{"id":11715,"date":"2026-01-22T14:36:38","date_gmt":"2026-01-22T19:36:38","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/?p=11715"},"modified":"2026-03-27T09:48:30","modified_gmt":"2026-03-27T13:48:30","slug":"aster-technologies","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2026\/01\/22\/aster-technologies\/","title":{"rendered":"ASTER Technologies strengthens Siemens digital thread for optimized PCB manufacturability"},"content":{"rendered":"\n<p>Siemens EDA is pleased to announce its acquisition of <a href=\"https:\/\/aster-technologies.com\/en\/\" target=\"_blank\" rel=\"noopener\">ASTER Technologies<\/a>, a trusted name within the&nbsp;PCB design&nbsp;industry with more than 30 years&nbsp;of focus on verifying, assembling, and testing&nbsp;PCB&nbsp;assemblies.&nbsp;<\/p>\n\n\n\n<p>Founded in 1993, and based in&nbsp;Cesson-S\u00e9vign\u00e9, France, ASTER Technologies provides compelling&nbsp;design for manufacturing (DFM)&nbsp;physical design verification software solutions for PCB fabrication, assembly and test, alongside robust&nbsp;test&nbsp;coverage&nbsp;analysis&nbsp;and test programming capabilities. Its flagship product,&nbsp;TestWay\u2122, is renowned for its best-in-class&nbsp;design for test (DFT)&nbsp;planning and implementation, enabling companies to prepare designs and implement robust test strategies early in the PCB assembly manufacturing process.&nbsp;TestWay&nbsp;complements Siemens\u2019 Valor\u2019s&nbsp;design for fabrication (DFF) and design for assembly (DFA)&nbsp;capabilities, creating a truly comprehensive&nbsp;(DFM)&nbsp;solution.&nbsp;<\/p>\n\n\n\n<p>ASTER Technologies brings proven capabilities for&nbsp;test&nbsp;coverage analysis, testability insight, and the practical workflows needed to translate test strategy into production execution across inspection and test stages such as&nbsp;SPI,&nbsp;AOI, &nbsp;X-ray, boundary&nbsp;scan,&nbsp;flying probe,&nbsp;in-circuit test,&nbsp;cable&nbsp;test, and functional test. By bringing&nbsp;TestWay&nbsp;into the Siemens ecosystem, Siemens strengthens an already mature end-to-end approach,&nbsp;connecting PCB design, manufacturability verification, and downstream test engineering more seamlessly&nbsp;than ever before. This allows&nbsp;our&nbsp;customers&nbsp;to&nbsp;release more reliable products faster,&nbsp;without adding complexity to their toolchain.&nbsp;&nbsp;<\/p>\n\n\n\n<p>This move will expand Siemens\u2019 electronic systems design portfolio with best-in-class DFT expertise and elevate test readiness as a first-class part of the shift-left digital thread. The acquisition of ASTER Technologies strengthens the digital thread by connecting design intent, manufacturing constraints, and test strategy in a more continuous, bidirectional workflow, so insights from manufacturing and test can inform design decisions earlier and more consistently. The result is higher confidence through ramp and production, with fewer late-stage surprises and less friction across the design-to-manufacturing handoff.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Strengthening&nbsp;design for&nbsp;manufacturing&nbsp;across&nbsp;our industry<\/strong>&nbsp;<\/h3>\n\n\n\n<p>As products become more&nbsp;compact&nbsp;and&nbsp;supply chains more complex,&nbsp;the cost of late-stage discovery keeps rising. A holistic&nbsp;DFM&nbsp;solution, which uses digital verification to catch issues while these issues are still inexpensive and before manufacturing decisions become locked&nbsp;in&nbsp;is a key tenet within&nbsp;<a href=\"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2026\/01\/14\/design-smarter-not-harder-evolving-design-reuse-methodologies-in-eda\/\">Siemens\u2019 Valor<\/a>&nbsp;portfolio.<\/p>\n\n\n\n<div class=\"wp-block-media-text has-media-on-the-right is-stacked-on-mobile is-vertically-aligned-center\" style=\"grid-template-columns:auto 39%\"><div class=\"wp-block-media-text__content\">\n<p><em>A robust <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/valor\/\" target=\"_blank\" rel=\"noopener\">DFM solution<\/a> contains design for fabrication, design for assembly and design for test solutions.<\/em><\/p>\n<\/div><figure class=\"wp-block-media-text__media\"><img loading=\"lazy\" decoding=\"async\" width=\"724\" height=\"576\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/DFM-in-3-parts-with-DFF-DFA-and-DFT.png\" alt=\"\" class=\"wp-image-11699 size-full\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/DFM-in-3-parts-with-DFF-DFA-and-DFT.png 724w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/DFM-in-3-parts-with-DFF-DFA-and-DFT-600x477.png 600w\" sizes=\"auto, (max-width: 724px) 100vw, 724px\" \/><\/figure><\/div>\n\n\n\n<p>Product testing is no longer a downstream activity;&nbsp;it\u2019s&nbsp;a business-critical discipline that must be planned early, engineered intentionally, and continuously&nbsp;validated.&nbsp;<\/p>\n\n\n\n<p>A comprehensive test engineering strategy is&nbsp;an important component&nbsp;of a robust shift-left ideology. By embedding test intent early within design, we enable our users to&nbsp;intercept defects before they become&nbsp;respins, prevent product returns, and reduce costly field failures.&nbsp;<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>TestWay&nbsp;brings DFT into a&nbsp;shift-left workflow<\/strong>&nbsp;<\/h3>\n\n\n\n<p>DFT&nbsp;delivers&nbsp;value by shifting your testability and coverage left into the design, creating an engineered and measurable workflow strategy, rather than a late-stage checklist.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"496\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray-1024x496.png\" alt=\"Aster technologies brings DFT to Siemens\" class=\"wp-image-11702\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray-1024x496.png 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray-600x291.png 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray-768x372.png 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray-1536x744.png 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray-900x436.png 900w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/x-ray.png 1920w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p>Implementing&nbsp;TestWay&nbsp;extends your digital thread beyond coverage,&nbsp;into operational performance. It&nbsp;can&nbsp;evaluate multiple test scenarios and models&nbsp;to&nbsp;determine&nbsp;your overall test coverage, allowing teams to tune their strategy based on the production process and the defects&nbsp;most likely to occur. Once&nbsp;that&nbsp;is complete, it develops the test machine input files&nbsp;required&nbsp;to perform the actual procedure, interfacing with more than&nbsp;75&nbsp;test&nbsp;and inspection machines. After the test program runs on the test line, the software measures actual coverage across more than 85 test and inspection machines, identifies gaps versus estimated figures, and enables closed-loop operation for maximum PCB coverage.