{"id":198,"date":"2024-11-27T10:53:17","date_gmt":"2024-11-27T15:53:17","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/?p=198"},"modified":"2026-03-27T10:16:27","modified_gmt":"2026-03-27T14:16:27","slug":"siemens-cre8ventures-to-help-tum-and-startups-at-future-of-computing-conference-2024","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/2024\/11\/27\/siemens-cre8ventures-to-help-tum-and-startups-at-future-of-computing-conference-2024\/","title":{"rendered":"Siemens Cre8Ventures to Help TUM and Startups at Future of Computing Conference 2024"},"content":{"rendered":"<span class=\"span-reading-time rt-reading-time\" style=\"display: block;\"><span class=\"rt-label rt-prefix\">Reading Time: <\/span> <span class=\"rt-time\"> 2<\/span> <span class=\"rt-label rt-postfix\">minutes<\/span><\/span>\n<p><strong>Empowering the Next Generation of Innovators with Digital Twin Technology<\/strong><\/p>\n\n\n\n<p>Siemens Cre8Ventures is excited to announce its interest in the&nbsp;Future of Computing Conference 2024 (<a href=\"https:\/\/www.future-of-computing.com\/conference\/\" target=\"_blank\" rel=\"noopener\">Conference Information<\/a>)&nbsp;on December 11th, which will be organised by TUM Venture Labs Quantum \/ Semicon, Future of Computing, and INAM.<\/p>\n\n\n\n<p>As a hub for groundbreaking ideas and transformative technologies, the event promises to highlight emerging trends and disruptive innovations in computing. Siemens Cre8Ventures is proud to support the Venture Labs and the entrepreneurial startups showcasing their ideas at this prestigious event.<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<p><strong>Technical University of Munich (TUM)<\/strong><\/p>\n\n\n\n<p>The Technical University of Munich (TUM) is a global leader in advancing educational learning in semiconductor design, equipping students with the knowledge and hands-on experience needed to innovate in this critical field.<\/p>\n\n\n\n<p>TUM integrates cutting-edge research with practical applications, offering specialized courses in semiconductor technologies, circuit design, and microelectronics. Through collaborations with industry leaders and access to state-of-the-art facilities, students are exposed to the latest tools, such as Electronic Design Automation (EDA) software and simulation platforms.<\/p>\n\n\n\n<p>Additionally, TUM fosters interdisciplinary learning by combining semiconductor education with entrepreneurship programs, enabling students to bridge the gap between technical expertise and business acumen. Initiatives like the <strong>TUM Venture Labs<\/strong> further support aspiring innovators by providing mentorship, help in securing funding, and resources to turn their ideas into impactful solutions for the global semiconductor industry.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"825\" height=\"550\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/77\/2024\/11\/AdobeStock_1087957237.png\" alt=\"\" class=\"wp-image-199\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/77\/2024\/11\/AdobeStock_1087957237.png 825w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/77\/2024\/11\/AdobeStock_1087957237-600x400.png 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/77\/2024\/11\/AdobeStock_1087957237-768x512.png 768w\" sizes=\"auto, (max-width: 825px) 100vw, 825px\" \/><\/figure><\/div><\/div>\n<\/div>\n\n\n\n<p><strong>Driving Innovation Through Collaboration<\/strong><\/p>\n\n\n\n<p>Siemens Cre8Ventures, a collaborative venture arm dedicated to accelerating the growth of early-stage startups in the semiconductor and digital technologies space, is committed to identifying and nurturing talent that aligns with its mission to revolutionize industries.<\/p>\n\n\n\n<p>The initiative leverages the Siemens Cre8Ventures Digital Twin Marketplace and enables startups to fast-track their journey from concept to market.<\/p>\n\n\n\n<p>Following the Future of Computing Conference, Siemens Cre8Ventures will aim to engage with participating startups, exploring how their innovations can benefit from inclusion in its&nbsp;Collaborative Venturing Initiative.