{"id":3162,"date":"2025-05-12T15:09:28","date_gmt":"2025-05-12T19:09:28","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/ee-systems\/?p=3162&preview=true&preview_id=3162"},"modified":"2026-03-26T13:45:33","modified_gmt":"2026-03-26T17:45:33","slug":"iesf-2025","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/ee-systems\/2025\/05\/12\/iesf-2025\/","title":{"rendered":"IESF 2025: Attend this one day event and gain actionable solutions from automotive experts"},"content":{"rendered":"\n

Siemens Capital Integrated Electrical Solutions Forum IESF 2025 takes place June 2, 2025 at Huntington Place, Detroit<\/em>. <\/p>\n\n\n\n

Join us at the Integrated Electrical Solutions Forum (IESF) 2025<\/a>, a dynamic event celebrating 25 years of driving automotive innovation. This year’s conference promises to bring industry leaders, best practices and transformative ideas together to help shape the future of automotive engineering.<\/p>\n\n\n\n

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REGISTER YOUR TEAM FOR FREE*<\/strong><\/a><\/div>\n<\/div>\n\n\n\n
\"IESF<\/figure>\n\n\n\n

IESF 2025 Agenda Highlights<\/strong><\/h2>\n\n\n\n

For the first time, IESF will kick off the 2025 Realize LIVE Americas conference<\/a>, providing an even richer experience for attendees. As an IESF participant, you can enjoy the first day of the Realize LIVE Expo, engage with more than 3,000 engineering professionals, participate in thought-provoking keynotes, and network during the reception \u2014 all included on the first day.<\/p>\n\n\n\n

Why attend IESF 2025? The focus areas include electrical design and wire harness engineering, software as a service (SaaS) and Cloud-based solutions, as well as software-defined vehicles (SDVs). IESF 2025 will feature guest sessions with industry leaders from Rivian, PACCAR, Stellantis, LEONI, and IBM, among others. These sessions will offer attendees the opportunity to hear from top experts and gain insights into the latest trends and innovations in automotive engineering.<\/p>\n\n\n\n

>> Driving the Future: Accelerating Automotive Innovation with a Scalable SDV Framework<\/strong>
Speakers: <\/em>
Rogerio Vollet, EE Architecture Director, Stellantis
Amarnath Bharadwaj, Managing Director, Accenture
Hans-Juergen Mantsch, Business Development Director MBSE, SDV & E\/E, Siemens <\/p>\n\n\n\n

>> Panel: Wire Harness Transformation in the Era of SDVs, Electrification, Global Shifts, and a Sustainable World<\/strong>
Speakers:
<\/em>Sven Neeser, Director & Head of Development Excellence, LEONI
Tim Mailley, Chief Commercial Officer, Yazaki North America
Eric Varton, VP of Engineering, Yazaki North America
Doug Burcicki, Sr. Director, Siemens<\/p>\n\n\n\n

>> PACCAR\u2019s Roadmap to Managing Electrical Complexity in Vehicle System Integration<\/strong>
Speakers:
<\/em>Kevin Ibarra, Electrical Design Engineer, PACCAR
Devin Nakahara, Electrical Architecture Project Engineer, PACCAR<\/p>\n\n\n\n

>> Electrifying Innovation: How Rivian\u2019s Generative Flow is Revolutionizing Design and Sustainability<\/strong>
Speaker:
<\/em>Bryan Horvat, Systems Integration Engineer, Rivian<\/p>\n\n\n\n

>> Automating Wire Harness Assembly: Transforming Process Design in Automotive Manufacturing<\/strong>
Speaker:
<\/em>Alex Cid, LEONI Mexico
<\/p>\n\n\n\n

IESF 2025 is set to continue the 25 year tradition of automotive innovation, bringing together keynotes from industry leaders, breakout tracks and panels sharing industry trends and best practices and access to actionable solutions from the OEMs, suppliers and top-tier experts. <\/p>\n\n\n\n

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Registration is now open, but places are limited. Don\u2019t miss out!<\/a><\/strong><\/p>\n\n\n\n

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*Complimentary registration is exclusively available to employees of Automotive Original Equipment Manufacturers (OEMs) and Tier 1 suppliers.<\/em><\/p>\n\n\n\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

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