{"id":10241,"date":"2023-05-30T15:02:21","date_gmt":"2023-05-30T19:02:21","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/valor-dfm-solutions\/?p=452"},"modified":"2026-03-27T09:46:07","modified_gmt":"2026-03-27T13:46:07","slug":"whats-new-in-z-planner-v2023-1","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/electronic-systems-design\/2023\/05\/30\/whats-new-in-z-planner-v2023-1\/","title":{"rendered":"What\u2019s New in Z-planner V2023.1"},"content":{"rendered":"\n

Z-planner Introduction<\/a><\/h2>\n\n\n\n

Creating the correct stackup using the proper materials and then transferring that information to your fabricator is extremely important in the success of your PCB design.  Being able to \u201cleft shift\u201d this stage of your design process can add huge cost and quality savings into your entire design.<\/p>\n\n\n\n

Z-planner V2023.1<\/a> builds on previous versions by enhancing rigid\/flex useability, tighter integration with Xpedition<\/a> and HyperLynx<\/a> and the addition of more Mil-Aero materials to the dielectric materials library.<\/p>\n\n\n\n

So, let\u2019s look at some of these new enhancements in more detail.<\/p>\n\n\n\n

Stack up Wizard Enhancements<\/h2>\n\n\n\n

There were a couple changes made to the Stackup wizard<\/a> too.<\/p>\n\n\n\n

The biggest enhancement is the addition of adding via definitions. This allows the extra plating layers needed for sequential lamination designs to be added before the impedance calculations are done.<\/p>\n\n\n\n

A usability enhancement was added to assign a frequency for the impedance planning. Impedance settings are now remembered for later use in the stack up editor.<\/p>\n\n\n\n

\"\"
New step added to the stackup wizard – Drill definition<\/figcaption><\/figure>\n\n\n\n

Via Drill Table<\/h2>\n\n\n\n

An updated drill table has now been added to the viewer as well as the Excel export spreadsheet.<\/p>\n\n\n\n

The new drill table has updated graphics for a more detailed description of the vias being used.<\/p>\n\n\n\n

\"\"
Drill table from the viewer or excel export<\/figcaption><\/figure>\n\n\n\n

Integration<\/h2>\n\n\n\n

There were several updates with the integration other tools. Let\u2019s look at them separately.<\/p>\n\n\n\n

Xpedition:<\/h3>\n\n\n\n

You can now import the percent copper data from Xpedition. Using this data, you get more accurate results of the impedance calculations since the actual prepreg thickness can be calculated.<\/p>\n\n\n\n

\"\"
Import and Export data from Xpedition<\/figcaption><\/figure>\n\n\n\n

HyperLynx:<\/h3>\n\n\n\n

The etch factor calculation now uses the same formula as HyperLynx.<\/p>\n\n\n\n

\"\"<\/figure>
\n

Proposed definitions of “etchback”<\/em> and “etch factor,”<\/em> where x (etchback) is the difference between w1 and w2, and etch factor is defined as the degree of etchback per thickness.<\/p>\n<\/div><\/div>\n\n\n\n

HyperLynx Advanced Solvers:<\/h3>\n\n\n\n

Stack up data from HLAS can now be directly imported.<\/p>\n\n\n\n

This addition continues to improve the integration with the Siemens EDA flow.<\/p>\n\n\n\n

\"\"<\/figure>
\n

HyperLynx <\/strong><\/h3>\n\n\n\n