<\/p>\n\n\n\n<p>This program, underpinned by Siemens\u2019 unique digital twin capabilities, provides startups with tools, and access to Siemens\u2019 vast ecosystem of customers, partners, and investors.<\/p>\n\n\n\n<p><strong>#Supporting the TUM Ecosystem<\/strong><\/p>\n\n\n\n<p>The TUM Venture Labs Quantum \/ Semicon\u2019s Future of Computing Conference exemplifies the university\u2019s dedication to fostering innovation and entrepreneurship. Siemens Cre8Ventures is keen to strengthen its collaboration with the TUM Venture Labs Quantum \/ Semicon, offering additional support to startups in the university\u2019s ecosystem. This includes exploring opportunities to:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Provide startups with access to Siemens EDA tools and semiconductor design resources.<\/li>\n\n\n\n<li>Enable hands-on learning opportunities with Siemens\u2019 advanced technologies.<\/li>\n\n\n\n<li>Guide entrepreneurial teams toward inclusion in EU Chips Act funding programs and other financial support mechanisms.<\/li>\n<\/ul>\n\n\n\n<p><strong>For more information about Dream Chip and Siemens\u2019 Cre8Ventures, visit\u00a0<a href=\"https:\/\/resources.sw.siemens.com\/en-US\/cre8ventures\" target=\"_blank\" rel=\"noreferrer noopener\">our website<\/a>\u00a0or contact Carson Bradbury, Director \u2013 EU Chips Act &amp; Co-founder Cre8Ventures<\/strong>\u00a0<strong>(<a href=\"mailto:carson.bradbury@siemens.com\">carson.bradbury@siemens.com<\/a><\/strong>)<\/p>\n","protected":false},"excerpt":{"rendered":"<p><span class=\"span-reading-time rt-reading-time\" style=\"display: block;\"><span class=\"rt-label rt-prefix\">Reading Time: <\/span> <span class=\"rt-time\"> 2<\/span> <span class=\"rt-label rt-postfix\">minutes<\/span><\/span>Empowering the Next Generation of Innovators with Digital Twin Technology Siemens Cre8Ventures is excited to announce its interest in the&nbsp;Future&#8230;<\/p>\n","protected":false},"author":105110,"featured_media":199,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[14],"tags":[225,218,205,219,210,206,37,203,84,211,217,221,212,215,208,220,213,87,115,22,226,224,223,222,207,204,214,227,216,209],"industry":[18,8],"product":[],"coauthors":[10],"class_list":["post-198","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-eda","tag-academic-collaboration","tag-advanced-technologies","tag-collaborative-venturing","tag-collaborative-venturing-initiative","tag-concept-to-market","tag-digital-technologies","tag-digital-twin-marketplace","tag-driving-innovation-through-collaboration","tag-early-stage-startups","tag-entrepreneurship","tag-eu-chips-act-funding","tag-financial-support-mechanisms","tag-future-of-computing-conference","tag-hands-on-learning","tag-industry-revolution","tag-quantum-computing","tag-semiconductor-design-resources","tag-semiconductor-innovation","tag-semiconductor-startups","tag-siemens-cre8ventures","tag-siemens-customers","tag-siemens-digital-twin","tag-siemens-eda-tools","tag-siemens-investors","tag-siemens-partners","tag-startup-acceleration","tag-startup-ecosystem","tag-startup-growth","tag-tum-ecosystem","tag-tum-venture-labs","industry-automotive","industry-eda"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/77\/2024\/11\/AdobeStock_1087957237.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/posts\/198","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/users\/105110"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/comments?post=198"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/posts\/198\/revisions"}],"predecessor-version":[{"id":201,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/posts\/198\/revisions\/201"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/media\/199"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/media?parent=198"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/categories?post=198"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/tags?post=198"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/industry?post=198"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/product?post=198"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cre8ventures\/wp-json\/wp\/v2\/coauthors?post=198"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}