&nbsp;<\/p>\n\n\n\n<div class=\"wp-block-media-text is-stacked-on-mobile\" style=\"grid-template-columns:63% auto\"><figure class=\"wp-block-media-text__media\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"572\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-1024x572.png\" alt=\"\" class=\"wp-image-11717 size-full\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-1024x572.png 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-600x335.png 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-768x429.png 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-1536x858.png 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-2048x1144.png 2048w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-395x222.png 395w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/ASTER-blog-3-900x503.png 900w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure><div class=\"wp-block-media-text__content\">\n<p><em>ASTER Technologies&#8217; TestWay\u2122 creates end-to-end test flows within a simple drag and drop interface by using a full mix of available inspection and test machines: SPI, AOI, AXI, boundary scan, ICT, flying probe, and functional test.<\/em><\/p>\n<\/div><\/div>\n\n\n\n<p>Siemens already brings manufacturing readiness into the <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/xpedition\/\" target=\"_blank\" rel=\"noopener\">PCB design process <\/a>through mature DFM capabilities. TestWay&nbsp;strengthens that flow by adding DFT and coverage-driven test planning as a first-class part of manufacturability, enabling organizations to make earlier, more informed tradeoffs between inspection, probing, and downstream test approaches. It also supports a governance model that executives care about: consistent measurement and accountability.&nbsp;<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Optimizing&nbsp;for&nbsp;yield<\/strong>&nbsp;<\/h3>\n\n\n\n<p>Yield is the most visible scoreboard for <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/valor\/valor-npi\/\" target=\"_blank\" rel=\"noopener\">DFM<\/a> because it reflects how&nbsp;well design&nbsp;intent survives the realities of fabrication and assembly at scale. Small choices in footprints, tolerances, stackups, accessibility, and process assumptions can accumulate into scrap, rework, delays, and&nbsp;margin&nbsp;erosion. In a strong shift-left DFM approach, yield is treated as a design outcome that can be influenced early through continuous verification and manufacturing-aware decisions that reduce sensitivity to variation and prevent defects from being designed in. <\/p>\n\n\n\n<p>DFT complements this by ensuring that when defects do occur in complex electronics, they are detected quickly, localized accurately, and prevented from escaping downstream. By planning coverage across inspection and test stages and aligning that strategy to real accessibility and manufacturing constraints, DFT helps raise first-pass yield, lower escape rates, shorten debug cycles, and stabilize ramp so yield improvement becomes repeatable instead of reactive.&nbsp;<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>A warm welcome<\/strong>&nbsp;<\/h3>\n\n\n\n<p>Through the acquisition of ASTER Technologies, <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/valor\/stackup-design-high-speed\/\" target=\"_blank\" rel=\"noopener\">Siemens EDA<\/a> strengthens your shift-left strategy by extending manufacturability thinking beyond fabrication and assembly readiness into testability and coverage planning, allowing early decisions which influence your design decisions when changes are still fast and affordable. In a world where electronics complexity is&nbsp;accelerating&nbsp;and quality expectations are unforgiving, DFM is a core business discipline that protects schedule, cost, and brand reputation by preventing&nbsp;respins&nbsp;and improving first-pass success.&nbsp;&nbsp;<\/p>\n\n\n\n<p>With ASTER Technologies\u2019&nbsp;TestWay&nbsp;capabilities added to Siemens\u2019 broader PCB portfolio, customers can pursue a more continuous, digital-thread workflow that connects design intent to manufacturing and test execution,&nbsp;helping teams&nbsp;validate&nbsp;earlier, collaborate more effectively across engineering and manufacturing, and deliver higher reliability at scale.&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Siemens EDA is pleased to announce its acquisition of ASTER Technologies, a trusted name within the&nbsp;PCB design&nbsp;industry with more than&#8230;<\/p>\n","protected":false},"author":77873,"featured_media":11698,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[13],"tags":[2092,1981,1407],"industry":[1007,341],"product":[939,937],"coauthors":[2011],"class_list":["post-11715","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-design-for-test","tag-dft","tag-valor","industry-electronic-manufacturing-services","industry-electronics-semiconductors","product-valor-dfm-solutions","product-valor-dft"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/65\/2026\/01\/furth-factory-1365813694_medium.jpeg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/11715","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/users\/77873"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/comments?post=11715"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/11715\/revisions"}],"predecessor-version":[{"id":11757,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/posts\/11715\/revisions\/11757"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media\/11698"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/media?parent=11715"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/categories?post=11715"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/tags?post=11715"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/industry?post=11715"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/product?post=11715"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/wp-json\/wp\/v2\/coauthors?post=11715"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}