{"id":1553,"date":"2026-02-20T16:46:33","date_gmt":"2026-02-20T21:46:33","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/cicv\/?p=1553"},"modified":"2026-03-27T09:04:38","modified_gmt":"2026-03-27T13:04:38","slug":"how-symphony-pro-is-defining-the-future-of-mixed-signal-verification-for-high-speed-die-to-die-interfaces-a-case-study-by-analogport","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/cicv\/2026\/02\/20\/how-symphony-pro-is-defining-the-future-of-mixed-signal-verification-for-high-speed-die-to-die-interfaces-a-case-study-by-analogport\/","title":{"rendered":"How Symphony Pro is defining the future of mixed-signal verification for high-speed die-to-die interfaces: A case study by AnalogPort"},"content":{"rendered":"\n

A modern chiplet interface contains millions of transistors, thousands of control signals, and dozens of ultra-sensitive analog blocks, all of which must work together flawlessly at ultra-high frequency. How do you verify that?<\/strong><\/p>\n\n\n\n

This is a tough challenge many verification engineers are grappling with as the semiconductor industry accelerates toward chiplet-based architectures. The sheer scale and complexity of these mixed-signal interfaces have created a verification crisis that traditional methodologies simply cannot solve.<\/p>\n\n\n\n

The problem runs deeper than complexity alone. High-speed die-to-die interconnects are intricate mixed-signal systems that demand two contradictory things simultaneously: transistor-level SPICE accuracy for analog signal integrity and digital-scale performance for comprehensive system verification. Traditional digital mixed-signal (DMS) flows use behavioral models that run fast but miss critical analog effects like crosstalk, jitter, and impedance mismatches. Meanwhile, analog mixed-signal (AMS) approaches deliver the precision you need but come with the cost of prohibitively large simulation times, manual signal connection overhead, and tool fragmentation that turns debug into a painstaking investigation.<\/p>\n\n\n\n

For years, engineering teams have been forced into an impossible choice: sacrifice analog fidelity for speed or sacrifice productivity for precision. Neither option is acceptable when a single missed bug can cost millions of dollars in re-spins and many months of lost market opportunity.<\/p>\n\n\n\n

Symphony Pro: unified mixed-signal simulator that eliminates the compromise<\/strong><\/h2>\n\n\n\n

AnalogPort, a leading provider of high-speed interface IP, overcame the verification bottleneck by utilizing Siemens EDA’s SymphonyTM<\/sup> Pro platform, part of SolidoTM<\/sup> Simulation Suite. \u00a0Facing the challenge of verifying a complex 32 Gbps, 16-transmit\/16-receive full-duplex die-to-die interface, AnalogPort needed a solution that could handle millions of devices while maintaining transistor-level accuracy where it mattered most.<\/p>\n\n\n\n

The breakthrough?<\/strong> Symphony Pro’s ability to seamlessly integrate UVM-based digital verification with high-fidelity SPICE simulation without the manual overhead, tool fragmentation, or performance penalties that plague traditional approaches.<\/p>\n\n\n\n

AnalogPort achieved these results through following essential capabilities of Symphony Pro:<\/p>\n\n\n\n