{"id":1607,"date":"2026-04-22T14:59:56","date_gmt":"2026-04-22T18:59:56","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/cicv\/?p=1607"},"modified":"2026-04-22T17:02:12","modified_gmt":"2026-04-22T21:02:12","slug":"what-to-expect-at-the-solido-custom-ic-track-at-user2user-north-america-2026","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cicv\/2026\/04\/22\/what-to-expect-at-the-solido-custom-ic-track-at-user2user-north-america-2026\/","title":{"rendered":"What to expect at the Solido Custom IC track at User2User North America 2026"},"content":{"rendered":"\n<p>User2User is our annual user conference that brings together engineers and designers for keynotes, technical sessions, and direct access to our technical teams. It&#8217;s a chance to learn, share, and connect with peers who are working through the same challenges you are.<\/p>\n\n\n\n<p>This year&#8217;s North America event takes place on April 28, 2026 at the Santa Clara Marriott in Santa Clara, CA. The Solido Custom IC track features <strong>Intel<\/strong>, <strong>NVIDIA<\/strong>, <strong>Microsoft<\/strong>, and <strong>STMicroelectronics<\/strong> sharing their real-world experiences using AI-powered Solido tools for custom IC design, offering practical perspectives on how these solutions are being applied in production environments.<\/p>\n\n\n\n<p>If you work in custom IC design and want to hear directly from teams already using these tools, these sessions will be worth your time.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>2:00 PM \u2013 2:20 PM | Technical breakout session #1<\/strong><br><strong>Intel: Achieving unprecedented throughput for large-scale library verification with a Solido AI-powered batch flow<\/strong><br><strong>Presented by Randil Gajasinghe, standard cell design engineer, Intel<\/strong><\/h4>\n\n\n\n<p>This session discusses the challenges of verifying modern standard cell libraries, and presents how groups like the Intel Production Library team can use Solido Worst-Case Yield Solver, a batch flow utilizing Solido Design Environment high-sigma technology, to automate and accelerate verification at scale for massive standard cell libraries. This flow makes it possible to achieve brute-force accurate, variation-aware 6+ sigma verification for over a million netlists in less than a week, optimizing engineering effort and production timelines.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>2:30 PM \u2013 2:50 PM | Technical breakout session #2<\/strong><br><strong>NVIDIA: Scalable and dynamic liberty verification for diverse IP<\/strong><br><strong>Presented by Eric Hsu, senior circuit design methodology staff, NVIDIA<\/strong><\/h4>\n\n\n\n<p>This session discusses a collaboration between NVIDIA and Siemens EDA to integrate a rigorous, reliable, and scalable solution for quick Liberty QA and delivery through the Solido Characterization Suite. This combines a curated, API-driven flow for NVIDIA-specific designs, timing model comparison across revisions using Solido Analytics Compare, and efficient discrepancy reporting using Solido Analytics Validate, accelerating IP integration across large design teams and diverse IP portfolios.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>3:00 PM \u2013 3:20 PM | Technical breakout session #3<br>Microsoft: Trust but verify for IP handoff: IP validation at scale across design views and revisions<br>Presented by Martin Sanchez, senior director, IP program management office, Microsoft<\/strong><\/h4>\n\n\n\n<p>This session discusses how Microsoft&#8217;s AI and high-performance compute silicon programs manage large volumes of IP delivered in multiple interdependent views, where multi-view inconsistencies and unintended revision changes can evade local scripts and surface late during SoC integration, creating debug churn and schedule risk. Microsoft adopted a trust-but-verify methodology with Solido IP Validation Suite combining format-aware integrity checks, cross-view consistency validation, and revision delta analysis to turn IP quality into a repeatable, auditable gate before handoff to SoC consumers.<\/p>\n\n\n\n<h4 class=\"wp-block-heading\"><strong>3:30 PM \u2013 3:50 PM | Technical breakout session #4<\/strong><br><strong>STMicroelectronics: Advanced high-sigma standard cell yield verification methodology using AI-powered Solido Library Verifier<\/strong><br><strong>Presented by Rohit Kumar Gupta, senior member of technical staff, STMicroelectronics and Neel Natekar, senior product manager, Siemens EDA<\/strong><\/h4>\n\n\n\n<p>This session details how STMicroelectronics introduced a batch verification methodology using Solido Library Verifier, driven by an in-simulator AI engine for high-sigma yield verification with SPICE accuracy. By combining this next-generation yield solver, SPICE simulator, and Additive AI technology, STMicroelectronics achieved 7x\u201312x speedups, resulting in months of time savings.<\/p>\n\n\n\n<p>Ready to join us? <a href=\"https:\/\/events.sw.siemens.com\/en-US\/u2uconference\/north-america\/\" data-type=\"link\" data-id=\"https:\/\/events.sw.siemens.com\/en-US\/u2uconference\/north-america\/\" target=\"_blank\" rel=\"noopener\">Secure your spot at User2User North America 2026.<\/a><\/p>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Intel, NVIDIA, Microsoft, and STMicroelectronics will be sharing their real-world experiences using AI-powered Solido tools for custom IC design. <\/p>\n","protected":false},"author":110486,"featured_media":1615,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[5,1],"tags":[498,463,334,303,326,308,330],"industry":[],"product":[],"coauthors":[496],"class_list":["post-1607","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","category-news","tag-ai-powered-eda","tag-custom-ic-verification","tag-ip-validation","tag-library-characterization","tag-solido","tag-spice-simulation","tag-variation-aware-verification"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/58\/2026\/04\/Screenshot-2026-04-22-144352.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1607","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/users\/110486"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/comments?post=1607"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1607\/revisions"}],"predecessor-version":[{"id":1641,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/posts\/1607\/revisions\/1641"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media\/1615"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/media?parent=1607"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/categories?post=1607"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/tags?post=1607"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/industry?post=1607"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/product?post=1607"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/cicv\/wp-json\/wp\/v2\/coauthors?post=1607"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}