{"id":1691,"date":"2026-05-08T14:23:25","date_gmt":"2026-05-08T18:23:25","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/cicv\/?p=1691"},"modified":"2026-05-08T14:23:28","modified_gmt":"2026-05-08T18:23:28","slug":"accelerating-design-innovation-through-scalable-computing-with-cloud-ready-solido-simulation-suite-on-amazon-web-services","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cicv\/2026\/05\/08\/accelerating-design-innovation-through-scalable-computing-with-cloud-ready-solido-simulation-suite-on-amazon-web-services\/","title":{"rendered":"Accelerating design innovation through scalable computing with cloud-ready Solido Simulation Suite on Amazon Web Services"},"content":{"rendered":"\n

Chip design complexity is increasing exponentially, driven by the explosion of AI and expanding applications across high-performance computing (HPC), the Internet of Things (IoT), automotive and 5G mobile communications. Advanced process technology nodes compound this challenge further, demanding extensive circuit simulations to verify correct circuit functionality. The result: more simulations and increasing simulation run times, which in turn leads to increasing load and reduced efficiency on traditional on-premises compute resources.<\/p>\n\n\n\n

Solido Simulation Suite powered cloud computing solution<\/h2>\n\n\n\n

Cloud computing has proven to reduce circuit simulation run times by providing design teams with scalable, on-demand compute resources. Solido Custom IC and Amazon Web Services (AWS) have collaborated to provide scalable, secure and cost-effective circuit simulation workflows. This collaboration addresses the fundamental challenge of compute resource bottlenecks while enabling design teams to leverage the elastic nature of cloud computing to meet their simulation demands efficiently.<\/p>\n\n\n\n

In collaboration with AWS, we have made Solido  <\/sup>Simulation Suite, an integrated suite of AI-accelerated simulators, cloud-ready, empowering faster design innovation to meet critical time-to-market requirements.<\/p>\n\n\n

\n
\"\"
Solido Simulation Suite\u2019s AI-accelerated simulators<\/strong><\/figcaption><\/figure><\/div>\n\n\n

Analog FastSPICE, Solido SPICE, Solido FastSPICE, Solido LibSPICE and Symphony, part of Solido Simulation Suite<\/a>, delivers massive scalability validated up to 8,000 CPUs, as well as multi-thread scaling. The solution also demonstrates up to 80% run time improvement and up to 35% cost saving through the advanced Graviton4 platform. Beyond this performance, the solution is built for deployment: resource optimization, enhanced security with enterprise-grade protection for intellectual property and improved productivity through streamlined workflows and flexibility.<\/p>\n\n\n

\n
\"\"
AWS reference architecture for circuit simulation workflow with Solido SPICE<\/strong><\/figcaption><\/figure><\/div>\n\n\n

White paper and cloud resources<\/h2>\n\n\n\n

For cloud configuration templates and flight plans for quick ramp-up\u200b\u200b on using Solido Simulation Suite on Amazon Web Services and more, visit the whitepaper Cloud-ready Solido Simulation Suite on Amazon Web Services<\/a>.<\/p>\n\n\n

\n
\"\"
Whitepaper on cloud-ready Solido Simulation Suite<\/strong><\/figcaption><\/figure><\/div>\n\n\n

We have also published application notes for Solido SPICE, Solido FastSPICE, Solido LibSPICE and Symphony which can be found here:\u00a0Solido Simulation Suite Amazon Web Services Application Notes<\/a><\/p>\n\n\n\n

Visit Solido Simulation Suite Cloud Resources<\/a>\u200b for additional information on cloud resources for Solido Simulation Suite.<\/p>\n\n\n\n

<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Chip design complexity is increasing exponentially, driven by the explosion of AI and expanding applications across high-performance computing (HPC), the…<\/p>\n","protected":false},"author":112032,"featured_media":1704,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[9],"tags":[521,520,522,523,506,308],"industry":[34,37],"product":[235],"coauthors":[494],"class_list":["post-1691","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-product-updates","tag-analog-fastspice","tag-circuit-simulation","tag-solido-fastspice","tag-solido-libspice","tag-solido-simulation-suite","tag-spice-simulation","industry-electronics-semiconductors","industry-semiconductor-devices","product-solido"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/58\/2026\/05\/2026-05-07_16-33-49.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1691","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/users\/112032"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/comments?post=1691"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1691\/revisions"}],"predecessor-version":[{"id":1722,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1691\/revisions\/1722"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media\/1704"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media?parent=1691"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/categories?post=1691"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/tags?post=1691"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/industry?post=1691"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/product?post=1691"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/coauthors?post=1691"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}