{"id":868,"date":"2023-12-07T12:50:11","date_gmt":"2023-12-07T17:50:11","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/cicv\/?p=868"},"modified":"2026-03-27T09:03:39","modified_gmt":"2026-03-27T13:03:39","slug":"exploring-production-proven-ai-powered-eda-solutions-with-solido-design-environment","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cicv\/2023\/12\/07\/exploring-production-proven-ai-powered-eda-solutions-with-solido-design-environment\/","title":{"rendered":"Exploring production-proven AI-powered EDA solutions with Solido Design Environment"},"content":{"rendered":"\n

Note: If you\u2019re interested in knowing more about Solido Design Environment, check out this <\/em>executive video<\/em><\/a> by Amit Gupta, VP and GM of Custom IC Verification Division at Siemens EDA.<\/em><\/p>\n\n\n\n

The landscape of semiconductor design is constantly evolving, with engineers and designers continually seeking innovative solutions to meet the ever-increasing demands of their designs faster and more accurate. At Design Automation Conference (DAC) 2023, we unveiled Solido Design Environment (Solido DE) as a comprehensive AI-powered SPICE-level design environment. I invite you to check out our press release<\/a> featuring notable customer testimonials from leading organizations such as SK Hynix, Ametek and others.<\/p>\n\n\n\n

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In this blog, we will discuss the disruptive technologies in Solido Design Environment and highlight the key features that make it a standout choice for chip designers. Before we start, I highly recommend delving into this SemiWiki article<\/a>, which showcases AI capabilities in the design and verification of Custom, Analog Mixed-Signal ICs.<\/p>\n\n\n\n

Adaptive AI: enabling orders of magnitude faster, production-accurate verification<\/strong><\/p>\n\n\n\n

Solido\u2019s Adaptive AI technology significantly accelerates the verification process while maintaining production accuracy. This technology utilizes machine learning to adapt and optimize the verification process in real-time, resulting in faster and more accurate results.<\/p>\n\n\n\n

This technology enables users to achieve 3, 4, 5, 6 and higher target sigma verification in a fraction of runtime compared to brute force verification using PVTMC Verifier and High-Sigma Verifier tools in Solido Design Environment. For higher sigma targets such as 6 sigma and higher, verification is generally not feasible, without a solution like this.<\/p>\n\n\n\n

Additive Learning: powering up to a 100X boost to existing AI techniques<\/strong>
Solido Design Environment pushes its capabilities with Additive Learning technology, which is a breakthrough approach to AI in the EDA industry.<\/p>\n\n\n\n

Additive Learning technology boosts existing AI providing additional speedups on incremental verification runs, after an initial verification run is completed.<\/p>\n\n\n\n

Assistive AI: providing 5X-10X productivity boosts<\/strong>
Design optimization is a critical aspect of chip design, especially as SoC designs get bigger and more complex. Solido Design Environment\u2019s Assistive AI technology accelerates time-to-market by assisting the user in achieving their power, performance, and area specifications.<\/p>\n\n\n\n

Siemens EDA’s Solido Design Environment has transformed the custom IC design process by offering a comprehensive AI-powered design environment for SPICE-level design and verification. It serves as a unified solution for both nominal and variation analysis, trusted by thousands of designers who rely on it to create cutting-edge products in high-performance computing, AI, IoT, automotive, and mobile applications.<\/p>\n\n\n\n

Check out our launch executive video<\/a>, and go through this SemiWiki article<\/a>!<\/p>\n","protected":false},"excerpt":{"rendered":"

Note: If you\u2019re interested in knowing more about Solido Design Environment, check out this executive video by Amit Gupta, VP…<\/p>\n","protected":false},"author":98995,"featured_media":869,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[311,462,331,326,469,330,302],"industry":[],"product":[],"coauthors":[476],"class_list":["post-868","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-ams-blogs","tag-cicv-blogs","tag-high-sigma-analysis","tag-solido","tag-solido-design-environment","tag-variation-aware-verification","tag-verification-environment"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/58\/2023\/12\/Solido-DE-value-prop-slide-for-Blog1.svg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/868","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/users\/98995"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/comments?post=868"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/868\/revisions"}],"predecessor-version":[{"id":873,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/868\/revisions\/873"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media\/869"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media?parent=868"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/categories?post=868"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/tags?post=868"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/industry?post=868"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/product?post=868"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/coauthors?post=868"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}