=\"http:\/\/www.designcon.com\/2010\/attendees\/4_wa3\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Analysis of FPGA PDN Noise Propagation by die\/package 3D Modeling<\/a><\/li>\n<li><a href=\"http:\/\/www.designcon.com\/2010\/attendees\/6_wa4\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">Interconnect Considerations for DDR Timing Closure beyond 1600Mbps<\/a><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<p>Mentor will also have a TecPreview session on Wednesday @ 2:00pm where we&#8217;ll talk a bit about modeling for SerDes interfaces called <a href=\"http:\/\/www.designcon.com\/2010\/attendees\/tech_perv4\/index.asp\" target=\"_blank\" rel=\"noopener noreferrer\">What engineers need to know about SERDES, SPICE, and IBIS-AMI.<\/a><\/p>\n<p>Be sure and stop by booth #320 and say &#8220;hi&#8221; and register for you chance to win that jacket I talked about in my <a href=\"https:\/\/blogs.mentor.com\/hyperblog\/blog\/2010\/01\/05\/designcon-baby\/\" target=\"_blank\" rel=\"noopener noreferrer\">previous blog<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>You may have noticed on the [SI-LIST] that everyone and their brother have been posting information about DesignCon.\u00a0 Well it&#8230;<\/p>\n","protected":false},"author":71697,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[1014,1044,1063,1067,1069,1099,1115,1117,137],"industry":[],"product":[],"coauthors":[],"class_list":["post-130","post","type-post","status-publish","format-standard","hentry","category-news","tag-ami","tag-designcon","tag-hyperlynx","tag-ibis","tag-ibis-ami","tag-power-integrity","tag-serdes","tag-si-list","tag-signal-integrity"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/130","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/71697"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=130"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/130\/revisions"}],"predecessor-version":[{"id":10278,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/130\/revisions\/10278"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=130"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=130"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=130"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=130"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=130"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=130"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}